公开(公告)号：US06876091B2

公开(公告)日：2005-04-05

申请号：US10024581

申请日：2001-12-21

申请人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Obayashi ,  Hisahito Kashima

发明人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Obayashi ,  Hisahito Kashima

IPC分类号： H05K3/28 ,  H01L23/498 ,  H05K1/18 ,  H05K3/46 ,  H01L23/29

CPC分类号： H01L23/49822 ,  H01L23/49894 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4602 ,  Y10T428/24802 ,  Y10T428/24926 ,  H01L2224/05599

摘要： The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, which prevents random reflection of light, and which reduces non-uniformity in color of the resin during curing thereof. The present invention includes a wiring board in which electronic components are embedded by use of an embedding resin having a dielectric constant of less than or equal to about 5 and tan δ of less than or equal to about 0.08. The embedding resin preferably contains carbon black in an amount of less than or equal to about 1.4 mass %. Moreover, the embedding resin preferably contains at least a thermosetting resin and at least one inorganic filler.

摘要翻译： 本发明提供了一种布线基板，其中电子部件通过嵌入树脂嵌入，该嵌入树脂在布线板中的电子部件的高安装密度，其表现出优异的电性能如绝缘性能，防止光的随机反射 并且其在固化期间降低树脂的颜色不均匀。 本发明包括一种布线板，其中使用具有小于或等于约5的介电常数和小于或等于约0.08的tanδ的嵌入树脂来嵌入电子部件。 嵌入树脂优选含有小于或等于约1.4质量％的量的炭黑。 此外，嵌入树脂优选至少含有热固性树脂和至少一种无机填料。

公开(公告)号：US06512182B2

公开(公告)日：2003-01-28

申请号：US10086428

申请日：2002-03-04

申请人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Obayashi

发明人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Obayashi

IPC分类号： H05K103

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/49822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T428/24917 ,  Y10T428/249996 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the wiring layer. This interface has a roughness in a range of 2-6 &mgr;m in terms of ten-point mean roughness.

公开(公告)号：US06586827B2

公开(公告)日：2003-07-01

申请号：US10026928

申请日：2001-12-27

申请人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Obayashi ,  Hisahito Kashima

发明人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Obayashi ,  Hisahito Kashima

IPC分类号： H01L2322

CPC分类号： H05K1/185 ,  B32B15/08 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/0231 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2224/05599

摘要： A wiring board includes a substrate having an opening, and an electronic part placed in the opening, wherein a space left in the opening is filled with an embedding resin having a base color tone selected from black, blue, green, red, orange, yellow, and violet.

公开(公告)号：US06740411B2

公开(公告)日：2004-05-25

申请号：US10042317

申请日：2002-01-11

申请人： Toshifumi Kojima ,  Hiroki Takeuchi ,  Kazushige Obayashi

发明人： Toshifumi Kojima ,  Hiroki Takeuchi ,  Kazushige Obayashi

IPC分类号： B32B2738

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31529 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.

摘要翻译： 用于将电子部件嵌入布线基板中的嵌入树脂包括可溶性树脂和可溶性有机填料中的至少一种作为可溶性成分，以与氧化剂一起溶解。

公开(公告)号：US06680123B2

公开(公告)日：2004-01-20

申请号：US10024601

申请日：2001-12-21

申请人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Obayashi ,  Hisahito Kashima

发明人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Obayashi ,  Hisahito Kashima

IPC分类号： B32B2738

CPC分类号： H01L21/568 ,  C08K3/04 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31529 ,  H01L2924/00 ,  H01L2224/05599

摘要： An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan &dgr; of about 0.08 or less.

摘要翻译： 嵌入树脂将电子部件嵌入物体中，并且具有约5以下的介电常数和约0.08以下的tanδ。

公开(公告)号：US06770965B2

公开(公告)日：2004-08-03

申请号：US10026454

申请日：2001-12-27

申请人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Ohbayashi ,  Hisahito Kashima

发明人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Ohbayashi ,  Hisahito Kashima

IPC分类号： H05K346

CPC分类号： H01L21/568 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/0231 ,  H05K1/185 ,  Y10T428/24917 ,  H01L2924/00

摘要： A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.

摘要翻译： 布线基板包括（1）具有开口的绝缘基板或芯基板和堆积层，其中芯基板和堆积层中的至少一个具有开口，（2）至少一个电子部件 （3）包含热塑性树脂，酸酐固化剂，固化促进剂和填料的嵌入树脂，其中嵌入树脂在剪切速率下显示不高于85Pa.s的粘度 在25℃±1℃下静置24小时后为8.4s -1。

公开(公告)号：US06822170B2

公开(公告)日：2004-11-23

申请号：US10025764

申请日：2001-12-26

申请人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Ohbayashi ,  Hisahito Kashima

发明人： Hiroki Takeuchi ,  Toshifumi Kojima ,  Kazushige Ohbayashi ,  Hisahito Kashima

IPC分类号： H05K100

CPC分类号： H01L21/568 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/564 ,  H01L23/642 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4602 ,  Y10S428/901 ,  Y10T428/31678 ,  Y10T428/31714 ,  H01L2924/00 ,  H01L2224/05599

摘要： In an embedding resin for embedding electronic parts, after a substrate in which a copper layer is formed on a cured product of the embedding resin is subjected to a pressure cooker test, the copper layer has a peeling strength of at least 588 N/m (0.6 kg/cm), wherein the conditions of the pressure cooker test are 121° C., 100% by mass humidity, 2.1 atm and 168 hours, and the measurement method of the peeling strength is according to JIS C 5012, and the width of the copper layer is 10 mm.

