公开(公告)号：US07347347B2

公开(公告)日：2008-03-25

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US20050057856A1

公开(公告)日：2005-03-17

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： G11B5/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L29/06 ,  G11B21/20

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US06885522B1

公开(公告)日：2005-04-26

申请号：US09548313

申请日：2000-04-12

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： G11B5/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L29/06

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US06400529B1

公开(公告)日：2002-06-04

申请号：US09528683

申请日：2000-03-20

申请人： Shunji Baba ,  Hidehiko Kira ,  Norio Kainuma ,  Toru Okada

发明人： Shunji Baba ,  Hidehiko Kira ,  Norio Kainuma ,  Toru Okada

IPC分类号： G11B576

CPC分类号： G11B5/4853

摘要： A head assembly has a head slider including a magnetic head and a first electrode, an IC chip supporting the head slider on a principal surface of the IC chip, and a suspension supporting the IC chip, the IC chip comprising a second electrode and a third electrode on the principal surface thereof, the third electrode being connected to the suspension, the second electrode being electrically connected to the first electrode.

摘要翻译： 头组件具有头滑块，其包括磁头和第一电极，IC芯片，其在IC芯片的主表面上支撑磁头滑块，以及支撑IC芯片的悬架，所述IC芯片包括第二电极和第三电极 电极在其主表面上，第三电极连接到悬架，第二电极电连接到第一电极。

公开(公告)号：US07436062B2

公开(公告)日：2008-10-14

申请号：US10223454

申请日：2002-08-20

申请人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

发明人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

IPC分类号： H01L23/48 ,  H01L23/04

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L24/13 ,  H01L24/14 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05664

摘要： An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 μm is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.

摘要翻译： 一种用于改善超声波接合并安装在电路板上的半导体芯片元件100的底部填充填充的装置和方法。 半导体芯片元件100包括硅芯片101和形成在芯片101的底表面101a上的一组柱形突起117。 信号柱凸起113由金制成，而电源凸块114，接地柱形凸块115和虚拟凸块凸块116都由金 - 钯合金制成，其比信号柱凸块113更硬，因此在超声波期间不容易变形 治疗。 因此，在安装半导体芯片元件100的状态下，在芯片100的底面101a与半导体芯片元件100的电路基板120的上表面之间保持约30μm的间隙 安装。

公开(公告)号：US06483190B1

公开(公告)日：2002-11-19

申请号：US09618726

申请日：2000-07-18

申请人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

发明人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

IPC分类号： H01L2348

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L24/13 ,  H01L24/14 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05664

摘要： An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 &mgr;m is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.

摘要翻译： 一种用于改善超声波接合并安装在电路板上的半导体芯片元件100的底部填充填充的装置和方法。 半导体芯片元件100包括硅芯片101和形成在芯片101的底表面101a上的一组柱形突起117.信号柱凸块113由金制成，而电源触头凸块114，接地柱形突起115和虚拟凸块凸块 116均由金 - 钯合金制成，其比信号柱凸块113更硬，因此在超声波处理期间不容易变形。 因此，在安装半导体芯片元件100的状态下，在芯片100的底面101a与安装有半导体芯片元件100的电路基板120的上表面之间保持约30μm的间隙 。

公开(公告)号：US20050038537A1

公开(公告)日：2005-02-17

申请号：US10806105

申请日：2004-03-23

申请人： Toru Okada ,  Masanao Fujii ,  Takatoyo Yamakami ,  Kazuhisa Mishima ,  Toshiaki Otsuka

发明人： Toru Okada ,  Masanao Fujii ,  Takatoyo Yamakami ,  Kazuhisa Mishima ,  Toshiaki Otsuka

IPC分类号： G06F17/50 ,  G05B19/418 ,  G06F19/00 ,  G06Q50/00 ,  G06Q50/04 ,  H01L21/02

CPC分类号： G05B19/41885 ,  G05B2219/31334 ,  G05B2219/31343 ,  G05B2219/35029 ,  G05B2219/35179 ,  G06Q10/06 ,  G06Q50/04 ,  Y02P90/185 ,  Y02P90/26 ,  Y02P90/265 ,  Y02P90/30

摘要： The present invention relates to a design support system constructed so as to comprise a manufacturing line information preparation section and an output section. On the basis of element types selected by a selection section as arbitrary element types to be used for constituting a manufacturing line, the manufacturing line information preparation section prepares information about the manufacturing line by means of acquiring information about element types stored in an element type database beforehand. The output section can output the information about the manufacturing line prepared by the manufacturing line information preparation section. A manufacturing line including a plurality of steps is efficiently examined, determined, and established, thereby shortening the time required to design and manufacture the manufacturing line and curtailing manufacturing costs.

