公开(公告)号：US6069094A

公开(公告)日：2000-05-30

申请号：US924304

申请日：1997-09-05

申请人： Hideki Matsumura ,  Akira Izumi ,  Atsushi Masuda ,  Yasunobu Nashimoto ,  Yosuke Miyoshi ,  Shuji Nomura ,  Kazuo Sakurai ,  Shouichi Aoshima

发明人： Hideki Matsumura ,  Akira Izumi ,  Atsushi Masuda ,  Yasunobu Nashimoto ,  Yosuke Miyoshi ,  Shuji Nomura ,  Kazuo Sakurai ,  Shouichi Aoshima

IPC分类号： H01L21/205 ,  C23C16/02 ,  C23C16/44 ,  H01L21/28 ,  H01L21/31 ,  H01L21/314 ,  H01L21/316 ,  H01L21/318

CPC分类号： C23C16/44 ,  C23C16/0236 ,  H01L21/28264 ,  H01L21/3185

摘要： This invention discloses a method and apparatus where a pre-treatment which reduce interfacial level density is carried out before thin film deposition on a substrate utilizing a catalytic gas phase reaction. The catalytic gas phase reaction is generated with a treatment gas which is supplied with the substrate via a thermal catalysis body provided near the substrate surface. Thin film deposition on the substrate surface is carried out after this pre-treatment. The thermal catalysis body is made of tungsten, molybdenum, tantalum, titanium or vanadium, and is heated by a heater. And, this invention also discloses a semiconductor device having a semiconductor-insulator junction with its interfacial level density is 10.sup.12 eV .sup.-1 cm.sup.-2 or less, which is brought by the above pre-treatment in the insulator film deposition process.

摘要翻译： 本发明公开了一种方法和装置，其中在使用催化气相反应的薄膜沉积在基板上之前进行降低界面密度的预处理。 催化气相反应是通过设置在基板表面附近的热催化体被提供给基板的处理气体产生的。 在该预处理之后进行在基板表面上的薄膜沉积。 热催化体由钨，钼，钽，钛或钒制成，并被加热器加热。 并且，本发明还公开了一种具有半导体 - 绝缘体结的半导体器件，其界面电平密度为1012eV -1cm-2或更小，这是通过上述绝缘膜沉积工艺中的预处理所带来的。

公开(公告)号：US06723664B2

公开(公告)日：2004-04-20

申请号：US10041609

申请日：2002-01-10

申请人： Hideki Matsumura ,  Akira Izumi ,  Atsushi Masuda ,  Yasunobu Nashimoto ,  Yosuke Miyoshi ,  Shuji Nomura ,  Kazuo Sakurai ,  Shouichi Aoshima

发明人： Hideki Matsumura ,  Akira Izumi ,  Atsushi Masuda ,  Yasunobu Nashimoto ,  Yosuke Miyoshi ,  Shuji Nomura ,  Kazuo Sakurai ,  Shouichi Aoshima

IPC分类号： H01L2131

CPC分类号： C23C16/44 ,  C23C16/0236 ,  H01L21/28264 ,  H01L21/3185

摘要： This invention discloses a method and apparatus where a pre-treatment which reduce interfacial level density is carried out before thin film deposition on a substrate utilizing a catalytic gas phase reaction. The catalytic gas phase reaction is generated with a treatment gas which is supplied with the substrate via a thermal catalysis body provided near the substrate surface. Thin film deposition on the substrate surface is carried out after this pre-treatment. The thermal catalysis body is made of tungsten, molybdenum, tantalum, titanium or vanadium, and is heated by a heater. And, this invention also discloses a semiconductor device having a semiconductor-insulator junction with its interfacial level density is 1012 eV −1cm−2 or less, which is brought by the above pre-treatment in the insulator film deposition process.

摘要翻译： 本发明公开了一种方法和装置，其中在使用催化气相反应的薄膜沉积在基板上之前进行降低界面密度的预处理。 催化气相反应是通过设置在基板表面附近的热催化体被提供给基板的处理气体产生的。 在该预处理之后进行在基板表面上的薄膜沉积。 热催化体由钨，钼，钽，钛或钒制成，并被加热器加热。 并且，本发明还公开了一种具有半导体 - 绝缘体结的半导体器件，其界面密度为10 12 eV -1 cm -2以下，这是通过上述预处理在绝缘体中产生的 薄膜沉积工艺。

公开(公告)号：US06349669B1

公开(公告)日：2002-02-26

申请号：US09102665

申请日：1998-06-23

申请人： Hideki Matsumura ,  Akira Izumi ,  Atsushi Masuda ,  Yasunobu Nashimoto ,  Yosuke Miyoshi ,  Shuji Nomura ,  Kazuo Sakurai ,  Shouichi Aoshima

发明人： Hideki Matsumura ,  Akira Izumi ,  Atsushi Masuda ,  Yasunobu Nashimoto ,  Yosuke Miyoshi ,  Shuji Nomura ,  Kazuo Sakurai ,  Shouichi Aoshima

IPC分类号： C23C1600

CPC分类号： C23C16/44 ,  C23C16/0236 ,  H01L21/28264 ,  H01L21/3185

摘要： This invention discloses a method and apparatus where a pre-treatment which reduce interfacial level density is carried out before thin film deposition on a substrate utilizing a catalytic gas phase reaction. The catalytic gas phase reaction is generated with a treatment gas which is supplied with the substrate via a thermal catalysis body provided near the substrate surface. Thin film deposition on the substrate surface is carried out after this pre-treatment. The thermal catalysis body is made of tungsten, molybdenum, tantalum, titanium or vanadium, and is heated by a heater. And, this invention also discloses a semiconductor device having a semiconductor-insulator junction with its interfacial level density is 1012 eV−1 cm−2 or less, which is brought by the above pre-treatment in the insulator film deposition process.

摘要翻译： 本发明公开了一种方法和装置，其中在使用催化气相反应的薄膜沉积在基板上之前进行降低界面密度的预处理。 催化气相反应是通过设置在基板表面附近的热催化体被提供给基板的处理气体产生的。 在该预处理之后进行在基板表面上的薄膜沉积。 热催化体由钨，钼，钽，钛或钒制成，并被加热器加热。 而且，本发明还公开了一种具有半导体 - 绝缘体结的半导体器件，其界面电平密度为1012eV-1cm-2或更低，这是通过上述绝缘膜沉积工艺中的预处理而得到的。