公开(公告)号：US06603527B1

公开(公告)日：2003-08-05

申请号：US09707820

申请日：2000-11-08

申请人： Hiroko Hayata ,  Mitsuru Goto ,  Hideaki Abe ,  Satoshi Namiki

发明人： Hiroko Hayata ,  Mitsuru Goto ,  Hideaki Abe ,  Satoshi Namiki

IPC分类号： G02F11336

CPC分类号： G02F1/13452

摘要： A liquid crystal display device is provided with a driver circuit which can cope with an increase in the number of pixels per device. The liquid crystal display device has signal lines for driving individual pixels and a driver circuit connected to the signal lines, on a liquid-crystal-side surface of either one of substrates disposed to oppose each other with a liquid crystal interposed therebetween. The driver circuit includes a film substrate, interconnection layers formed on a surface of the film substrate, and a semiconductor chip mounted on the film substrate, and bumps are formed on the semiconductor chip inwardly of the periphery thereof. Some of the interconnection layers are connected to the bumps of the semiconductor chip, and then run under the semiconductor chip and extend to the periphery of the film substrate.

摘要翻译： 液晶显示装置设置有可以应付每个装置的像素数量增加的驱动电路。 液晶显示装置具有用于驱动各个像素的信号线和连接到信号线的驱动电路，在布置成彼此相对的任一个基板的液晶侧表面之间插入液晶。 驱动器电路包括薄膜基板，形成在薄膜基板的表面上的互连层和安装在薄膜基板上的半导体芯片，并且在半导体芯片的周围向内形成凸块。 一些互连层连接到半导体芯片的凸块，然后在半导体芯片下方延伸到薄膜基板的周边。

公开(公告)号：US07679189B2

公开(公告)日：2010-03-16

申请号：US11600091

申请日：2006-11-16

申请人： Hideaki Abe ,  Makoto Sato ,  Mitsuru Goto

发明人： Hideaki Abe ,  Makoto Sato ,  Mitsuru Goto

IPC分类号： H01L23/48

CPC分类号： H01L24/12 ,  G02F1/13452 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/17 ,  H01L24/29 ,  H01L24/83 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/1147 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81136 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00

摘要： A display device includes a drive circuit chip, and a substrate on which the drive circuit chip is mounted. The drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer. The first bump is superposed with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view. The second bump is superposed with the second conductive layer, and a profile of the second pump in plan view is beyond a profile of the second conductive layer in plan view.

摘要翻译： 显示装置包括驱动电路芯片和安装驱动电路芯片的基板。 驱动电路芯片包括半导体衬底和绝缘层之间的半导体衬底，绝缘层，第一导电层和由金属形成的第二导电层，以及形成在绝缘层上的第一凸起和第二凸起。 第一凸起与第一导电层重叠，并且平面图中的第一凸块的轮廓在平面图中位于第一导电层的轮廓内。 第二凸起与第二导电层重叠，并且平面图中的第二泵的轮廓在平面图中超过第二导电层的轮廓。

公开(公告)号：US20050242436A1

公开(公告)日：2005-11-03

申请号：US11103493

申请日：2005-04-12

申请人： Hideaki Abe ,  Makoto Sato ,  Mitsuru Goto

发明人： Hideaki Abe ,  Makoto Sato ,  Mitsuru Goto

IPC分类号： H01L21/60 ,  G02F1/13 ,  G02F1/133 ,  G09F9/00 ,  G09G3/36 ,  H01L21/44 ,  H01L23/48 ,  H01L23/485 ,  H01L23/544

CPC分类号： H01L24/12 ,  G02F1/13452 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/17 ,  H01L24/29 ,  H01L24/83 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/1147 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81136 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00

摘要： The present invention enhances the mounting accuracy of a drive circuit chip on a substrate thus realizing a display of high quality. Bumps (for example, gold bumps) on the drive circuit chip are used for alignment. Here, to enhance the recognition property of the alignment bumps, a plane shape of a conductive layer which is formed between a semiconductor substrate (Si substrate) of the drive circuit chip and the alignment bump is set to be included within a profile of a plane shape of the alignment bump. That is, by preventing the conductive layer from being observed in a periphery of the alignment bump, it is possible to prevent a photographed pattern of the bump taken by a camera or the like from be influenced by the conductive layer.

摘要翻译： 本发明提高了驱动电路芯片在基板上的安装精度，从而实现了高质量的显示。 驱动电路芯片上的碰撞（例如，金凸块）用于对准。 这里，为了提高取向凸块的识别特性，形成在驱动电路芯片的半导体基板（Si基板）和对准凸块之间的导电层的平面形状被设置为包括在平面的轮廓内 对准凸块的形状。 也就是说，通过防止在对准突起的周围观察导电层，可以防止由照相机等拍摄的凸块的拍摄图案受到导电层的影响。

公开(公告)号：US07141877B2

公开(公告)日：2006-11-28

申请号：US11103493

申请日：2005-04-12

申请人： Hideaki Abe ,  Makoto Sato ,  Mitsuru Goto

发明人： Hideaki Abe ,  Makoto Sato ,  Mitsuru Goto

IPC分类号： H01L23/48 ,  G02F1/1345

CPC分类号： H01L24/12 ,  G02F1/13452 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/17 ,  H01L24/29 ,  H01L24/83 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/1147 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81136 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00

