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57 条记录 (耗时 0.041 秒)

    Film forming apparatus
    1.
    发明授权
    Film forming apparatus 有权
    成膜装置

    公开(公告)号：US09163311B2

    公开(公告)日：2015-10-20

    申请号：US13333137

    申请日：2011-12-21

    申请人： Harunari Hasegawa ,  Kippei Sugita ,  Atsushi Ando ,  Yoshiki Fukuhara ,  Makoto Takahashi

    发明人： Harunari Hasegawa ,  Kippei Sugita ,  Atsushi Ando ,  Yoshiki Fukuhara ,  Makoto Takahashi

    IPC分类号： C23C16/455 ,  C23C16/458 ,  C23F1/00 ,  H01L21/306 ,  C23C16/52 ,  C23C16/06 ,  C23C16/22

    CPC分类号： C23C16/45578 ,  C23C16/455 ,  C23C16/45563 ,  C23C16/45576 ,  C23C16/458 ,  C23C16/4584 ,  C23C16/52

    摘要： Provided is a film forming apparatus for forming a film on a substrate maintained within a film forming container by supplying a raw material gas to the substrate. The film forming container includes a substrate maintaining unit, a supply mechanism configured to include a supply pipe with supply holes formed thereon to supply a raw material gas to the interior of the film forming container through the supply holes, an exhaust mechanism configured to include an exhaust pipe with exhaust holes formed thereon to exhaust gas from the interior of the film forming container through the exhaust holes, and a controller configured to control the substrate maintaining unit, the supply mechanism, and the exhaust mechanism. The supply holes and the exhaust holes are formed to face each other with the substrate maintained in the substrate maintaining unit interposed therebetween.

    摘要翻译： 本发明提供一种成膜装置，其通过向基板供给原料气体而在保持在成膜容器内的基板上形成膜。 成膜容器包括基板保持单元，供给机构，其构造成包括供给管，其上形成有供给孔，供给孔通过供给孔向成膜容器的内部供给原料气体;排气机构， 排气管，其上形成有排气孔，通过排气孔从成膜容器的内部排出气体;以及控制器，被配置为控制基板保持单元，供给机构和排气机构。 供给孔和排气孔形成为彼此面对，并且基板保持在基板保持单元之间。

    FILM DEPOSITION APPARATUS
    3.
    发明申请
    FILM DEPOSITION APPARATUS 审中-公开
    胶片沉积装置

    公开(公告)号：US20130068163A1

    公开(公告)日：2013-03-21

    申请号：US13425483

    申请日：2012-03-21

    申请人： Tatsuya YAMAGUCHI ,  Masafumi Ishida ,  Hiroyuki Hashimoto ,  Shigure Ohmukai ,  Atsushi Ando

    发明人： Tatsuya YAMAGUCHI ,  Masafumi Ishida ,  Hiroyuki Hashimoto ,  Shigure Ohmukai ,  Atsushi Ando

    IPC分类号： C23C16/02

    CPC分类号： H01L21/02118 ,  B05D1/36 ,  B05D1/60 ,  B05D3/104 ,  H01L21/02271 ,  H01L21/02312 ,  H01L21/67109 ,  H01L21/67303 ,  H01L21/67757

    摘要： A film deposition apparatus includes a film deposition chamber into which a substrate is carried, a heating mechanism that heats the substrate carried into the film deposition chamber, an adhesion accelerating agent feed mechanism that feeds an adhesion accelerating agent gas into the film deposition chamber, and a control part that controls the heating mechanism and the adhesion accelerating agent feed mechanism. When depositing a polyimide film on the substrate by feeding a first source gas formed of dianhydride and a second source gas formed of diamine into the film deposition chamber, the control part is configured to control the adhesion accelerating agent feed mechanism to treat a surface of the substrate with the adhesion accelerating agent gas by feeding the adhesion accelerating agent gas into the film deposition chamber until the substrate is heated to a predetermined temperature for depositing the polyimide film.