摘要翻译： 本发明涉及一种构造为包括制造线信息准备部分和输出部分的设计支撑系统。 基于由选择部分选择的元素类型作为用于构成生产线的任意元素类型，生产线信息准备部分通过获取关于元素类型数据库中存储的元素类型的信息来准备关于生产线的信息 预先。 输出部可以输出由制造线信息准备部准备的生产线的信息。 包括多个步骤的生产线被有效地检查，确定和建立，从而缩短了设计和制造生产线所需的时间并缩短了制造成本。

公开(公告)号：US07133733B2

公开(公告)日：2006-11-07

申请号：US10806105

申请日：2004-03-23

申请人： Toru Okada ,  Masanao Fujii ,  Takatoyo Yamakami ,  Kazuhisa Mishima ,  Toshiaki Otsuka

发明人： Toru Okada ,  Masanao Fujii ,  Takatoyo Yamakami ,  Kazuhisa Mishima ,  Toshiaki Otsuka

IPC分类号： G06F19/00

CPC分类号： G05B19/41885 ,  G05B2219/31334 ,  G05B2219/31343 ,  G05B2219/35029 ,  G05B2219/35179 ,  G06Q10/06 ,  G06Q50/04 ,  Y02P90/185 ,  Y02P90/26 ,  Y02P90/265 ,  Y02P90/30

摘要： The present invention relates to a design support system constructed so as to comprise a manufacturing line information preparation section and an output section. On the basis of element types selected by a selection section as arbitrary element types to be used for constituting a manufacturing line, the manufacturing line information preparation section prepares information about the manufacturing line by means of acquiring information about element types stored in an element type database beforehand. The output section can output the information about the manufacturing line prepared by the manufacturing line information preparation section. A manufacturing line including a plurality of steps is efficiently examined, determined, and established, thereby shortening the time required to design and manufacture the manufacturing line and curtailing manufacturing costs.

摘要翻译： 本发明涉及一种构造为包括制造线信息准备部分和输出部分的设计支撑系统。 基于由选择部分选择的元素类型作为用于构成生产线的任意元素类型，生产线信息准备部分通过获取关于元素类型数据库中存储的元素类型的信息来准备关于生产线的信息 预先。 输出部可以输出由制造线信息准备部准备的生产线的信息。 包括多个步骤的生产线被有效地检查，确定和建立，从而缩短了设计和制造生产线所需的时间并缩短了制造成本。

公开(公告)号：US20100097080A1

公开(公告)日：2010-04-22

申请号：US12487885

申请日：2009-06-19

申请人： Hiroshi Kobayashi ,  Toru Okada ,  Yasutoshi Furukawa

发明人： Hiroshi Kobayashi ,  Toru Okada ,  Yasutoshi Furukawa

IPC分类号： G01R27/00 ,  B32B37/00

CPC分类号： H03K17/962 ,  G06K9/00053 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A contact sensor unit includes: a flexible substrate having a conductive pattern; a sensor element having a detecting surface for detecting a fingerprint of a test subject, the sensor element having a terminal electrically connected to the conductive pattern, and the sensor element mounted on the flexible substrate to be covered with the flexible substrate; and a reinforcing member fixed on the flexible substrate and surrounding the sensor element.

摘要翻译： 接触传感器单元包括：具有导电图案的柔性基板; 传感器元件，具有用于检测测试对象的指纹的检测表面，所述传感器元件具有电连接到所述导电图案的端子，以及所述传感器元件安装在所述柔性基板上以被所述柔性基板覆盖; 以及固定在柔性基板上并围绕传感器元件的加强构件。

公开(公告)号：US08604347B2

公开(公告)日：2013-12-10

申请号：US13075895

申请日：2011-03-30

申请人： Hiroshi Kobayashi ,  Satoshi Emoto ,  Masayuki Kitajima ,  Toru Okada

发明人： Hiroshi Kobayashi ,  Satoshi Emoto ,  Masayuki Kitajima ,  Toru Okada

IPC分类号： H05K1/03 ,  H05K7/00 ,  H01L23/58

CPC分类号： H05K3/3436 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2009 ,  Y02P70/613

摘要： Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.

摘要翻译： 公开了一种用于加强其中电子部件安装在第一表面上的电路板的电路板加强结构，该电子部件具有布置在第一表面上的矩形区域中的电极。 板加强结构包括加强构件，该加强构件在设置在与电路板的第一表面相对的一侧上的第二表面上接合到与矩形区域的四个角的角部相对应的位置。 在板加强结构中，在加强构件中，在与矩形区域的四个角的一个角部相对应的位置处形成相应的一个切口，并且加强构件的至少两个顶点指向外部 形成为与其中一个凹口成形其轮廓。