摘要： The present invention enhances the mounting accuracy of a drive circuit chip on a substrate thus realizing a display of high quality. Bumps (for example, gold bumps) on the drive circuit chip are used for alignment. Here, to enhance the recognition property of the alignment bumps, a plane shape of a conductive layer which is formed between a semiconductor substrate (Si substrate) of the drive circuit chip and the alignment bump is set to be included within a profile of a plane shape of the alignment bump. That is, by preventing the conductive layer from being observed in a periphery of the alignment bump, it is possible to prevent a photographed pattern of the bump taken by a camera or the like from be influenced by the conductive layer.

摘要翻译： 本发明提高了驱动电路芯片在基板上的安装精度，从而实现了高质量的显示。 驱动电路芯片上的碰撞（例如，金凸块）用于对准。 这里，为了提高取向凸块的识别特性，形成在驱动电路芯片的半导体基板（Si基板）和对准凸块之间的导电层的平面形状被设置为包括在平面的轮廓内 对准凸块的形状。 也就是说，通过防止在对准突起的周围观察导电层，可以防止由照相机等拍摄的凸块的拍摄图案受到导电层的影响。

公开(公告)号：US07948080B2

公开(公告)日：2011-05-24

申请号：US12502379

申请日：2009-07-14

申请人： Hideaki Abe ,  Makoto Sato ,  Mitsuru Goto

发明人： Hideaki Abe ,  Makoto Sato ,  Mitsuru Goto

IPC分类号： H01L23/48

CPC分类号： H01L24/12 ,  G02F1/13452 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/17 ,  H01L24/29 ,  H01L24/83 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/1147 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81136 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00

摘要： A display device includes a drive circuit chip, and a substrate on which the drive circuit chip is mounted. The drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer. The first bump is superposed with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view. The second bump is superposed with the second conductive layer, and a profile of the second pump in plan view is beyond a profile of the second conductive layer in plan view.

摘要翻译： 显示装置包括驱动电路芯片和安装驱动电路芯片的基板。 驱动电路芯片包括半导体衬底和绝缘层之间的半导体衬底，绝缘层，第一导电层和由金属形成的第二导电层，以及形成在绝缘层上的第一凸起和第二凸起。 第一凸起与第一导电层重叠，并且平面图中的第一凸块的轮廓在平面图中位于第一导电层的轮廓内。 第二凸起与第二导电层重叠，并且平面图中的第二泵的轮廓在平面图中超过第二导电层的轮廓。

公开(公告)号：US20070063346A1

公开(公告)日：2007-03-22

申请号：US11600091

申请日：2006-11-16

申请人： Hideaki Abe ,  Makoto Sato ,  Mitsuru Goto

发明人： Hideaki Abe ,  Makoto Sato ,  Mitsuru Goto

IPC分类号： H01L23/48

CPC分类号： H01L24/12 ,  G02F1/13452 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/17 ,  H01L24/29 ,  H01L24/83 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/1147 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81136 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00

摘要： A display device includes a drive circuit chip, and a substrate on which the drive circuit chip is mounted. The drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer. The first bump is superposed with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view. The second bump is superposed with the second conductive layer, and a profile of the second pump in plan view is beyond a profile of the second conductive layer in plan view.

摘要翻译： 显示装置包括驱动电路芯片和安装驱动电路芯片的基板。 驱动电路芯片包括半导体衬底和绝缘层之间的半导体衬底，绝缘层，第一导电层和由金属形成的第二导电层，以及形成在绝缘层上的第一凸起和第二凸起。 第一凸起与第一导电层重叠，并且平面图中的第一凸块的轮廓在平面图中位于第一导电层的轮廓内。 第二凸起与第二导电层重叠，并且平面图中的第二泵的轮廓在平面图中超过第二导电层的轮廓。

公开(公告)号：US09001054B2

公开(公告)日：2015-04-07

申请号：US13280420

申请日：2011-10-25

申请人： Hideaki Abe ,  Setsuo Kobayashi ,  Hironobu Abe

发明人： Hideaki Abe ,  Setsuo Kobayashi ,  Hironobu Abe

IPC分类号： G06F3/041 ,  H05K1/02 ,  G02F1/1333 ,  H05K1/14 ,  G02F1/1345 ,  H05K3/36

CPC分类号： H05K1/028 ,  G02F1/133308 ,  G02F1/13338 ,  G02F1/13452 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/053

摘要： A liquid crystal display device having a liquid crystal panel LCP and a touch panel TP provided on the front surface of the liquid crystal panel is characterized in that wires connected to the liquid crystal panel and wires connected to the touch panel are included in one flexible printed circuit FPC, which is first connected (FOG1) to the liquid crystal panel (specifically, a TFT substrate (TFTS)) and then connected (FOG2) to the touch panel.

