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公开(公告)号：US4767674A
公开(公告)日：1988-08-30
申请号：US759209
申请日：1985-07-26
申请人： Hideaki Shirai , Kimio Chiba , Koji Okawa , Hiroshi Ishibashi , Akihiro Ishii , Hirotaka Itoh , Hirokazu Kuzushita , Michihiko Yoshioka , Michio Hirose
发明人： Hideaki Shirai , Kimio Chiba , Koji Okawa , Hiroshi Ishibashi , Akihiro Ishii , Hirotaka Itoh , Hirokazu Kuzushita , Michihiko Yoshioka , Michio Hirose
CPC分类号： B32B15/08 , H01L23/142 , H05K1/056 , H01L2924/0002 , H05K1/09 , H05K2203/135 , H05K3/022 , Y10T428/12569 , Y10T428/12576 , Y10T428/12882 , Y10T428/31692 , Y10T428/31699
摘要： It is disclosed that a metal cored board which comprises an electrically conductive layer whose one surface at least composed of a hardly oxidizable metal, an insulating organic polymer layer baked on the surface of the hardly oxidizable metal, and a metal core adhered on the insulating organic polymer layer, and a method for manufacturing a metal cored board, which comprises a step to coat the surface of a hardly oxidizable metal layer of an electrically conductive metal foil with an insulating varnish, a step to bake a layer of the varnish, and a step to adhere a metal core on the baked varnish layer.
摘要翻译： 公开了一种金属芯板，其包括导电层，其一个表面至少由几乎不可氧化的金属构成，在几乎可氧化的金属的表面上焙烧的绝缘有机聚合物层和粘附在绝缘有机物上的金属芯 聚合物层和金属芯板的制造方法，其包括用绝缘漆涂覆导电金属箔的几乎不可氧化的金属层的表面的步骤，烘烤一层清漆的步骤，以及 将金属芯粘附在烘烤的清漆层上。
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公开(公告)号：US4695515A
公开(公告)日：1987-09-22
申请号：US759210
申请日：1985-07-26
申请人： Hideaki Shirai , Kimio Chiba , Koji Okawa , Hiroshi Ishibashi , Akihiro Ishii , Hirotaka Itoh , Hirokazu Kuzushita , Michihiko Yoshioka , Michio Hirose
发明人： Hideaki Shirai , Kimio Chiba , Koji Okawa , Hiroshi Ishibashi , Akihiro Ishii , Hirotaka Itoh , Hirokazu Kuzushita , Michihiko Yoshioka , Michio Hirose
CPC分类号： H05K1/056 , B32B15/08 , H01L23/142 , H01L2924/0002 , H05K1/09 , H05K2203/135 , H05K3/022 , Y10T428/12639 , Y10T428/12646 , Y10T428/12653 , Y10T428/1266 , Y10T428/12667 , Y10T428/12882 , Y10T428/31681 , Y10T428/31692 , Y10T428/31699
摘要： It is disclosed that a metal cored board which comprises a base metal core, an easily solderable metal plating layer formed on one surface of the base metal core, an electrically insulating layer formed on the another surface of the base metal core, and an electrically conductive metal layer formed on the electrically insulating layer, a method for manufacturing a metal cored board, which comprises a step to plate both surface of a base metal core with an easily solderable metal, a step to form an electrically insulating layer on one surface of the easily solderable metal plating layer, and a step to form an electrically conductive metal layer on the electrically insulating layer.
摘要翻译： 公开了一种金属芯板，其包括母金属芯，形成在母金属芯的一个表面上的容易焊接的金属镀层，形成在母材金属芯的另一个表面上的电绝缘层，以及导电 金属层，形成在电绝缘层上的金属层，金属芯板的制造方法，其特征在于，包括使用容易焊接的金属对所述母金属芯的两面进行平板化的工序，在所述金属芯的一个表面上形成电绝缘层 易于焊接的金属镀层，以及在电绝缘层上形成导电金属层的步骤。
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公开(公告)号：US4443337A
公开(公告)日：1984-04-17
申请号：US352203
申请日：1982-02-25
申请人： Mitsunobu Otani , Teruo Senda , Michio Hirose
发明人： Mitsunobu Otani , Teruo Senda , Michio Hirose
摘要： A method for biologically purifiying waste water which produces substantially no excess waste sludge is provided. In this method, a waste water containing biodegradable substances is treated in a biological fixed film type reactor and aqueous water sludge discharged from the reactor is aerobically digested after being separated from the biologically treated waste water. The digested aqueous sludge is returned to the reactor or the upstream thereof. This method can be advantageously combined with any installed activated sludge type water purification process, to thereby substantially eliminate the production of excess waste sludge from the water purification system.
摘要翻译： 提供了一种生物净化废水的方法，该方法基本上不产生多余的废污泥。 在该方法中，在生物固定膜型反应器中处理含有生物降解性物质的废水，从生物处理废水中分离后，将从反应器排出的含水水泥进行有氧消毒。 消化的水性污泥返回到反应器或其上游。 该方法可以有利地与任何已安装的活性污泥型水净化方法组合，从而基本上消除了来自水净化系统的过量废渣的产生。
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