公开(公告)号：US07220617B2

公开(公告)日：2007-05-22

申请号：US11349219

申请日：2006-02-08

申请人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

发明人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/24 ,  H01L21/52 ,  H01L23/488 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals. In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals being exposed. Mounting surfaces of the metal plate terminals and a third part of the metal cap are bonded to electrodes on a mounting board.

摘要翻译： 半导体芯片由树脂密封而不覆盖具有功率晶体管的半导体器件的外部端子。 具有功率晶体管的半导体芯片容纳在金属盖的凹部内，而半导体芯片的第一表面上的漏电极经由连接材料接合到凹部的底部。 在与半导体芯片的第一表面相对的第二表面上形成栅电极和源电极，并且栅极电极和源极电极与金属板端子接合。 此外，半导体芯片被树脂密封体密封，金属板端子的安装表面露出。 金属板端子和金属盖的第三部分的安装表面与安装板上的电极接合。

公开(公告)号：US20060175700A1

公开(公告)日：2006-08-10

申请号：US11349219

申请日：2006-02-08

申请人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

发明人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

IPC分类号： H01L23/34

CPC分类号： H01L23/24 ,  H01L21/52 ,  H01L23/488 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals being exposed. Mounting surfaces of the metal plate terminals and a third part of the metal cap are bonded to electrodes on a mounting board.

摘要翻译： 半导体芯片由树脂密封而不覆盖具有功率晶体管的半导体器件的外部端子。 具有功率晶体管的半导体芯片容纳在金属盖的凹部内，而半导体芯片的第一表面上的漏电极经由连接材料接合到凹部的底部。 在与半导体芯片的第一表面相对的第二表面上形成栅极电极和源极电极，并且栅极电极和源极电极与金属板端子接合。此外，半导体芯片由树脂密封体 金属板端子的安装表面露出。 金属板端子和金属盖的第三部分的安装表面与安装板上的电极接合。

公开(公告)号：US20070210430A1

公开(公告)日：2007-09-13

申请号：US11783919

申请日：2007-04-13

申请人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

发明人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

IPC分类号： H01L23/02

CPC分类号： H01L23/24 ,  H01L21/52 ,  H01L23/488 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals 6G, 6S via connection materials 5b, 5c. In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals 6G, 6S being exposed. Mounting surfaces of the metal plate terminals 6G, 6S and a third part of the metal cap are bonded to electrodes on a mounting board 10 via connection materials 5e, 5f and 5g.

摘要翻译： 半导体芯片由树脂密封而不覆盖具有功率晶体管的半导体器件的外部端子。 具有功率晶体管的半导体芯片容纳在金属盖的凹部内，而半导体芯片的第一表面上的漏电极经由连接材料接合到凹部的底部。 在与半导体芯片的第一表面相对的第二表面上形成栅电极和源电极，并且栅电极和源电极通过连接材料5b，5c连接金属板端子6G，6S 。 此外，半导体芯片由金属板端子6G，6S的露出的安装面的树脂密封体密封。 金属板端子6G，6S和金属盖的第三部分的安装表面通过连接材料5e，5f和5g与安装板10上的电极接合。

公开(公告)号：US07405469B2

公开(公告)日：2008-07-29

申请号：US11783919

申请日：2007-04-13

申请人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

发明人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

IPC分类号： H01L23/495

CPC分类号： H01L23/24 ,  H01L21/52 ,  H01L23/488 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals 6G, 6S via connection materials 5b, 5c. In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals 6G, 6S being exposed. Mounting surfaces of the metal plate terminals 6G, 6S and a third part of the metal cap are bonded to electrodes on a mounting board 10 via connection materials 5e, 5f and 5g.