摘要翻译： 具有设置在液晶面板的前表面上的液晶面板LCP和触摸面板TP的液晶显示装置的特征在于，连接到液晶面板的电线和连接到触摸面板的电线被包括在一个柔性印刷 将电路FPC（FOG1）首先连接到液晶面板（具体而言是TFT基板（TFTS）），然后连接（FOG2）到触摸面板。

公开(公告)号：US08378741B2

公开(公告)日：2013-02-19

申请号：US13200856

申请日：2011-10-04

申请人： Tadashi Hoshi ,  Kenji Hirose ,  Hideaki Abe ,  Junichi Nishimoto ,  Midori Nagayama

发明人： Tadashi Hoshi ,  Kenji Hirose ,  Hideaki Abe ,  Junichi Nishimoto ,  Midori Nagayama

IPC分类号： G11C5/14

CPC分类号： G06F1/3287 ,  G06F1/32 ,  G06F1/3203 ,  H01L2924/0002 ,  Y02D10/171 ,  Y02D50/20 ,  H01L2924/00

摘要： A mobile telephone is provided that includes a plurality of circuit blocks and adapted to cut off the supply of power source voltage to any one of the circuit blocks. The mobile telephone also includes an interblock interface circuit provided on a signal path between an elected circuit block and a branch point at which the signal path branches into different branch paths so as to connect to other circuit blocks. The interblock interface circuit includes a signal gate for preventing signal transmission from the elected circuit block to the other circuit blocks, and includes a storage unit for storing a signal right before the power cut-off.

摘要翻译： 提供一种移动电话，其包括多个电路块，并且适于切断对任何一个电路块的电源电压的供应。 移动电话还包括设置在选通的电路块和信号路径分支到不同分支路径的分支点之间的信号路径上的块间接口电路，以便连接到其他电路块。 所述帧间接口电路包括用于防止从所选择的电路块到其他电路块的信号传输的信号门，并且包括用于在电源切断之前存储信号的存储单元。

公开(公告)号：US08319709B2

公开(公告)日：2012-11-27

申请号：US12622457

申请日：2009-11-20

申请人： Hiroshi Ito ,  Kazunori Ojima ,  Hideaki Abe ,  Shinji Tanabe ,  Masayuki Yanagihara

发明人： Hiroshi Ito ,  Kazunori Ojima ,  Hideaki Abe ,  Shinji Tanabe ,  Masayuki Yanagihara

IPC分类号： G09G3/30

CPC分类号： G06F3/0416 ,  G06F3/044

摘要： A display device of the invention includes a display panel attached to one face side of a light transmissive circuit board and a light transmissive substrate attached to the other face side of the circuit board. A mounted component is mounted on the other face side of the circuit board. The circuit board includes a light transmissive junction layer for joining the circuit board to the light transmissive substrate at a position avoiding the mounted component. The junction layer includes a core substrate formed of a resin, an adhesive layer formed on one face of the core substrate, and a bonding layer formed on the other face of the core substrate and cured. The adhesive layer is adhered to the circuit board, and the bonding layer is firmly fixed to the light transmissive substrate.

摘要翻译： 本发明的显示装置包括：安装在透光电路基板的一个面侧的显示面板和安装在电路基板的另一个面侧的透光基板。 安装的部件安装在电路板的另一面上。 电路板包括用于在避开安装部件的位置处将电路板接合到透光基板的透光结层。 接合层包括由树脂形成的芯基板，形成在芯基板的一个面上的粘合层和形成在芯基板的另一个表面上并固化的接合层。 粘合剂层粘合到电路板上，并且粘合层牢固地固定在透光基板上。

公开(公告)号：US07649715B2

公开(公告)日：2010-01-19

申请号：US11553892

申请日：2006-10-27

申请人： Ooki Yamaguchi ,  Takao Haino ,  Hideaki Abe

发明人： Ooki Yamaguchi ,  Takao Haino ,  Hideaki Abe

IPC分类号： G11B5/58

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H05K1/056 ,  H05K1/189 ,  H05K3/326 ,  H05K3/3494 ,  H05K2201/091 ,  H05K2201/10727 ,  H05K2203/107 ,  Y02P70/613

摘要： A magnetic head assembly is provided. The magnetic head assembly includes a slider in which a head element is mounted. A flexure supports the slider. The flexure includes a pair of outriggers, a connection portion, and a tongue portion. A flexible wiring substrate is fixedly bonded to the surface of the flexure. An electrode pad of the slider and an electrode pad of the flexible wiring substrate are bonded to each other by solder. A plurality of solder bonded portions are arranged on the connection portion. A deformable portion is formed in the pair of outriggers and located on an extended line on which the solder bonded portions are arranged, so that the free end side of the flexure is deformable.

摘要翻译： 提供磁头组件。 磁头组件包括其中安装有头元件的滑块。 挠性件支撑滑块。 挠曲件包括一对外伸支架，连接部分和舌部。 柔性布线基板固定地粘合到挠曲件的表面上。 滑块的电极焊盘和柔性布线基板的电极焊盘通过焊料彼此接合。 多个焊接接合部分布置在连接部分上。 可变形部分形成在该对外伸支架中并且位于其上布置焊料接合部分的延伸线上，使得挠曲件的自由端侧可变形。