公开(公告)号：US20080225496A1

公开(公告)日：2008-09-18

申请号：US12073930

申请日：2008-03-12

申请人： Hiromitsu Fujiya ,  Hideki Kimura ,  Eiji Makabe

发明人： Hiromitsu Fujiya ,  Hideki Kimura ,  Eiji Makabe

IPC分类号： H05K7/16

CPC分类号： H05K7/20736

摘要： A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.

摘要翻译： 第一印刷布线板在垂直方向上延伸的第一导管内沿垂直方向延伸。 第一轴流风扇产生吸收第一印刷线路板的热量的气流。 第二和第三导管与第一导管平行延伸。 第四管道在第二和第三管道之间延伸。 第二印刷线路板在第四导管内沿水平方向延伸。 第二轴流风扇连接到第三管道。 第二轴流风扇产生吸收第二印刷线路板的热量的气流。 电子设备的尺寸可以减小。

公开(公告)号：US07365976B2

公开(公告)日：2008-04-29

申请号：US11387762

申请日：2006-03-24

申请人： Hiromitsu Fujiya ,  Hideki Kimura ,  Eiji Makabe

发明人： Hiromitsu Fujiya ,  Hideki Kimura ,  Eiji Makabe

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.

公开(公告)号：US20070223199A1

公开(公告)日：2007-09-27

申请号：US11387762

申请日：2006-03-24

申请人： Hiromitsu Fujiya ,  Hideki Kimura ,  Eiji Makabe

发明人： Hiromitsu Fujiya ,  Hideki Kimura ,  Eiji Makabe

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.

摘要翻译： 第一印刷布线板在垂直方向上延伸的第一导管内沿垂直方向延伸。 第一轴流风扇产生吸收第一印刷线路板的热量的气流。 第二和第三导管与第一导管平行延伸。 第四管道在第二和第三管道之间延伸。 第二印刷线路板在第四导管内沿水平方向延伸。 第二轴流风扇连接到第三管道。 第二轴流风扇产生吸收第二印刷线路板的热量的气流。 电子设备的尺寸可以减小。

公开(公告)号：US07733648B2

公开(公告)日：2010-06-08

申请号：US12073930

申请日：2008-03-12

申请人： Hiromitsu Fujiya ,  Hideki Kimura ,  Eiji Makabe

发明人： Hiromitsu Fujiya ,  Hideki Kimura ,  Eiji Makabe

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.

摘要翻译： 第一印刷布线板在垂直方向上延伸的第一导管内沿垂直方向延伸。 第一轴流风扇产生吸收第一印刷线路板的热量的气流。 第二和第三导管与第一导管平行延伸。 第四管道在第二和第三管道之间延伸。 第二印刷线路板在第四导管内沿水平方向延伸。 第二轴流风扇连接到第三管道。 第二轴流风扇产生吸收第二印刷线路板的热量的气流。 电子设备的尺寸可以减小。

公开(公告)号：US07319596B2

公开(公告)日：2008-01-15

申请号：US11387765

申请日：2006-03-24

申请人： Hiromitsu Fujiya ,  Eiji Makabe

发明人： Hiromitsu Fujiya ,  Eiji Makabe

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： A second duct is designed to oppose its air outlet to a portion of an air inlet of a first duct in an electronic apparatus. The wall member closes the air inlet of the first duct at a position outside the air outlet of the second duct. An opening is defined in the wall member. The opening enables a connection between the outer space of the second duct and the air inlet of the first duct. Airflow enters the air inlet of the first duct from the air outlet of the second duct as well as from the opening of the wall member, respectively.

摘要翻译： 第二导管被设计成将其空气出口与电子设备中的第一管道的空气入口的一部分相对。 壁构件在第二管道的出气口外侧的位置关闭第一管道的空气入口。 在壁构件中限定开口。 该开口能够连接第二管道的外部空间和第一管道的空气入口。 气流分别从第二管道的出气口和壁构件的开口进入第一管道的空气入口。

公开(公告)号：US20070223201A1

公开(公告)日：2007-09-27

申请号：US11387765

申请日：2006-03-24

申请人： Hiromitsu Fujiya ,  Eiji Makabe

发明人： Hiromitsu Fujiya ,  Eiji Makabe

IPC分类号： H05K7/16

CPC分类号： H05K7/20736

摘要： A second duct is designed to oppose its air outlet to a portion of an air inlet of a first duct in an electronic apparatus. The wall member closes the air inlet of the first duct at a position outside the air outlet of the second duct. An opening is defined in the wall member. The opening enables a connection between the outer space of the second duct and the air inlet of the first duct. Airflow enters the air inlet of the first duct from the air outlet of the second duct as well as from the opening of the wall member, respectively.

