摘要:
Disclosed is a method and apparatus for inspecting defects of patterns of a sample at high speed and with high sensitivity while damage of the sample arising from high-power pulsed light is reduced. Light emitted from a pulsed laser light source is transmitted through a pseudo continuous-wave forming optical system having an optical system capable of reducing energy per pulse and yet maintaining the entire amount of light of the pulsed light, a beam formation optical system, and a coherence reduction optical system, and a beam deflected by a deformation illumination optical system is made to reflect on a PBS to be irradiated on a wafer. The apparatus is configured so that the diffracted light from the wafer is focused by an objective lens, transmitted through light modulation units, focused to form a plurality of images on a plurality of image sensors in a visual-field divided parallel detection unit 12, and then defects are detected by a signal processing unit.
摘要:
Disclosed is a method and apparatus for inspecting defects of patterns of a sample at high speed and with high sensitivity while damage of the sample arising from high-power pulsed light is reduced. Light emitted from a pulsed laser light source is transmitted through a pseudo continuous-wave forming optical system having an optical system capable of reducing energy per pulse and yet maintaining the entire amount of light of the pulsed light, a beam formation optical system, and a coherence reduction optical system, and a beam deflected by a deformation illumination optical system is made to reflect on a PBS to be irradiated on a wafer. The apparatus is configured so that the diffracted light from the wafer is focused by an objective lens, transmitted through light modulation units, focused to form a plurality of images on a plurality of image sensors in a visual-field divided parallel detection unit 12, and then defects are detected by a signal processing unit.
摘要:
A method of inspecting pattern defects can detect target defects in various processes stably by reducing erroneous detection of grains and morphology and decreasing the influence of an intensity nonuniformity in interference light. For this purpose, lights emitted from two sources of illumination capable of outputting a plurality of wavelengths are reflected by a beam splitter and irradiated onto a wafer. Diffracted light from the wafer is converged by an objective lens, is made to pass through light modulation units and imaged on an image sensor in a light detection unit. Then, defects are detected in a signal processing unit. Further, the optical modulation unit is made to have a structure that uses a plurality of optical components selectively and which can be optimized according to target defects.
摘要:
A method of inspecting pattern defects can detect target defects in various processes stably by reducing erroneous detection of grains and morphology and decreasing the influence of an intensity nonuniformity in interference light. For this purpose, lights emitted from two sources of illumination capable of outputting a plurality of wavelengths are reflected by a beam splitter and irradiated onto a wafer. Diffracted light from the wafer is converged by an objective lens, is made to pass through light modulation units and imaged on an image sensor in a light detection unit. Then, defects are detected in a signal processing unit. Further, the optical modulation unit is made to have a structure that uses a plurality of optical components selectively and which can be optimized according to target defects.
摘要:
This invention provides a defect inspection method and apparatus that can easily and quickly determine, from among a plurality of inspection conditions, a condition that allows for an inspection with high sensitivity. The inspection apparatus has a variety of optical functions to cover a variety of kinds of defects to be inspected (shape, material, nearby pattern, etc.). For each optical function, grayscale depths of defects that the operator wants detected and of pseudo defects that he or she wants undetected are accumulated for future use, so that conditions conducive to a higher sensitivity and a lower pseudo defect detection rate can be selected efficiently. Conditions that can be selected for optical systems include a bright-field illumination, a dark-field illumination and a bright-/dark-field composite illumination, illumination wavelength bands, polarization filters and spatial filters.
摘要:
This invention provides a defect inspection method and apparatus that can easily and quickly determine, from among a plurality of inspection conditions, a condition that allows for an inspection with high sensitivity. The inspection apparatus has a variety of optical functions to cover a variety of kinds of defects to be inspected (shape, material, nearby pattern, etc.). For each optical function, grayscale depths of defects that the operator wants detected and of pseudo defects that he or she wants undetected are accumulated for future use, so that conditions conducive to a higher sensitivity and a lower pseudo defect detection rate can be selected efficiently. Conditions that can be selected for optical systems include a bright-field illumination, a dark-field illumination and a bright-/dark-field composite illumination, illumination wavelength bands, polarization filters and spatial filters.
摘要:
The present invention relates to a pattern defect inspection apparatus, wherein light emitted from an illumination source capable of outputting a plurality of wavelengths is linearly illuminated by an illuminating optical system. Diffracted or scattered light due to a circuit pattern or defect on a wafer is collected by an imaging optical system onto a line sensor and converted into a digital signal, and the defect is detected by a signal processing section. Then, the defect can be detected with high sensitivity since a surface to be formed by an optical axis of the illuminating optical system and an optical axis of the imaging optical system is almost collimated to a direction of a wiring pattern and further since an angle to be formed by the optical axis of the imaging optical system and the wafer is set to an angle with less diffracted light from the pattern. Thereby, the pattern defect inspection detecting various defects on the wafer with high sensitivity at high speed can be achieved.
摘要:
A method of inspecting detects includes assigning a plurality of sets of image acquisition conditions, executing inspection using each of the sets of conditions, classifying all detected defects into real defects and false defects by use of an automatic defect classification function, and selecting, from the plurality of sets of conditions, a set of conditions ideal for detection.
摘要:
In order to detect defects without reducing the inspection speed, even when inspection is made by acquiring a high magnification image, defect inspection method is provided in which a surface of a sample is illuminated, via an illumination optical system, with light emitted by an illumination light source, an image of the sample illuminated with the light is picked up via a detection optical system, and the picked up image of the sample is compared with a previously stored image to detect defects. In illuminating the sample with the light, the area of the sample to be illuminated is varied according to an imaging magnification of the detection optical system.
摘要:
The pattern defect inspection apparatus and its method of the present invention comprises: a recipe setting unit for setting an inspection recipe and/or a review recipe; an illumination optical system including: a laser light source for emitting ultraviolet laser light; a quantity-of-light adjusting unit for adjusting a quantity of the ultraviolet laser light emitted from the laser light source; and an illumination range forming unit for forming on a sample an illumination range of the ultraviolet laser light; a coherence reducing system; and a detection optical system including: a condensing optical system; a diffracted-light control optical system; and a detecting unit.