    摘要翻译： 一种成膜装置，包括：载置基板的成膜室，将载置于成膜室内的基板加热的加热机构，将粘附促进剂气体送入成膜室的粘合促进剂供给机构，以及 控制加热机构和附着促进剂供给机构的控制部。 当通过将由二酐形成的第一源气体和由二胺形成的第二源气体供给到成膜室中而在基板上沉积聚酰亚胺膜时，控制部分被配置为控制粘合促进剂进料机构以处理 通过将粘合促进剂气体进料到成膜室中直到基板被加热到用于沉积聚酰亚胺膜的预定温度为止，具有附着促进剂气体的基板。

    Electron beam apparatus and method for manufacturing semiconductor device
    8.
    发明授权
    Electron beam apparatus and method for manufacturing semiconductor device 失效
    电子束装置及半导体装置的制造方法

    公开(公告)号：US07372027B2

    公开(公告)日：2008-05-13

    申请号：US11247263

    申请日：2005-10-12

    申请人： Atsushi Ando ,  Katsuhide Watanabe

    发明人： Atsushi Ando ,  Katsuhide Watanabe

    IPC分类号： G01N23/00

    CPC分类号： H01J37/09 ,  H01J37/24 ,  H01J2237/0264 ,  H01J2237/26 ,  H01J2237/3175

    摘要： A sample chamber and a column are connected to each other and comprise a magnetic substance. An exhaust section controls a pressure in the sample chamber and the column. A stage controller controls a stage, above which a sample is placed, in the sample chamber. An electron beam source power supply supplies power to an electron beam source, which emits an electron beam to the sample. A power supply supplies voltage to electron optic system, which controls the electron beam. The sample chamber, exhaust section, stage controller, electron beam source power supply and power supply are grounded by a first, second, third, fourth and fifth grounding point, respectively. The electron beam source and the electron optic system are electrically insulated from the sample chamber, column, exhaust section and stage. One of the first, second and third grounding point is different from the fourth or fifth grounding point.

    摘要翻译： 样品室和色谱柱彼此连接并包含磁性物质。 排气部分控制样品室和柱中的压力。 舞台控制器控制在样品室中放置样品的阶段。 电子束源电源向电子束源供电，该电子束向样品发射电子束。 电源将电压供给控制电子束的电子光学系统。 样品室，排气段，载物台控制器，电子束源电源和电源分别由第一，第二，第三，第四和第五接地点接地。 电子束源和电子光学系统与样品室，色谱柱，排气部分和电极电绝缘。 第一，第二和第三接地点之一与第四或第五接地点不同。

    Constant velocity universal joint
    9.
    发明申请
    Constant velocity universal joint 审中-公开
    恒速万向节

    公开(公告)号：US20070066405A1

    公开(公告)日：2007-03-22

    申请号：US10549565

    申请日：2004-12-09

    申请人： Atsushi Ando ,  Tomohiko Sato ,  Takumi Matsumoto ,  Takeo Yamamoto

    发明人： Atsushi Ando ,  Tomohiko Sato ,  Takumi Matsumoto ,  Takeo Yamamoto

    IPC分类号： F16D3/00

    CPC分类号： F16D3/2055 ,  F16D3/205 ,  F16D2003/2023

    摘要： In a constant velocity universal joint including a double roller type roller unit, a cylindrical surface is formed in a radially outer surface of the outer roller; a flat engagement surface which is engaged with the cylindrical surface is formed in each of the guide grooves of the outer joint member; and the cylindrical surface satisfies following two equations, W1>PCR (1−cos θ)/2+μ3R3+μ2R1, W2>3PCR (1−cos θ)/2−μ3R3+μ2R1wherein W1, W2: a length from a center of the cylindrical surface to each of axially both end portions; PCR: a distance from an axis of the inner joint member to a center of the convex sphere of each of the leg shafts; θ: a required maximum joint angle; R1, R3: radii of the cylindrical surface and the concave sphere, respectively; and μ2, μ3: friction coefficients between the inner roller and the outer roller, and between the convex sphere and the concave sphere, respectively.

    摘要翻译： 在包括双辊型辊单元的等速万向接头中，在外辊的径向外表面上形成圆柱面; 在外接头构件的每个引导槽中形成有与圆筒形表面接合的平坦接合表面; 并且圆柱形表面满足以下两个等式：W 1> PCR（1-cosθ）/ 2 + mu 3 R 3 + mu 2 R 1，W 2> 3PCR （1-cosθ）/ 2-mu 3 R 3 +μ2 R 1其中W 1，W 2：从圆柱形表面的中心到每个的长度 轴向两端部; PCR：从内接头构件的轴线到每个腿轴的凸球的中心的距离; θ：所需的最大关节角度; R 1，R 3分别为圆柱面和凹球的半径; 和内部辊子和外部辊子之间以及凸形球体和凹形球体之间的摩擦系数分别为μ2，3/3。