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公开(公告)号：US07651260B2
公开(公告)日：2010-01-26
申请号：US12048620
申请日：2008-03-14
IPC分类号： G01N25/72
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
摘要翻译： 所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。 该装置包括热耦合到热管的冷却装置。 该热管具有用于选择性地在其上施加热量的暴露表面。 选择性地将局部热源施加到暴露表面的至少一个区域。 热源优选地能够相对于暴露的表面和热强度都在位置上变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与局部热源隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后使用温度分布来热定形冷却装置。
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公开(公告)号：US20080281551A1
公开(公告)日：2008-11-13
申请号：US12110698
申请日：2008-04-28
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
IPC分类号： G01K13/00
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
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公开(公告)号：US08038343B2
公开(公告)日：2011-10-18
申请号：US12048635
申请日：2008-03-14
IPC分类号： G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A novel computer program product and method for thermally characterizing a device used for cooling an electronic device is disclosed. A cooling device, being operated, is thermally coupled to a heat pipe having a surface to receive a test chip. A heater is patterned on a circuitry side of the test chip. The heater is separate from operational circuitry of the test chip. A localized heat source is applied to at least one region on a test chip thermally coupled to the heat pipe to locally heat more than one region on a second surface of the test chip to test more than one hot spot. The second surface is the circuitry side of the test chip. The heater provides a bias heat to the test chip, independent of operating the test chip, while the localized heat source is selectively applied directly to the test chip. A temperature detector is used to measure a temperature distribution on the second surface of the test chip. The temperature distribution is used to thermally characterize said cooling device during operation.
摘要翻译： 公开了一种用于热表征用于冷却电子设备的设备的新颖的计算机程序产品和方法。 被操作的冷却装置热耦合到具有接收测试芯片的表面的热管。 加热器在测试芯片的电路侧进行图案化。 加热器与测试芯片的操作电路分开。 将局部热源施加到热耦合到热管的测试芯片上的至少一个区域，以局部加热测试芯片的第二表面上的多于一个区域，以测试多于一个热点。 第二个表面是测试芯片的电路侧。 加热器对测试芯片提供偏置热量，与操作测试芯片无关，同时局部热源被选择性地直接应用于测试芯片。 温度检测器用于测量测试芯片第二表面上的温度分布。 温度分布用于在操作期间热定形所述冷却装置。
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4.发明授权公开(公告)号：US07739073B2
公开(公告)日：2010-06-15
申请号：US12110732
申请日：2008-04-28
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要翻译： 公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。 该装置包括支撑多个传感器的推车。 购物车可在数据中心内移动。 传感器捕获房间内的温度或其他物理参数。 传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。
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公开(公告)号：US20100046574A1
公开(公告)日：2010-02-25
申请号：US12611519
申请日：2009-11-03
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
摘要翻译： 所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。 该装置包括热耦合到热管的冷却装置。 该热管具有用于选择性地在其上施加热量的暴露表面。 选择性地将局部热源施加到暴露表面的至少一个区域。 热源优选地能够相对于暴露的表面和热强度都在位置上变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与局部热源隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后使用温度分布来热定形冷却装置。
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公开(公告)号：US08210741B2
公开(公告)日：2012-07-03
申请号：US12611519
申请日：2009-11-03
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.
摘要翻译： 设备确定用于从电子设备传送热量的操作冷却装置的冷却特性。 操作冷却装置热耦合到热管。 热管具有用于选择性地在其上施加热量的暴露表面。 来自局部热源的热量被选择性地施加到暴露表面的至少一个区域。 热源优选能够相对于暴露的表面和热强度在位置上都变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与来自局部热源的热隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后将温度分布用于热操作冷却装置的特征。
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7.发明授权公开(公告)号：US07756667B2
公开(公告)日：2010-07-13
申请号：US12110698
申请日：2008-04-28
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要翻译： 公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。 该装置包括支撑多个传感器的推车。 购物车可在数据中心内移动。 传感器捕获房间内的温度或其他物理参数。 传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。
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公开(公告)号：US20080239539A1
公开(公告)日：2008-10-02
申请号：US12110732
申请日：2008-04-28
申请人： HENDRIK F. HAMANN , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： HENDRIK F. HAMANN , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
IPC分类号： G11B27/36
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要翻译： 公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。 该装置包括支撑多个传感器的推车。 购物车可在数据中心内移动。 传感器捕获房间内的温度或其他物理参数。 传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。
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公开(公告)号：US08636406B2
公开(公告)日：2014-01-28
申请号：US13445641
申请日：2012-04-12
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.
摘要翻译： 设备确定用于从电子设备传送热量的操作冷却装置的冷却特性。 操作冷却装置热耦合到热管。 热管具有用于选择性地在其上施加热量的暴露表面。 来自局部热源的热量被选择性地施加到暴露表面的至少一个区域。 热源优选能够相对于暴露的表面和热强度在位置上都变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与来自局部热源的热隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后将温度分布用于热操作冷却装置的特征。
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公开(公告)号：US08029186B2
公开(公告)日：2011-10-04
申请号：US10982575
申请日：2004-11-05
IPC分类号： G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
摘要翻译： 所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。 该装置包括热耦合到热管的冷却装置。 该热管具有用于选择性地在其上施加热量的暴露表面。 选择性地将局部热源施加到暴露表面的至少一个区域。 热源优选地能够相对于暴露的表面和热强度都在位置上变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与局部热源隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后使用温度分布来热定形冷却装置。
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