GaN substrate, substrate with epitaxial layer, semiconductor device, and method of manufacturing GaN substrate
    1.
    发明授权
    GaN substrate, substrate with epitaxial layer, semiconductor device, and method of manufacturing GaN substrate 失效
    GaN衬底,具有外延层的衬底,半导体器件和制造GaN衬底的方法

    公开(公告)号:US07816238B2

    公开(公告)日:2010-10-19

    申请号:US12137038

    申请日:2008-06-11

    IPC分类号: H01L21/20

    摘要: A GaN substrate having a large diameter of two inches or more by which a semiconductor device such as a light emitting element with improved characteristics such as luminance efficiency, an operating life and the like can be obtained at low cost industrially, a substrate having an epitaxial layer formed on the GaN substrate, a semiconductor device, and a method of manufacturing the GaN substrate are provided. A GaN substrate has a main surface and contains a low-defect crystal region and a defect concentrated region adjacent to low-defect crystal region. Low-defect crystal region and defect concentrated region extend from the main surface to a back surface positioned on the opposite side of the main surface. A plane direction [0001] is inclined in an off-angle direction with respect to a normal vector of the main surface.

    摘要翻译: 具有两英寸以上的大直径的GaN衬底,通过该GaN衬底可以以低成本在工业上获得具有诸如亮度效率,寿命等的改善的特性的发光元件的半导体器件,具有外延的衬底 提供了形成在GaN衬底上的层,半导体器件和制造GaN衬底的方法。 GaN衬底具有主表面并且包含低缺陷晶体区域和与低缺陷晶体区域相邻的缺陷集中区域。 低缺陷晶体区域和缺陷集中区域从主表面延伸到位于主表面相对侧的后表面。 平面方向相对于主表面的法线矢量在偏角方向上倾斜。

    GaN SUBSTRATE, SUBSTRATE WITH EPITAXIAL LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING GaN SUBSTRATE
    2.
    发明申请
    GaN SUBSTRATE, SUBSTRATE WITH EPITAXIAL LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING GaN SUBSTRATE 失效
    GaN衬底,具有外延层的衬底,半导体器件以及制造GaN衬底的方法

    公开(公告)号:US20080308906A1

    公开(公告)日:2008-12-18

    申请号:US12137038

    申请日:2008-06-11

    IPC分类号: H01L29/20 H01L21/20 C01B21/06

    摘要: A GaN substrate having a large diameter of two inches or more by which a semiconductor device such as a light emitting element with improved characteristics such as luminance efficiency, an operating life and the like can be obtained at low cost industrially, a substrate having an epitaxial layer formed on the GaN substrate, a semiconductor device, and a method of manufacturing the GaN substrate are provided. A GaN substrate has a main surface and contains a low-defect crystal region and a defect concentrated region adjacent to low-defect crystal region. Low-defect crystal region and defect concentrated region extend from the main surface to a back surface positioned on the opposite side of the main surface. A plane direction [0001] is inclined in an off-angle direction with respect to a normal vector of the main surface.

    摘要翻译: 具有两英寸以上的大直径的GaN衬底,通过该GaN衬底可以以低成本在工业上获得具有诸如亮度效率,工作寿命等改善的特性的发光元件的半导体器件,具有外延 提供了形成在GaN衬底上的层,半导体器件和制造GaN衬底的方法。 GaN衬底具有主表面并且包含低缺陷晶体区域和与低缺陷晶体区域相邻的缺陷集中区域。 低缺陷晶体区域和缺陷集中区域从主表面延伸到位于主表面相对侧的后表面。 平面方向相对于主表面的法线矢量在偏角方向上倾斜。

    Nitride semiconductor light emitting device and method for forming the same
    4.
    发明授权
    Nitride semiconductor light emitting device and method for forming the same 有权
    氮化物半导体发光器件及其形成方法

    公开(公告)号:US07973322B2

    公开(公告)日:2011-07-05

    申请号:US12440643

    申请日:2008-04-17

    IPC分类号: H01L29/00 H01L21/00

    摘要: An active layer 17 is provided so as to emit light having a light emission wavelength in the range of 440 to 550 nm. A first conduction type gallium nitride-based semiconductor region 13, the active layer 17, and a second conduction type gallium nitride-based semiconductor region 15 are disposed in a predetermined axis Ax direction. The active layer 17 includes a well layer composed of hexagonal InXGa1-XN (0.16≦X≦0.35, X: strained composition), and the indium composition X is represented by a strained composition. The a-plane of the hexagonal InXGa1-XN is aligned in the predetermined axis Ax direction. The thickness of the well layer is in the range of more than 2.5 nm to 10 nm. When the thickness of the well layer is set to 2.5 nm or more, a light emitting device having a light emission wavelength of 440 nm or more can be formed.

