PLASMA PROCESSING METHOD
    2.
    发明申请
    PLASMA PROCESSING METHOD 审中-公开
    等离子体处理方法

    公开(公告)号:US20080260966A1

    公开(公告)日:2008-10-23

    申请号:US11738507

    申请日:2007-04-22

    IPC分类号: H05H1/24

    CPC分类号: H01J37/3266 H01J37/32623

    摘要: Embodiments of the present invention relate to plasma processing apparatus and methods of use thereof. In some embodiments, a method of controlling a plasma in a process chamber includes providing a chamber for processing a substrate and having a processing volume defined therein wherein a plasma is to be formed during operation, the chamber further having a plasma control magnet assembly comprising a plurality of magnets that provide a magnetic field having a magnitude is greater than about 10 Gauss in an upper region of the processing volume and less than about 10 Gauss in a lower region of the processing volume proximate a substrate to be processed; supplying a process gas to the chamber; and forming a plasma in the processing volume from the process gas.

    摘要翻译: 本发明的实施例涉及等离子体处理装置及其使用方法。 在一些实施例中,控制处理室中的等离子体的方法包括提供用于处理衬底并具有其中限定的处理体积的室,其中在操作期间将形成等离子体,所述室还具有等离子体控制磁体组件,其包括 提供具有幅度的磁场的多个磁体在处理体积的上部区域中大于约10个高斯,并且在处理体积的接近待处理衬底的较低区域中小于约10个高斯; 向所述室供应处理气体; 以及从所述处理气体在所述处理容积中形成等离子体。