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1.发明授权公开(公告)号：US08306794B2
公开(公告)日：2012-11-06
申请号：US12146852
申请日：2008-06-26
CPC分类号： G06F1/206 , G06F17/5004 , G06F2217/80 , H05K7/20836 , Y02D10/16
摘要： Techniques for modeling a data center are provided. In one aspect, a method for modeling a data center is provided. The method comprises the following steps. Spatially dense three-dimensional thermal distribution and air flow measurements made in the data center using a mobile off-line surveying system are obtained. A temperature and air flow model for the data center is created using the spatially dense three-dimensional thermal distribution and air flow measurements. The temperature and air flow model is used to make thermal distribution and air flow predictions of the data center. The thermal distribution and air flow predictions are compared with the thermal distribution and air flow measurements made using the mobile off-line surveying system to produce a validated model for the data center.
摘要翻译： 提供了数据中心建模技术。 在一方面，提供了一种用于建模数据中心的方法。 该方法包括以下步骤。 获得了使用移动离线测量系统在数据中心进行的空间密集三维热分布和气流测量。 使用空间密集的三维热分布和空气流量测量，创建数据中心的温度和气流模型。 温度和气流模型用于对数据中心进行热分布和气流预测。 将热分布和气流预测与使用移动离线测量系统进行的热分布和气流测量进行比较，以生成数据中心的验证模型。
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2.发明授权公开(公告)号：US08020390B2
公开(公告)日：2011-09-20
申请号：US12479798
申请日：2009-06-06
IPC分类号： F25B1/00
CPC分类号： F25B25/00 , F25B27/007 , F25B2400/24 , F25D16/00 , H05K7/20745
摘要： Energy-efficient data center cooling techniques that utilize free cooling and/or solar cooling are provided. In one aspect, a cooling system is provided including a cooling tower; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the cooling tower, through one or more of the modular refrigeration chiller units or through a combination thereof. Another cooling system is provided including a solar cooling unit; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the solar cooling unit, through one or more of the modular refrigeration chiller units or through a combination thereof.
摘要翻译： 提供了利用免费冷却和/或太阳能冷却的节能数据中心冷却技术。 一方面，提供一种包括冷却塔的冷却系统; 一个或多个模块式冷冻机组; 以及可以选择性地通过冷却塔引导通过一个或多个模块式制冷机组或通过其组合的水回路。 提供另一个冷却系统，包括太阳能冷却单元; 一个或多个模块式冷冻机组; 以及可以选择性地通过太阳能冷却单元，通过一个或多个模块式冷冻机组或通过其组合引导的水回路。
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3.发明申请公开(公告)号：US20090326879A1
公开(公告)日：2009-12-31
申请号：US12146852
申请日：2008-06-26
CPC分类号： G06F1/206 , G06F17/5004 , G06F2217/80 , H05K7/20836 , Y02D10/16
摘要： Techniques for modeling a data center are provided. In one aspect, a method for modeling a data center is provided. The method comprises the following steps. Spatially dense three-dimensional thermal distribution and air flow measurements made in the data center using a mobile off-line surveying system are obtained. A temperature and air flow model for the data center is created using the spatially dense three-dimensional thermal distribution and air flow measurements. The temperature and air flow model is used to make thermal distribution and air flow predictions of the data center. The thermal distribution and air flow predictions are compared with the thermal distribution and air flow measurements made using the mobile off-line surveying system to produce a validated model for the data center.
摘要翻译： 提供了数据中心建模技术。 在一方面，提供了一种用于建模数据中心的方法。 该方法包括以下步骤。 获得了使用移动离线测量系统在数据中心进行的空间密集三维热分布和气流测量。 使用空间密集的三维热分布和空气流量测量，创建数据中心的温度和气流模型。 温度和气流模型用于对数据中心进行热分布和气流预测。 将热分布和气流预测与使用移动离线测量系统进行的热分布和气流测量进行比较，以生成数据中心的验证模型。
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4.发明申请公开(公告)号：US20100307171A1
公开(公告)日：2010-12-09
申请号：US12479798
申请日：2009-06-06
CPC分类号： F25B25/00 , F25B27/007 , F25B2400/24 , F25D16/00 , H05K7/20745
摘要： Energy-efficient data center cooling techniques that utilize free cooling and/or solar cooling are provided. In one aspect, a cooling system is provided including a cooling tower; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the cooling tower, through one or more of the modular refrigeration chiller units or through a combination thereof. Another cooling system is provided including a solar cooling unit; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the solar cooling unit, through one or more of the modular refrigeration chiller units or through a combination thereof.
