摘要:
A semiconductor memory device and method is shown in which a built-in system test (BIST) circuit determines, based upon the test algorithm and the refresh requirements of a DRAM memory cell array, a refresh point address where the BIST circuit performs a refresh operation on the test data in the memory cell array when the test address reaches the refresh point address. Another embodiment of a semiconductor memory device and method is also shown in which a BIST circuit descrambles the test address and test data before input to a memory circuit which includes address and data scrambling circuits such that the logical test address and test data generated according to a test algorithm matches the physical address and data in the memory cell array.
摘要:
A built-in self test (BIST) circuit using a linear feedback shift register (LFSR) and a multiple input signature register (MISR) requiring reduced circuitry exclusive of the number of inputs and outputs of the circuit to be tested. The BIST circuit is built in a prescribed circuit having a memory to test a target circuit in the prescribed circuit. The BIST circuit includes an LFSR, including a first logic section which is composed of a plurality of XOR gates and selection sections, and a first memory which is a part of the memory, for performing a primitive polynomial, an MISR, including a second logic section which is composed of a plurality of XOR gates and selection sections, and a second memory which is a part of the memory, for performing the primitive polynomial, and a BIST control section for controlling data input/output between the first and second memories and the target circuit and providing selection signals for controlling the selection sections in the first and second logic sections, the BIST control section controlling the target circuit and comparing operation results of the target circuit to perform the test of the target circuit.
摘要:
An integrated circuit semiconductor device comprises a built-in self-repair (BISR) circuit including a plurality of row fill entries and a plurality of column fill entries for storing faulty memory cell information of an embedded memory. Sizes of the row and column fill entries are determined by the numbers of row and column redundancies of the embedded memory. The row/column fill entries store row/column addresses of the faulty memory cells, and the number of the faulty memory cells occurring at the same row/column address, respectively. In addition, the row/column fill entries include pointers for indicating opposite entries storing the column/row address corresponding to the row/column address. For repairing the faulty memory cells with the row and column redundancies, the BISR circuit selects row/column fill entries and deletes the number of the fault memory cells stored in the opposite fill entry. Thus, the information is deleted from the row/column fill entries with the exception of information to be repaired. Therefore, the self-repair of the faulty memory cells can be performed in the BISR circuit in response to the remaining information.