摘要翻译： 在用于嵌入电子部件的嵌入树脂中，在对嵌入树脂的固化物形成了铜层的基板进行压力锅试验后，铜层的剥离强度为588N / m（ 0.6kg / cm 2），其中压力锅试验条件为121℃，100质量％湿度，2.1atm和168小时，剥离强度的测定方法为JIS C 5012，宽度 的铜层为10mm。

公开(公告)号：US09417178B2

公开(公告)日：2016-08-16

申请号：US13993172

申请日：2011-12-13

申请人： Shun Momose ,  Hiroki Takeuchi

发明人： Shun Momose ,  Hiroki Takeuchi

IPC分类号： G01N21/01 ,  B01L3/00 ,  G01N33/487 ,  G01N35/00

CPC分类号： G01N21/01 ,  B01L3/502753 ,  B01L2200/0605 ,  B01L2200/0621 ,  B01L2300/0816 ,  B01L2400/0409 ,  B01L2400/0457 ,  G01N33/487 ,  G01N2035/00158

摘要： A microchip including a fluid circuit therein and a specimen inlet for introducing a specimen containing a first component and a second component different in specific gravity from each other into the fluid circuit is provided, in which the fluid circuit includes a specimen measurement unit connected to the specimen inlet and having a prescribed volume for measuring the specimen introduced through the specimen inlet and a separation unit which is a site connected to the specimen measurement unit and having a capacity capable of storing the total amount of the measured specimen, for storing the total amount of the measured specimen and separating the first component and the second component in the stored specimen from each other.

公开(公告)号：US08390183B2

公开(公告)日：2013-03-05

申请号：US12598482

申请日：2009-03-26

申请人： Hirokazu Kurono ,  Toshitaka Honda ,  Hiroki Takeuchi ,  Takeshi Mitsuoka ,  Kuniharu Tanaka ,  Kazunari Miyata ,  Katsuya Takaoka

发明人： Hirokazu Kurono ,  Toshitaka Honda ,  Hiroki Takeuchi ,  Takeshi Mitsuoka ,  Kuniharu Tanaka ,  Kazunari Miyata ,  Katsuya Takaoka

IPC分类号： H01T21/02

CPC分类号： H01T13/38 ,  C04B35/111 ,  C04B35/6261 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3222 ,  C04B2235/3224 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3418 ,  C04B2235/5436 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/96 ,  H01T21/02

摘要： This invention has an object to provide a spark plug exhibiting high withstand voltage characteristics and high strength at high temperature, formed by an alumina-based sintered body prepared with excellent processability and high productivity, and a method for manufacturing the spark plug. This invention relates to a spark plug 1 including an insulator 3, wherein the insulator 3 includes a dense alumina-based sintered body having an average crystal particle diameter of 1.50 μm or more, and the alumina-based sintered body contains Si, a Group 2 element component containing Ba and a Group 2 element other than those, and a rare earth element component, such that a ratio of a content S of the Si component to a total content of the content S and a content A of the Group 2 element component is 0.60 or more, and a method for manufacturing the spark plug 1 prepared through a grinding-shaping process in which the insulator 3 is ground before burning to shape the same.

摘要翻译： 本发明的目的是提供一种具有高耐压特性和高温强度的火花塞，由具有优异的加工性和高生产率制备的氧化铝基烧结体形成，以及一种用于制造火花塞的方法。 本发明涉及一种包括绝缘体3的火花塞1，其中绝缘体3包括平均结晶粒径为1.50μm以上的致密的氧化铝基烧结体，氧化铝基烧结体包含Si，第2组 含有Ba的元素成分和除此以外的第2族元素的元素成分和稀土元素成分，使得Si成分的含量S与含量S的总含量的比率和第2族元素成分的含量A 为0.60以上，以及通过研磨成形工序制造火花塞1的方法，其中绝缘体3在燃烧之前被磨削成形。

公开(公告)号：US08141616B2

公开(公告)日：2012-03-27

申请号：US12946368

申请日：2010-11-15

申请人： Katsumi Iwasa ,  Yuji Tai ,  Takahiro Tsunemi ,  Hiroki Takeuchi

发明人： Katsumi Iwasa ,  Yuji Tai ,  Takahiro Tsunemi ,  Hiroki Takeuchi

IPC分类号： B22D41/04

CPC分类号： B22D23/006 ,  B22D35/04

摘要： A gravity casting method includes: situating a molding die having a feeder portion in communication with a cavity above the cavity to a horizontal state and pouring a molten metal from a runner in communication with the cavity; putting the molding die to a state inclined at a predetermined angle during pouring of the molten metal from a stage where the molten metal is filled in the runner and prevailing the molten metal while pouring to the inside of the cavity and the feeder portion; and returning the molding die to the horizontal state after the molten metal has been poured completely, and solidifying the molten metal.

摘要翻译： 重力铸造方法包括：将具有馈送部分的模具定位成与空腔上方的空腔连通到水平状态，并将来自与空腔连通的流道的熔融金属倾倒; 在将熔融金属从熔融金属填充在浇道中的阶段浇注期间浇注成型模具到倾斜预定角度的状态，同时浇注到空腔和进料器部分的内部; 并且在熔融金属完全浇注之后将成型模具返回到水平状态，并使熔融金属固化。