摘要翻译： 提供了利用免费冷却和/或太阳能冷却的节能数据中心冷却技术。 一方面，提供一种包括冷却塔的冷却系统; 一个或多个模块式冷冻机组; 以及可以选择性地通过冷却塔引导通过一个或多个模块式制冷机组或通过其组合的水回路。 提供另一个冷却系统，包括太阳能冷却单元; 一个或多个模块式冷冻机组; 以及可以选择性地通过太阳能冷却单元，通过一个或多个模块式冷冻机组或通过其组合引导的水回路。
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5.发明授权Device and method for generating an x-ray point source by geometric confinement 失效通过几何约束生成X射线点源的装置和方法公开(公告)号：US07469039B2
公开(公告)日：2008-12-23
申请号：US11497252
申请日：2006-08-02
IPC分类号： H01J35/00
CPC分类号： H01J35/08 , G21K7/00 , H01J2235/083 , H01J2235/086
摘要： A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.
摘要翻译： 用于产生x射线点源的装置包括靶，以及用于产生与靶相交的电子的电子源，以产生具有被靶的尺寸限制的尺寸的x射线点源。
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6.发明授权Device and method for generating an x-ray point source by geometric confinement 有权通过几何约束生成X射线点源的装置和方法公开(公告)号：US07130379B2
公开(公告)日：2006-10-31
申请号：US10445856
申请日：2003-05-28
IPC分类号： H01J35/08
CPC分类号： H01J35/08 , G21K7/00 , H01J2235/083 , H01J2235/086
摘要： A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.
摘要翻译： 用于产生x射线点源的装置包括靶，以及用于产生与靶相交的电子的电子源，以产生具有被靶的尺寸限制的尺寸的x射线点源。
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7.发明申请DEVICE AND METHOD FOR GENERATING AN X-RAY POINT SOURCE BY GEOMETRIC CONFINEMENT 审中-公开通过几何确定产生X射线点源的装置和方法公开(公告)号：US20080258068A1
公开(公告)日：2008-10-23
申请号：US12165500
申请日：2008-06-30
CPC分类号： H01J35/08 , G21K7/00 , H01J2235/083 , H01J2235/086
摘要： A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.
摘要翻译： 用于产生x射线点源的装置包括靶，以及用于产生与靶相交的电子的电子源，以产生具有被靶的尺寸限制的尺寸的x射线点源。
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公开(公告)号：US07063127B2
公开(公告)日：2006-06-20
申请号：US10665798
申请日：2003-09-18
申请人： Jeffrey D. Gelorme , Hendrik F. Hamann , Nancy C. LaBianca , Yves C. Martin , Theodore G. Van Kessel
发明人： Jeffrey D. Gelorme , Hendrik F. Hamann , Nancy C. LaBianca , Yves C. Martin , Theodore G. Van Kessel
IPC分类号： F28F7/00
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A thermal interface for IC chip cooling is provided. One embodiment of the thermal interface includes a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.
摘要翻译： 提供了用于IC芯片冷却的热接口。 热界面的一个实施例包括设置在柔性导热外壳内的导热液体或糊状金属。 壳体适于放置在IC芯片和散热器之间，以增强从芯片到散热片的热传递，从而比通过常规技术可以实现的更快和更有效地冷却芯片。 在几个实施例中，热界面通过机械压力而不是通过粘合保持在适当位置，这进一步便于IC器件的检查和修理。
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9.发明授权公开(公告)号：US07979250B2
公开(公告)日：2011-07-12
申请号：US11950747
申请日：2007-12-05
申请人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G06F17/50 , G06G7/56 , G06G7/50 , H02B1/00 , G01K13/00 , G01K1/08 , G01K7/16 , G01K11/30 , G01K1/16 , G01N9/36
CPC分类号： G06F17/509 , G06F1/20 , G06F17/5004 , G06F2217/78 , G06F2217/80
摘要： A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.
摘要翻译： 提供了一种便于在数据中心内安装一个或多个电子机架的方法。 该方法包括：将多个热模拟器放置在数据中心中的数据中心布局中，以建立热仿真数据中心，每个热模拟器模拟多个模拟数据中心的相应电子机架的气流吸入或加热气流排气中的至少一个 电子机架要安装在数据中心; 监测多个位置的热仿真数据中心内的温度，以及如果测量温度在包含多个电子机架时数据中心的可接受温度范围内，则验证数据中心布局; 以及使用已验证的数据中心布局在所述数据中心内建立所述多个电子机架，所述建立包括用相应的电子机架重新配置或替换每个热模拟器中的至少一个。
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公开(公告)号：US08593815B2
公开(公告)日：2013-11-26
申请号：US13189515
申请日：2011-07-24
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
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