Radio apparatus
    9.
    发明申请
    Radio apparatus 审中-公开
    无线电设备

    公开(公告)号:US20060262931A1

    公开(公告)日:2006-11-23

    申请号:US10569352

    申请日:2003-10-29

    申请人: Hirofumi Nakano

    发明人: Hirofumi Nakano

    IPC分类号: H04K1/00

    摘要: A radio apparatus encrypts transmission information to be radio-transmitted at a radio station or decrypts transmission information received through a radio transmission path. The radio apparatus securely encrypts, for transmission, information containing information to be encrypted. Thus, the radio apparatus includes an encryption object identifying unit which identifies from transmission information a portion whose contents and/or attributes that satisfy predetermined conditions, and a transmitting unit which encrypts the identified portion of the transmission information or information containing the identified portion and which radio-transmits the encryption result.

    摘要翻译: 无线装置对通过无线电台进行无线发送的发送信息进行加密,对通过无线传输路径接收的发送信息进行解密。 无线电设备安全地加密用于传输的包含要加密的信息的信息。 因此,无线电设备包括:加密对象识别单元,其从传输信息识别满足预定条件的内容和/或属性的部分;以及发送单元,其对发送信息的识别部分或包含所识别部分的信息进行加密,以及哪个 无线电传输加密结果。

    Method for manufacturing semiconductor device and semiconductor device
    10.
    发明授权
    Method for manufacturing semiconductor device and semiconductor device 失效
    半导体器件和半导体器件的制造方法

    公开(公告)号:US06335265B1

    公开(公告)日:2002-01-01

    申请号:US09447289

    申请日:1999-11-23

    IPC分类号: H01L2178

    摘要: A semiconductor device has a plated heat sink layer on the back surface, preventing a short-circuit between a bonding wire and a first metal layer. A method of making a semiconductor device includes forming a catalyst layer on a bottom of a first separation groove in the front surface of a semiconductor substrate, forming a first metal layer selectively in the first separation groove by electroless plating, using the catalyst layer as a catalyst.

    摘要翻译: 半导体器件在背面具有电镀散热层,防止接合线和第一金属层之间的短路。 制造半导体器件的方法包括在半导体衬底的前表面的第一分离槽的底部形成催化剂层,通过无电解电镀在第一分离槽中选择性地形成第一金属层,使用催化剂层作为 催化剂。