摘要翻译： 半导体芯片由树脂密封而不覆盖具有功率晶体管的半导体器件的外部端子。 具有功率晶体管的半导体芯片容纳在金属盖的凹部内，而半导体芯片的第一表面上的漏电极经由连接材料接合到凹部的底部。 在与半导体芯片的第一表面相对的第二表面上形成栅电极和源电极，并且栅电极和源电极通过连接材料5b，5c连接金属板端子6G，6S 。 此外，半导体芯片由金属板端子6G，6S的露出的安装面的树脂密封体密封。 金属板端子6G，6S和金属盖的第三部分的安装表面通过连接材料5e，5f和5g与安装板10上的电极接合。

公开(公告)号：US20080268577A1

公开(公告)日：2008-10-30

申请号：US12164625

申请日：2008-06-30

申请人： Hidemasa KAGII ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

发明人： Hidemasa KAGII ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

IPC分类号： H01L21/00

CPC分类号： H01L23/24 ,  H01L21/52 ,  H01L23/488 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals 6G, 6S via connection materials 5b, 5c. In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals 6G, 6S being exposed. Mounting surfaces of the metal plate terminals 6G, 6S and a third part of the metal cap are bonded to electrodes on a mounting board 10 via connection materials 5e, 5f and 5g.

摘要翻译： 半导体芯片由树脂密封而不覆盖具有功率晶体管的半导体器件的外部端子。 具有功率晶体管的半导体芯片容纳在金属盖的凹部内，而半导体芯片的第一表面上的漏电极经由连接材料接合到凹部的底部。 在与半导体芯片的第一表面相对的第二表面上形成栅电极和源电极，并且栅电极和源电极通过连接材料5b，5c连接金属板端子6G，6S 。 此外，半导体芯片由金属板端子6G，6S的露出的安装面的树脂密封体密封。 金属板端子6G，6S和金属盖的第三部分的安装表面通过连接材料5e，5f和5g与安装板10上的电极接合。

公开(公告)号：US20080220568A1

公开(公告)日：2008-09-11

申请号：US12117359

申请日：2008-05-08

申请人： Akira MUTO ,  Ichio Shimizu ,  Katsuo Arai ,  Hidemasa Kagii ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Takuya Nakajo ,  Keiichi Okawa ,  Masahiko Osaka

发明人： Akira MUTO ,  Ichio Shimizu ,  Katsuo Arai ,  Hidemasa Kagii ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Takuya Nakajo ,  Keiichi Okawa ,  Masahiko Osaka

IPC分类号： H01L23/28

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/49537 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device in the form of a resin sealed semiconductor package is disclosed, wherein a gate terminal connected to a gate pad electrode formed on a surface of a semiconductor chip and a source terminal connected to a source pad electrode formed on the chip surface exposed to a back surface of a sealing resin portion, a first portion of a drain terminal connected to a back-surface drain electrode of the semiconductor chip is exposed to an upper surface of the sealing resin portion, and a second portion of the drain terminal formed integrally with the first portion of the drain terminal is exposed to the back surface of the sealing resin portion. When forming the sealing resin portion in such a semiconductor device, first the sealing resin portion is formed so as to also cover an upper surface of the first portion of the drain terminal and thereafter the upper surface side of the sealing resin portion is polished by liquid honing, thereby allowing the upper surface of the first portion of the drain terminal to be exposed on the upper surface of the sealing resin portion. Both heat dissipating property and production yield of the semiconductor device are improved.

摘要翻译： 公开了一种树脂密封半导体封装形式的半导体器件，其中连接到形成在半导体芯片的表面上的栅极焊盘电极的栅极端子和连接到形成在芯片表面上的源极焊盘电极的源极端子暴露于 密封树脂部分的背面，连接到半导体芯片的背面漏电极的漏极端子的第一部分暴露于密封树脂部分的上表面，并且漏极端子的第二部分整体地形成 漏极端子的第一部分暴露于密封树脂部分的背面。 当在这种半导体器件中形成密封树脂部分时，首先形成密封树脂部分，以便也覆盖漏极端子的第一部分的上表面，此后密封树脂部分的上表面侧被液体 从而允许排水端子的第一部分的上表面暴露在密封树脂部分的上表面上。 改善了半导体器件的散热性能和生产成本。

