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1.发明申请Method to Extract and Apply Circuit Features in Organic Substrate for Automation of Warp Modeling 失效在有机基板中提取和应用电路特征的方法，用于自动化变形建模公开(公告)号：US20090313588A1
公开(公告)日：2009-12-17
申请号：US12260957
申请日：2008-10-29
IPC分类号： G06F17/50
CPC分类号： H05K3/0005 , H05K1/0271 , H05K2201/09136
摘要： A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.
摘要翻译： 提供了表征包括多个电路层的有机衬底的方法包括以下步骤：接收有机衬底的图像，该图像包括衬底的电路层的几何描述; 至少部分地基于在衬底的图像中限定的电路结构的几何坐标将衬底分割成多个处理区域; 生成与所述基板的所述选择的一个所述处理区域对应的电路层图像; 识别电路层图像中的一个或多个几何特征; 估计电路层图像的至少一个热机械性质作为所识别的几何特征的函数; 重复接收图像的步骤，生成电路层图像，识别电路层图像中的一个或多个几何特征，以及估计电路层图像的至少一个热机械特性，直到已经处理了基板中的所有电路层; 以及根据所述多个电路层图像中的每一个的所述至少一个热机械特性，生成包括所述多个电路层图像的所述基板的所选择的一个处理区域的3-D表示。
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2.发明授权Method to extract and apply circuit features in organic substrate for automation of warp modeling 失效提取和应用电路特征的方法，用于有机衬底自动化的翘曲建模公开(公告)号：US08127255B2
公开(公告)日：2012-02-28
申请号：US12260957
申请日：2008-10-29
IPC分类号： G06F17/50
CPC分类号： H05K3/0005 , H05K1/0271 , H05K2201/09136
摘要： A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.
摘要翻译： 提供了表征包括多个电路层的有机衬底的方法包括以下步骤：接收有机衬底的图像，该图像包括衬底的电路层的几何描述; 至少部分地基于在衬底的图像中限定的电路结构的几何坐标将衬底分割成多个处理区域; 生成与所述基板的所述选择的一个所述处理区域对应的电路层图像; 识别电路层图像中的一个或多个几何特征; 估计电路层图像的至少一个热机械性质作为所识别的几何特征的函数; 重复接收图像的步骤，生成电路层图像，识别电路层图像中的一个或多个几何特征，以及估计电路层图像的至少一个热机械特性，直到已经处理了基板中的所有电路层; 以及根据所述多个电路层图像中的每一个的所述至少一个热机械特性，生成包括所述多个电路层图像的所述基板的所选择的一个处理区域的3-D表示。
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3.发明授权公开(公告)号：US06683745B1
公开(公告)日：2004-01-27
申请号：US09472175
申请日：1999-12-27
申请人： Sri M. Sri-Jayantha , Vijayeshwar Das Khanna , Gerard McVicker , Hien Dang , Arun Sharma , Kiyoshi Satoh , Tatsuo Nakamoto
发明人： Sri M. Sri-Jayantha , Vijayeshwar Das Khanna , Gerard McVicker , Hien Dang , Arun Sharma , Kiyoshi Satoh , Tatsuo Nakamoto
IPC分类号： G11B1700
CPC分类号： G11B33/08
摘要： A system for mounting a hard disk enclosure (HDE), includes a casing pivotably mounted to minimize at least one of settle-out dynamics, external rotational vibration, and emitted vibration, the casing allowing the HDE to rotate substantially freely, wherein the center of gravity of the HDE is substantially the same as a pivot point of the casing. Further, a computer chassis includes a housing, at least one disk drive assembly for being housed by the housing, and a plurality of theta-mounts integrally built within the housing.
摘要翻译： 一种用于安装硬盘盒（HDE）的系统，包括可枢转地安装的壳体，以最小化至少一个沉降动力学，外部旋转振动和发射的振动，所述壳体允许HDE基本上自由旋转，其中， HDE的重力基本上与壳体的枢转点相同。 此外，计算机机箱包括壳体，至少一个用于由壳体容纳的盘驱动组件以及一体地内置在壳体内的多个θ安装座。
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公开(公告)号：US06937432B2
公开(公告)日：2005-08-30
申请号：US10655061
申请日：2003-09-03
申请人： Sri M. Sri-Jayantha , Vijayeshwar Das Khanna , Gerard McVicker , Hien Dang , Arun Sharma , Kiyoshi Satoh , Tatsuo Nakamoto
发明人： Sri M. Sri-Jayantha , Vijayeshwar Das Khanna , Gerard McVicker , Hien Dang , Arun Sharma , Kiyoshi Satoh , Tatsuo Nakamoto
CPC分类号： G11B33/08
摘要： A system for mounting a hard disk enclosure (HDE), includes a casing pivotably mounted to minimize at least one of settle-out dynamics, external rotational vibration, and emitted vibration, the casing allowing the HDE to rotate substantially freely, wherein the center of gravity of the HDE is substantially the same as a pivot point of the casing. Further, a computer chassis includes a housing, at least one disk drive assembly for being housed by the housing, and a plurality of theta-mounts integrally built within the housing.