    摘要翻译: 提供有源层17以发射具有在440至550nm范围内的发光波长的光。 第一导电型氮化镓基半导体区域13,有源层17和第二导电型氮化镓基半导体区域15设置在预定的轴线方向。 有源层17包括由六方晶系InXGa1-XN(0.16≦̸ X< EL; 0.35,X:应变组成)构成的阱层,铟组合物X由应变组成表示。 六边形InXGa1-XN的a平面在预定轴Ax方向上对准。 阱层的厚度在大于2.5nm至10nm的范围内。 当阱层的厚度设定为2.5nm以上时,可以形成发光波长为440nm以上的发光元件。

    NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR FORMING THE SAME
    5.
    发明申请
    NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR FORMING THE SAME 有权
    氮化物半导体发光器件及其形成方法

    公开(公告)号:US20100059759A1

    公开(公告)日:2010-03-11

    申请号:US12440643

    申请日:2008-04-17

    IPC分类号: H01L33/00

    摘要: An active layer 17 is provided so as to emit light having a light emission wavelength in the range of 440 to 550 nm. A first conduction type gallium nitride-based semiconductor region 13, the active layer 17, and a second conduction type gallium nitride-based semiconductor region 15 are disposed in a predetermined axis Ax direction. The active layer 17 includes a well layer composed of hexagonal InXGa1-XN (0.16≦X≦0.35, X: strained composition), and the indium composition X is represented by a strained composition. The a-plane of the hexagonal InXGa1-XN is aligned in the predetermined axis Ax direction. The thickness of the well layer is in the range of more than 2.5 nm to 10 nm. When the thickness of the well layer is set to 2.5 nm or more, a light emitting device having a light emission wavelength of 440 nm or more can be formed.

    摘要翻译: 提供有源层17以发射具有在440至550nm范围内的发光波长的光。 第一导电型氮化镓基半导体区域13,有源层17和第二导电型氮化镓基半导体区域15设置在预定的轴线方向。 有源层17包括由六方晶系InXGa1-XN(0.16≦̸ X< EL; 0.35,X:应变组成)构成的阱层,铟组合物X由应变组成表示。 六边形InXGa1-XN的a平面在预定轴Ax方向上对准。 阱层的厚度在大于2.5nm至10nm的范围内。 当阱层的厚度设定为2.5nm以上时,可以形成发光波长为440nm以上的发光元件。

    Nitride Semiconductor Light-Emitting Device and Nitride Semiconductor Light-Emitting Device Fabrication Method
    6.
    发明申请
    Nitride Semiconductor Light-Emitting Device and Nitride Semiconductor Light-Emitting Device Fabrication Method 审中-公开
    氮化物半导体发光器件和氮化物半导体发光器件制造方法

    公开(公告)号:US20100032644A1

    公开(公告)日:2010-02-11

    申请号:US12307586

    申请日:2008-03-28

    IPC分类号: H01L33/00 H01L21/20

    摘要: An active layer (17) is provided so as to emit light having an emission wavelength in the 440 nm to 550 nm band. A first-conductivity-type gallium nitride semiconductor region (13), the active layer (17), and a second-conductivity-type gallium nitride semiconductor region (15) are arranged along a predetermined axis (Ax). The active layer (17) includes a well layer composed of hexagonal InxGa1-xN (0.16≦x≦0.4, x: strained composition), with the indium fraction x represented by the strained composition. The m-plane of the hexagonal InxGa1-xN is oriented along the predetermined axis (Ax). The well-layer thickness is between greater than 3 nm and less than or equal to 20 nm. Having the well-layer thickness be over 3 nm makes it possible to fabricate light-emitting devices having an emission wavelength of over 440 nm.

