Process for the production of optically isotropic extrusion films
    2.
    发明授权
    Process for the production of optically isotropic extrusion films 失效
    用于生产光学等压挤出膜的方法

    公开(公告)号:US5076987A

    公开(公告)日:1991-12-31

    申请号:US504482

    申请日:1990-04-04

    摘要: A process for the production of optically isotropic extrusion films is disclosed. Accordingly in a first process step a thermoplsatic resin is extruded to form a film having a thickness below 600 .mu.m. The second process step entailsa) calendering said film between a ground elastic roller and a high gloss steel roller to produce a film having a high gloss surface and a matt surface, orb) calendering said film between a lacquered elastic roller and a high gloss steel roller to produce a film having high gloss on both surfaces, orc) calendering said film between a ground elastic roller and a high gloss steel roller to produce a film having a high gloss surface and a matt surface, and then coating said matt surface with a melt of said thermoplastic polymer and calendering the resulting coated film between a high gloss steel roller and a ground elastic roller, with the high gloss side of the coated film facing the roller of elastic material.

    摘要翻译: 公开了一种制备光学各向同性挤出膜的方法。 因此,在第一工艺步骤中,将热塑性树脂挤出以形成厚度低于600μm的膜。 第二工艺步骤需要a)在接地弹性辊和高光泽钢辊之间压延所述膜以产生具有高光泽表面和无光泽表面的膜,或b)在漆层弹性辊和高光泽度之间压延所述膜 钢辊,以在两个表面上产生具有高光泽度的膜,或c)在接地弹性辊和高光泽钢辊之间压延所述膜以产生具有高光泽表面和无光泽表面的膜,然后涂覆所述亚光表面 用所述热塑性聚合物的熔体将所得的涂膜压延在高光泽的钢辊和研磨的弹性辊之间,涂膜的高光泽面与弹性材料的辊相对。

    Process for the manufacture of printed circuits
    5.
    发明授权
    Process for the manufacture of printed circuits 失效
    印刷电路制造工艺

    公开(公告)号:US4859263A

    公开(公告)日:1989-08-22

    申请号:US169830

    申请日:1988-03-17

    IPC分类号: B41M5/26 H05K3/04 H05K3/22

    摘要: A method for manufacturing printed electrical circuits which comprise a substrate and copper foil applied thereto by hot embossing in a predetermined circuit pattern, said method comprising(a) providing a laminate which comprises the sequence of a printed circuit substrate, a heat activated adhesive layer, a copper foil and a carrier film which is electrically conductive,(b) passing an electrical current between two electrodes and through the carrier film wherein one electrode has sufficiently large film contact area whereby substantially no resistance heating results from the current density and the other electrode serves as an embossing tool and is of sufficiently small film contact area whereby sufficient resistance heating results from the current density to activate the adhesive layer to bond the copper foil to the substrate in the pattern of said other electrode, and(c) removing from the laminate the carrier film and such copper foil overlying areas where the adhesive was not heat activated thereby leaving a copper foil pattern bonded to the substrate.

    摘要翻译: 一种制造印刷电路的方法,其包括以预定电路图案通过热压印施加到其上的基板和铜箔,所述方法包括(a)提供包括印刷电路基板,热活化粘合剂层, 铜箔和导电的载体膜,(b)在两个电极之间通过电流并通过载体膜,其中一个电极具有足够大的膜接触面积,从而基本上不受电流密度的影响,另一个电极 用作压花工具,并且具有足够小的膜接触面积,从而由电流密度产生足够的电阻加热,以激活粘合剂层,以将铜箔与基板以所述另一个电极的图案结合,以及(c) 将载体膜和这种铜箔叠合在不粘合剂的区域上 热激活,从而留下结合到基底的铜箔图案。