摘要翻译： 一种用于安装硬盘盒（HDE）的系统，包括可枢转地安装的壳体，以最小化至少一个沉降动力学，外部旋转振动和发射的振动，所述壳体允许HDE基本上自由旋转，其中， HDE的重力基本上与壳体的枢转点相同。 此外，计算机机箱包括壳体，至少一个用于由壳体容纳的盘驱动组件以及一体地内置在壳体内的多个θ安装座。
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公开(公告)号：US06876550B2
公开(公告)日：2005-04-05
申请号：US10318700
申请日：2002-12-13
IPC分类号： H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要： A cooling apparatus for cooling a heat source such as a microprocessor, comprising a mobile heat sink placed in close proximity to the heat source; and a thermal conductor for conducting heat generated by the heat source to the mobile heat sink.
摘要翻译： 一种用于冷却诸如微处理器的热源的冷却装置，包括放置在靠近热源的移动散热器; 以及用于将由热源产生的热量传导到移动散热器的热导体。
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6.发明申请HEAT TRANSFER APPARATUS CONTAINING A COMPLIANT FLUID FILM INTERFACE AND METHOD THEREFOR 审中-公开包含合适流体膜接口的热传递装置及其方法公开(公告)号：US20080158819A1
公开(公告)日：2008-07-03
申请号：US11619476
申请日：2007-01-03
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2924/10253 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/0401
摘要： A heat transfer device (and method therefore) for transferring heat from a heat source to a heat conductor, includes a fluid film operable as a compliant interface between the heat source and the heat conductor. The heat source includes a microelectronic device.
摘要翻译： 用于将热量从热源传递到热导体的传热装置（及其方法）包括可在热源和热导体之间作为柔性界面的流体膜。 热源包括微电子器件。
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公开(公告)号：US06963463B2
公开(公告)日：2005-11-08
申请号：US10153687
申请日：2002-05-24
CPC分类号： G11B5/596
摘要： A disk drive (HDD) subject to linear and rotational vibration, includes an independent sensing unit for sensing a rotational velocity component of the HDD rotational vibration in a predetermined frequency range.
摘要翻译： 经受线性和旋转振动的磁盘驱动器（HDD）包括用于感测预定频率范围内的HDD旋转振动的旋转速度分量的独立感测单元。
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8.发明授权公开(公告)号：US07382620B2
公开(公告)日：2008-06-03
申请号：US11249911
申请日：2005-10-13
CPC分类号： H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.
摘要翻译： 传热组件包括支撑包括一个或多个半导体芯片的电子部件组件的印刷电路板组件。 散热器组件适于与一个或多个半导体芯片热接合。 包括用于将一个或多个半导体芯片加载以与散热器组件接合的装载组件。 提供了一种封装机构，其包含足够量的导热介质以在半导体芯片和散热器组件中的一个或多个的表面之间传递热量，其中导热介质填充一个或多个半导体芯片之间的任何间隙或空间 半导体芯片和散热器组件。
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9.发明授权Deformable ring clamping device for warp-free disk stack assembly in a data storage disk drive 失效可变形的环形夹紧装置，用于数据存储磁盘驱动器中的无翘曲磁盘堆栈组装公开(公告)号：US06788494B2
公开(公告)日：2004-09-07
申请号：US10154344
申请日：2002-05-23
IPC分类号： G11B1708
CPC分类号： G11B17/038
摘要： A magnetic disk drive is provided with clamping rings that whenever nested will form an annular chamber to accommodate a toroidal ring which is deformable. As the clamping rings are progressively forcefully engaged by the clamping rings, the chamber is reduced in height and transmits the force of the top clamping ring to the bottom clamping ring in a uniform distribution and prevents the force of the bottom clamping ring from having non-uniformity of distribution. This action prevents magnetically recordable disks of the disk drive from being subjected to point loading and consequential warping. The uniform distribution exerted on glass disks also prevents cracking or shattering of the glass disk and prevents warping of non-glass disks.
摘要翻译： 磁盘驱动器设置有夹紧环，每当嵌套将形成环形室以容纳可变形的环形环。 当夹紧环逐渐被夹紧环逐渐地接合时，腔室的高度减小并且以均匀的分布将顶部夹紧环的力传递到底部夹紧环，并且防止底部夹紧环的力不受其限制， 分布均匀。 此操作可防止磁盘驱动器的磁性可记录磁盘受到点加载和后果翘曲。 施加在玻璃盘上的均匀分布也可防止玻璃盘的破裂或破裂，并防止非玻璃盘翘曲。
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公开(公告)号：US5963392A
公开(公告)日：1999-10-05
申请号：US869562
申请日：1997-06-05
CPC分类号： G11B19/04 , G11B5/54 , G11B5/82 , G11B5/5582
摘要： A data storage device 12 includes a disk 14 having a surface zone 14a for storing data, and an access head 18 mounted on a slider 20 for writing data to and reading data from the data zone. The head 18 flies across the data zone 14a to access selected data tracks during spinning of the disk. And, the slider 20 seeks a predetermined shock buffer zone 30 atop the spinning disk, where critical data is not stored, during an idle mode for confining thereto any shock induced contact between the slider and disk surface.
摘要翻译： 数据存储装置12包括具有用于存储数据的表面区域14a的盘14和安装在滑块20上用于将数据写入数据区并从数据区读取数据的存取头18。 头部18飞过数据区域14a，以便在旋转盘片期间访问所选数据轨道。 并且，在空闲模式期间，滑块20寻找在旋转盘上的临时数据未被存储的预定冲击缓冲区30，以限制滑块和盘表面之间的任何冲击感应接触。
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