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    Method for pattern seeding and plating of high density printed circuit boards
    6.
    发明授权
    Method for pattern seeding and plating of high density printed circuit boards 失效
    高密度印刷电路板图案播种和电镀方法

    公开(公告)号：US06207351B1

    公开(公告)日：2001-03-27

    申请号：US08481648

    申请日：1995-06-07

    申请人： Douglas Adam Cywar ,  Elizabeth Foster ,  Stephen Leo Tisdale

    发明人： Douglas Adam Cywar ,  Elizabeth Foster ,  Stephen Leo Tisdale

    IPC分类号： B05D512

    CPC分类号： H05K3/184 ,  C23C18/1608 ,  C23C18/30 ,  C23C18/38

    摘要： The method for forming circuitization of the present invention provides a circuitized product which does not have a blanket seed layer and only has seed layer under the metal circuitization. Thus, short circuits between circuit lines are eliminated. It is a further advantage of the method of the present invention that it does not involve stripping portions of the seed layer. The method of the present invention requires less processing steps than conventional methods and employs positive resists which are developable by aqueous alkaline solutions. Specifically, the method of the present invention for forming circuitization in a circuit board comprising the following steps: providing a dielectric substrate; applying a positive photoresist to the dielectric substrate; then exposing the positive resist through art work corresponding to the desired circuit pattern; then developing the resist with an aqueous alkaline solution to form the circuit pattern in the resist; then applying a seeding composition to the patterned substrate of step d; exposing the remaining resist to actinic radiation; developing the remaining acidified resist with an aqueous alkaline solution to remove photoresist not coated with seed to form a seed pattern; and then electrolessly plating metal onto the seed pattern so as to form the metallized circuit pattern.

    摘要翻译： 本发明的电路形成方法提供了不具有覆盖种子层的电路化产品，并且在金属电路化下仅具有晶种层。 因此，消除了电路线之间的短路。 本发明的方法的另一个优点是它不涉及剥离种子层的部分。 本发明的方法比常规方法需要较少的加工步骤，并且采用可用碱性水溶液显影的正性抗蚀剂。 具体地说，本发明的电路板的电路化方法，包括以下步骤：提供电介质基板; 将正性光致抗蚀剂施加到电介质基板上; 然后通过对应于期望的电路图案的艺术作品曝光正性抗蚀剂; 然后用碱性水溶液显影抗蚀剂以在抗蚀剂中形成电路图案; 然后将种子组合物施加到步骤d的图案化衬底上; 将剩余的抗蚀剂暴露于光化辐射; 用碱性水溶液显影剩余的酸化抗蚀剂以除去未涂覆种子的光致抗蚀剂以形成种子图案; 然后将金属无电镀在种子图案上，以形成金属化电路图案。