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    Method of producing electronic circuit and electronic circuit
    3.
    发明申请
    Method of producing electronic circuit and electronic circuit 有权
    电子电路和电子电路的制造方法

    公开(公告)号：US20050224931A1

    公开(公告)日：2005-10-13

    申请号：US11103464

    申请日：2005-04-12

    申请人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

    发明人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

    IPC分类号： H05K3/18 ,  H01L21/48 ,  H01L23/495 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24

    CPC分类号： H05K3/246 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/242 ,  H05K2201/0347 ,  H05K2203/0517 ,  Y10S438/951 ,  H01L2924/00

    摘要： According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin particles which consist of at least a thermoplastic resin and fine metal particles by electrophotography to form a first base pattern which consists of the first metal-containing resin particles and a second base pattern which consists of the second metal-containing resin particles on a substrate; forming a first metal conductor layer on the first and second base patterns; forming a second metal conductor layer on the first metal conductor layer by electrolytic plating by supplying electric current to the first metal conductor layer; and removing the second base pattern and the first and second metal conductor layers which are formed on the second base pattern.

    摘要翻译： 根据本发明的一个实施方案，电子电路的制造方法包括：将至少由热固性树脂和细金属颗粒组成的第一含金属树脂颗粒和第二含金属树脂颗粒打印，所述第二含金属树脂颗粒由至少热塑性塑料 树脂和细金属颗粒，以形成由第一含金属的树脂颗粒和由基材上的第二含金属的树脂颗粒组成的第二基底图案的第一基底图案; 在所述第一和第二基底图案上形成第一金属导体层; 通过向第一金属导体层提供电流通过电解电镀在第一金属导体层上形成第二金属导体层; 以及去除形成在第二基底图案上的第二基底图案和第一和第二金属导体层。

    Method of producing electronic circuit and electronic circuit
    6.
    发明授权
    Method of producing electronic circuit and electronic circuit 有权
    电子电路和电子电路的制造方法

    公开(公告)号：US07067398B2

    公开(公告)日：2006-06-27

    申请号：US11103464

    申请日：2005-04-12

    申请人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

    发明人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

    IPC分类号： H01L21/283

    CPC分类号： H05K3/246 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/242 ,  H05K2201/0347 ,  H05K2203/0517 ,  Y10S438/951 ,  H01L2924/00

    摘要： According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin particles which consist of at least a thermoplastic resin and fine metal particles by electrophotography to form a first base pattern which consists of the first metal-containing resin particles and a second base pattern which consists of the second metal-containing resin particles on a substrate; forming a first metal conductor layer on the first and second base patterns; forming a second metal conductor layer on the first metal conductor layer by electrolytic plating by supplying electric current to the first metal conductor layer; and removing the second base pattern and the first and second metal conductor layers which are formed on the second base pattern.

    摘要翻译： 根据本发明的一个实施方案，电子电路的制造方法包括：将至少由热固性树脂和细金属颗粒构成的第一含金属树脂颗粒和由至少由热塑性塑料构成的第二含金属树脂颗粒 树脂和细金属颗粒，以形成由第一含金属的树脂颗粒和由基材上的第二含金属的树脂颗粒组成的第二基底图案的第一基底图案; 在所述第一和第二基底图案上形成第一金属导体层; 通过向第一金属导体层提供电流通过电解电镀在第一金属导体层上形成第二金属导体层; 以及去除形成在第二基底图案上的第二基底图案和第一和第二金属导体层。

    COMPOUNDS HAVING NPY Y5 RECEPTOR ANTAGONISTIC ACTIVITY
    8.
    发明申请
    COMPOUNDS HAVING NPY Y5 RECEPTOR ANTAGONISTIC ACTIVITY 失效
    具有NPY Y5受体拮抗活性的化合物

    公开(公告)号：US20120130070A1

    公开(公告)日：2012-05-24

    申请号：US13354881

    申请日：2012-01-20

    申请人： Masahiro SAKAGAMI ,  Hiroshi Hashizume ,  Satoru Tanaka

    发明人： Masahiro SAKAGAMI ,  Hiroshi Hashizume ,  Satoru Tanaka

    IPC分类号： C07D471/04

    CPC分类号： C07D231/12 ,  C07D231/14 ,  C07D233/64 ,  C07D249/08 ,  C07D401/04 ,  C07D401/14 ,  C07D403/04 ,  C07D407/04 ,  C07D413/04 ,  C07D417/04 ,  C07D471/04 ,  C07D487/04

    摘要： This invention provides a compound of the formula (I): a pharmaceutically acceptable salt or solvate thereof, wherein R1 is substituted or unsubstituted alkyl or the like, R2 is hydrogen or substituted or unsubstituted alkyl, Ring A is monocyclic or bicyclic aromatic heterocycle, R3 is substituted or unsubstituted aryl, substituted or unsubstituted heteroaryl or substituted or unsubstituted heterocycle, R4 is halogen, cyano, substituted or unsubstituted alkyl, substituted or unsubstituted cycloalkyl or the like, m is an integer between 0 and 2, n is an integer between 0 and 5, R is halogen, oxo, cyano, nitro, substituted or unsubstituted alkyl or the like, and p is an integer between 0 and 2 as novel compounds having NPY Y5 antagonistic activity.

    摘要翻译： 本发明提供式（I）化合物：其药学上可接受的盐或溶剂合物，其中R 1为取代或未取代的烷基等，R 2为氢或取代或未取代的烷基，环A为单环或双环芳族杂环，R 3 取代或未取代的芳基，取代或未取代的杂芳基或取代或未取代的杂环，R4为卤素，氰基，取代或未取代的烷基，取代或未取代的环烷基等，m为0至2之间的整数，n为0 和5，R是卤素，氧代，氰基，硝基，取代或未取代的烷基等，p是0和2之间的整数，作为具有NPY Y5拮抗活性的新化合物。