公开(公告)号：US07374965B2

公开(公告)日：2008-05-20

申请号：US11348362

申请日：2006-02-07

申请人： Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hidemasa Kagii ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Takuya Nakajo ,  Keiichi Okawa ,  Masahiko Osaka

发明人： Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hidemasa Kagii ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Takuya Nakajo ,  Keiichi Okawa ,  Masahiko Osaka

IPC分类号： H01L21/00

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/49537 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device in the form of a resin sealed semiconductor package is disclosed, wherein a gate terminal connected to a gate pad electrode formed on a surface of a semiconductor chip and a source terminal connected to a source pad electrode formed on the chip surface exposed to a back surface of a sealing resin portion, a first portion of a drain terminal connected to a back-surface drain electrode of the semiconductor chip is exposed to an upper surface of the sealing resin portion, and a second portion of the drain terminal formed integrally with the first portion of the drain terminal is exposed to the back surface of the sealing resin portion. When forming the sealing resin portion in such a semiconductor device, first the sealing resin portion is formed so as to also cover an upper surface of the first portion of the drain terminal and thereafter the upper surface side of the sealing resin portion is polished by liquid honing, thereby allowing the upper surface of the first portion of the drain terminal to be exposed on the upper surface of the sealing resin portion. Both heat dissipating property and production yield of the semiconductor device are improved.

摘要翻译： 公开了一种树脂密封半导体封装形式的半导体器件，其中连接到形成在半导体芯片的表面上的栅极焊盘电极的栅极端子和连接到形成在芯片表面上的源极焊盘电极的源极端子暴露于 密封树脂部分的背面，连接到半导体芯片的背面漏电极的漏极端子的第一部分暴露于密封树脂部分的上表面，并且漏极端子的第二部分整体地形成 漏极端子的第一部分暴露于密封树脂部分的背面。 当在这种半导体器件中形成密封树脂部分时，首先形成密封树脂部分，以便也覆盖漏极端子的第一部分的上表面，此后密封树脂部分的上表面侧被液体 从而允许排水端子的第一部分的上表面暴露在密封树脂部分的上表面上。 改善了半导体器件的散热性能和生产成本。

公开(公告)号：US20060177967A1

公开(公告)日：2006-08-10

申请号：US11348362

申请日：2006-02-07

申请人： Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hidemasa Kagii ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Takuya Nakajo ,  Keiichi Okawa ,  Masahiko Osaka

发明人： Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hidemasa Kagii ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Takuya Nakajo ,  Keiichi Okawa ,  Masahiko Osaka

IPC分类号： H01L21/50

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/49537 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device in the form of a resin sealed semiconductor package is disclosed, wherein a gate terminal connected to a gate pad electrode formed on a surface of a semiconductor chip and a source terminal connected to a source pad electrode formed on the chip surface exposed to a back surface of a sealing resin portion, a first portion of a drain terminal connected to a back-surface drain electrode of the semiconductor chip is exposed to an upper surface of the sealing resin portion, and a second portion of the drain terminal formed integrally with the first portion of the drain terminal is exposed to the back surface of the sealing resin portion. When forming the sealing resin portion in such a semiconductor device, first the sealing resin portion is formed so as to also cover an upper surface of the first portion of the drain terminal and thereafter the upper surface side of the sealing resin portion is polished by liquid honing, thereby allowing the upper surface of the first portion of the drain terminal to be exposed on the upper surface of the sealing resin portion. Both heat dissipating property and production yield of the semiconductor device are improved.