摘要翻译： 第二导管被设计成将其空气出口与电子设备中的第一管道的空气入口的一部分相对。 壁构件在第二管道的出气口外侧的位置关闭第一管道的空气入口。 在壁构件中限定开口。 该开口能够连接第二管道的外部空间和第一管道的空气入口。 气流分别从第二管道的出气口和壁构件的开口进入第一管道的空气入口。

公开(公告)号：US20070223191A1

公开(公告)日：2007-09-27

申请号：US11387768

申请日：2006-03-24

申请人： Hiromitsu Fujiya ,  Hideki Kimura

发明人： Hiromitsu Fujiya ,  Hideki Kimura

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： Air in the first section is allowed to run into a second section through first and second air vents in an electronic apparatus. This causes an increase in the amount of airflow in the first section. In particular, if the pressure loss is larger in the first section, airflow blocked in the first section is forced to run into the second section. A smooth airflow can be established in the first section. Moreover, if the pressure in the first section is set larger than the pressure in the second section, a smoother airflow is established from the first section to the second section. A further superior airflow can be established in the first section.

摘要翻译： 允许第一部分中的空气通过电子设备中的第一和第二通风口进入第二部分。 这导致第一部分中的气流量的增加。 特别地，如果第一部分的压力损失较大，则在第一部分中阻塞的气流被迫流入第二部分。 在第一部分可以建立平稳的气流。 此外，如果第一部分中的压力设定为大于第二部分中的压力，则从第一部分到第二部分建立更平滑的气流。 在第一部分可以建立更好的气流。

公开(公告)号：US20080278910A1

公开(公告)日：2008-11-13

申请号：US12153583

申请日：2008-05-21

申请人： Hiromitsu Fujiya ,  Hideki Kimura

发明人： Hiromitsu Fujiya ,  Hideki Kimura

IPC分类号： H05K7/20

CPC分类号： H05K7/20727 ,  H01L2924/0002 ,  H01L2924/00

摘要： Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.

摘要翻译： 气流通过电子部件单元中的空气入口引入外壳。 空气流向第一电子部件。 气流吸收来自第一电子部件的热量。 因此，第一电子部件被充分冷却。 第二电子部件安装在印刷电路板上，位于远离第一电子部件的位置的空气入口的位置。 在外壳中形成进气口。 进气口限定在至少在第一和第二电子部件之间的与印刷线路板相对的外壳的一部分处。 通过进气口向第二电子部件引入气流。 因此，第二电子开口被充分冷却。 以这种方式，第一和第二电子部件被最大限度地冷却。

公开(公告)号：US07365977B2

公开(公告)日：2008-04-29

申请号：US11387768

申请日：2006-03-24

申请人： Hiromitsu Fujiya ,  Hideki Kimura

发明人： Hiromitsu Fujiya ,  Hideki Kimura

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： Air in the first section is allowed to run into a second section through first and second air vents in an electronic apparatus. This causes an increase in the amount of airflow in the first section. In particular, if the pressure loss is larger in the first section, airflow blocked in the first section is forced to run into the second section. A smooth airflow can be established in the first section. Moreover, if the pressure in the first section is set larger than the pressure in the second section, a smoother airflow is established from the first section to the second section. A further superior airflow can be established in the first section.

摘要翻译： 允许第一部分中的空气通过电子设备中的第一和第二通风口进入第二部分。 这导致第一部分中的气流量的增加。 特别地，如果第一部分的压力损失较大，则在第一部分中阻塞的气流被迫流入第二部分。 在第一部分可以建立平稳的气流。 此外，如果第一部分中的压力设定为大于第二部分中的压力，则从第一部分到第二部分建立更平滑的气流。 在第一部分可以建立更好的气流。

公开(公告)号：US20070223200A1

公开(公告)日：2007-09-27

申请号：US11387761

申请日：2006-03-24

申请人： Hiromitsu Fujiya ,  Hideki Kimura

发明人： Hiromitsu Fujiya ,  Hideki Kimura

IPC分类号： H05K7/16

CPC分类号： H05K7/20727 ,  H01L2924/0002 ,  H01L2924/00

摘要： Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.

摘要翻译： 气流通过电子部件单元中的空气入口引入外壳。 空气流向第一电子部件。 气流吸收来自第一电子部件的热量。 因此，第一电子部件被充分冷却。 第二电子部件安装在印刷电路板上，位于远离第一电子部件的位置的空气入口的位置。 在外壳中形成进气口。 进气口限定在至少在第一和第二电子部件之间的与印刷线路板相对的外壳的一部分处。 通过进气口向第二电子部件引入气流。 因此，第二电子开口被充分冷却。 以这种方式，第一和第二电子部件被最大限度地冷却。