    摘要翻译: 提供有源层(17)以发射具有440nm至550nm波段的发射波长的光。 第一导电型氮化镓半导体区域(13),有源层(17)和第二导电型氮化镓半导体区域(15)沿预定轴线(Ax)布置。 活性层(17)包括由六方晶系In x Ga 1-x N(0.16 <= x <= 0.4,x:应变组成)构成的阱层,其中铟组分x由应变组合物表示。 六边形In x Ga 1-x N的m面沿预定轴线(Ax)取向。 阱层厚度大于3nm且小于或等于20nm。 具有超过3nm的阱层厚度使得可以制造发射波长超过440nm的发光器件。

    Gallium nitride-based semiconductor optical device, method of fabricating gallium nitride-based semiconductor optical device, and epitaxial wafer
    7.
    发明授权
    Gallium nitride-based semiconductor optical device, method of fabricating gallium nitride-based semiconductor optical device, and epitaxial wafer 失效
    氮化镓系半导体光学元件,氮化镓系半导体光学元件的制造方法以及外延片

    公开(公告)号:US08228963B2

    公开(公告)日:2012-07-24

    申请号:US12715860

    申请日:2010-03-02

    IPC分类号: H01S5/00

    摘要: A gallium nitride-based semiconductor optical device is provided that includes an indium-containing gallium nitride-based semiconductor layer that exhibit low piezoelectric effect and high crystal quality. The gallium nitride-based semiconductor optical device 11a includes a GaN support base 13, a GaN-based semiconductor region 15, and well layers 19. A primary surface 13a tilts from a surface orthogonal to a reference axis that extends in a direction from one crystal axis of the m-axis and the a-axis of GaN toward the other crystal axis. The tilt angle AOFF is 0.05 degree or more to less than 15 degrees. The angle AOFF is equal to the angle defined by a vector VM and a vector VN. The inclination of the primary surface is shown by a typical m-plane SM and m-axis vector VM. The GaN-based semiconductor region 15 is provided on the primary surface 13a. In the well layers 19 in an active layer 17, both the m-plane and the a-plane of the well layers 19 tilt from a normal axis AN of the primary surface 13a. The indium content of the well layers 19 is 0.1 or more.

    摘要翻译: 提供一种氮化镓系半导体光学元件,其包括显示低压电效应和高结晶质量的含铟氮化镓系半导体层。 氮化镓系半导体光学元件11a包括GaN支撑基底13,GaN基半导体区域15以及阱层19.初级表面13a从与从一个晶体的方向延伸的参考轴正交的表面倾斜 m轴的a轴和另一个晶轴的GaN的a轴。 倾角AOFF为0.05度以上至小于15度。 角度AOFF等于由矢量VM和矢量VN定义的角度。 主表面的倾角由典型的m面SM和m轴矢量VM表示。 GaN基半导体区域15设置在主表面13a上。 在有源层17的阱层19中,阱层19的m面和a面都从主面13a的法线轴AN倾斜。 阱层19的铟含量为0.1以上。

    Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
    10.
    发明授权
    Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same 有权
    氮化物晶体,氮化物晶体衬底,含外延层的氮化物晶体衬底,半导体器件及其制造方法

    公开(公告)号:US08192543B2

    公开(公告)日:2012-06-05

    申请号:US12216237

    申请日:2008-07-01

    IPC分类号: C30B21/02

    摘要: A nitride crystal is characterized in that, in connection with plane spacing of arbitrary specific parallel crystal lattice planes of the nitride crystal obtained from X-ray diffraction measurement performed with variation of X-ray penetration depth from a surface of the crystal while X-ray diffraction conditions of the specific parallel crystal lattice planes are satisfied, a uniform distortion at a surface layer of the crystal represented by a value of |d1−d2|/d2 obtained from the plane spacing d1 at the X-ray penetration depth of 0.3 μm and the plane spacing d2 at the X-ray penetration depth of 5 μm is equal to or lower than 2.1×10−3. The above configuration provides the nitride crystal having a crystal surface layer that is evaluated directly and reliably without breaking the crystal so that it can be used in a preferred fashion as a substrate for a semiconductor device as well as the nitride crystal substrate, an epilayer-containing nitride crystal substrate, a semiconductor device and a method of manufacturing the same.

    摘要翻译: 氮化物晶体的特征在于,结合由X射线衍射测量得到的氮化物晶体的任意特定平行晶格面的平面间隔,与X射线的X射线 满足特定平行晶格面的衍射条件,在由X射线穿透深度为0.3μm的平面间距d1获得的由| d1-d2 | / d2值表示的晶体的表面层处的均匀畸变 并且在X射线穿透深度为5μm的平面间距d2等于或低于2.1×10-3。 上述结构提供了具有晶体表面层的氮化物晶体,其直接可靠地评估而不破坏晶体,使得其可以以优选的方式用作半导体器件的衬底以及氮化物晶体衬底, 含氮化物晶体基板,半导体装置及其制造方法。