摘要翻译： 公开了一种树脂密封半导体封装形式的半导体器件，其中连接到形成在半导体芯片的表面上的栅极焊盘电极的栅极端子和连接到形成在芯片表面上的源极焊盘电极的源极端子暴露于 密封树脂部分的背面，连接到半导体芯片的背面漏电极的漏极端子的第一部分暴露于密封树脂部分的上表面，并且漏极端子的第二部分整体地形成 漏极端子的第一部分暴露于密封树脂部分的背面。 当在这种半导体器件中形成密封树脂部分时，首先形成密封树脂部分，以便也覆盖漏极端子的第一部分的上表面，此后密封树脂部分的上表面侧被液体 从而允许排水端子的第一部分的上表面暴露在密封树脂部分的上表面上。 改善了半导体器件的散热性能和生产成本。

公开(公告)号：US20100172774A1

公开(公告)日：2010-07-08

申请号：US12663159

申请日：2008-05-22

申请人： Takaaki Itabashi ,  Kou Tsukamoto ,  Masahiko Osaka

发明人： Takaaki Itabashi ,  Kou Tsukamoto ,  Masahiko Osaka

IPC分类号： F04C18/02

CPC分类号： F04B39/121 ,  F04B39/14

摘要： The present invention provides a compressor having casings fixed together in a manner allowing the compressor to have a reduced sized as well as reusability.The compressor according to the present invention comprises a plurality of casings (1a, 1b) each having an open end designed to be brought into butt contact, the casings being arranged with the open ends in butt contact with each other, thereby constituting a pressure vessel enclosing a compressing unit; a flange-like projection (3) formed on the outer circumference of the open end of each of the casings, the projections of the casings butted together forming a pair; and a plurality of fixing members (4a to 4c) each in a shape corresponding to a section which would be obtained by dividing the open end of the casing, and having a groove inside, the groove being designed to engage with the paired projections butted together. The open ends of the casings butted together are fixed by the fixing members arranged to surround the casings, each in engagement with the paired projections, and welded to each other.

摘要翻译： 本发明提供了一种压缩机，其具有以允许压缩机具有减小尺寸以及可再利用性的方式固定在一起的壳体。 根据本发明的压缩机包括多个壳体（1a，1b），每个壳体具有被设计为对接的开口端，壳体被布置成使得开口端彼此对接接合，从而构成压力容器 封闭一个压缩单元; 形成在每个壳体的开口端的外圆周上的凸缘状突起（3），所述壳体的突起对接在一起形成一对; 以及多个固定构件（4a至4c），每个固定构件的形状对应于通过分隔壳体的开口端而获得的部分的形状，并且在其内部具有凹槽，该凹槽被设计成与成对的突出物接合在一起 。 对接在一起的壳体的开口端通过被布置成围绕壳体的固定构件固定，每个固定构件与成对的突起接合并彼此焊接。

公开(公告)号：US20100143165A1

公开(公告)日：2010-06-10

申请号：US12528437

申请日：2008-02-13

申请人： Takaaki Itabashi ,  Masahiko Osaka ,  Kou Tsukamoto

发明人： Takaaki Itabashi ,  Masahiko Osaka ,  Kou Tsukamoto

IPC分类号： F04B39/06 ,  F04B35/04 ,  F25B31/00

CPC分类号： F04C18/0215 ,  F01C21/10 ,  F04B39/121 ,  F04B2203/0204 ,  F04C29/0085 ,  F04C2240/808

摘要： An electric compressor provided with an integral inverter, incorporated with a motor and provided in a compressor housing with a motor drive circuit that includes the inverter. At least some of electric parts including the motor drive circuit are coated at an assembly-completed state with a resin material at a predetermined thickness by, for example, pouring of a liquid resin and draining of excess resin. In the electric compressor, a resin coating structure of the motor drive circuit is simplified, is easily coated with resin, is reduced in weight by reducing the amount of resin, and is reduced in cost.

摘要翻译： 一种具有整体逆变器的电动压缩机，其包括电动机并且设置在具有包括逆变器的电动机驱动电路的压缩机壳体中。 包括电动机驱动电路在内的至少一部分电气部件通过例如浇注液体树脂和排出多余的树脂，以预定厚度的树脂材料以组装完成状态被涂覆。 在电动压缩机中，电动机驱动电路的树脂涂布结构简单，容易涂布树脂，通过减少树脂量而减轻重量，成本降低。