摘要:
A piezoelectric film is provided having good piezoelectric properties. The piezoelectric film is represented by the following general formula: A1−bB1−aXaO3 wherein A contains Pb; B is at least one of Zr and Ti; X is at least one of V, Nb, Ta, Cr, Mo and W; a satisfies 0.05≦a≦0.3; and b satisfies 0.025≦b≦0.15.
摘要翻译:提供具有良好的压电性能的压电膜。 压电膜由以下通式表示:A 1-b B 1-a X a O 3 3 / >其中A含有Pb; B是Zr和Ti中的至少一种; X是V,Nb,Ta,Cr,Mo和W中的至少一种; a满足0.05 <= a <= 0.3; 并且b满足0.025≤b≤0.15。
摘要:
A piezoelectric film is provided having good piezoelectric properties. The piezoelectric film is represented by the following general formula: A1-bB1-aXaO3 wherein A contains Pb; B is at least one of Zr and Ti; X is at least one of V, Nb, Ta, Cr, Mo and W; a satisfies 0.05≦a≦0.3; and b satisfies 0.025≦b≦0.15.
摘要翻译:提供具有良好的压电性能的压电膜。 压电膜由以下通式表示:A 1-b B 1-a X a O 3 3 / >其中A含有Pb; B是Zr和Ti中的至少一种; X是V,Nb,Ta,Cr,Mo和W中的至少一种; a满足0.05 <= a <= 0.3; 并且b满足0.025≤b≤0.15。
摘要:
A ferroelectric film is provided that is expressed by a general formula of A1-bB1-aXaO3, wherein: A includes Pb; B is composed of at least one of Zr and Ti; X is composed of at least one of V, Nb, Ta, Cr, Mo and W; a is in a range of 0.05≦a≦0.3; and b is in a range of 0.025≦b≦0.15.
摘要翻译:提供一种铁电薄膜,其由下列通式表示:A 1-b B 1-a X a O 3 O 3, / SUB>,其中:A包括Pb; B由Zr和Ti中的至少一种构成; X由V,Nb,Ta,Cr,Mo和W中的至少一种构成; a在0.05 <= a <= 0.3的范围内; b在0.025≤b≤0.15的范围内。
摘要:
A ferroelectric film wherein 5 to 40 mol % in total of at least one of Nb, V, and W is included in the B site of a Pb(Zr,Ti)O3 ferroelectric which includes at least four-fold coordinated Si4+ or Ge4+ in the A site ion of a ferroelectric perovskite material in an amount of 1% or more. This enables to significantly improve reliability of the ferroelectric film.
摘要:
A ferroelectric film wherein 5 to 40 mol % in total of at least one of Nb, V, and W is included in the B site of a Pb(Zr,Ti)O3 ferroelectric which includes at least four-fold coordinated Si4+ or Ge4+ in the A site ion of a ferroelectric perovskite material in an amount of 1% or more. This enables to significantly improve reliability of the ferroelectric film.
摘要:
A ferroelectric memory device includes a simple matrix type memory cell array. Provided that the maximum absolute value of a voltage applied between a first signal electrode and a second signal electrode is Vs, polarization P of a ferroelectric capacitor formed of the first signal electrode, the second signal electrode, and ferroelectric layer is within the range of 0.1P(+Vs) P(+⅓Vs) when the applied voltage is changed from −Vs to +⅓Vs.
摘要:
A ferroelectric memory device includes a simple matrix type memory cell array. Provided that the maximum absolute value of a voltage applied between a first signal electrode and a second signal electrode is Vs, polarization P of a ferroelectric capacitor formed of the first electrode, the second electrode, and ferroelectric layer is within the range of 0.1P(+Vs) P(+1/3Vs) when the applied voltage is changed from −Vs to +1/3Vs.
摘要:
The present invention relates to a ferroelectric memory having a matrix-type memory cell array which has a superior degree of integration, in which the angularity of the ferroelectric layer's hysteresis curve is improved, the production yield is increased and costs are reduced.A ferroelectric memory having improved angularity in the hysteresis curve, and superior memory characteristics, production yield and costs is realized as follows. Namely, a peripheral circuit chip and a memory cell array chip are engaged onto an inexpensive assembly base 300 such as glass or plastic. In memory cell array chip 200, a ferroelectric layer is made to undergo epitaxial growth on to a Si single crystal via a buffer layer and first signal electrode. As a result, a ferroelectric memory can be realized which has improved angularity in the hysteresis curve and superior memory characteristics, production yield, and cost.
摘要:
The present invention relates to a ferroelectric memory having a matrix-type memory cell array which has an excellent degree of integration, in which the angularity of the ferroelectric layer's hysteresis curve is improved. A ferroelectric memory having both integration and memory characteristics in which the angularity of the ferroelectric layer's hysteresis curve is improved is realized as follows. Namely, a structure is employed in which the memory cell array and the peripheral circuit are in a plane separated from one another, and the ferroelectric layer is made to undergo epitaxial growth on to a Si single crystal via a buffer and the first signal electrodes.
摘要:
A method of manufacturing a ceramic includes forming a film which includes a complex oxide material having an oxygen octahedral structure and a paraelectric material having a catalytic effect for the complex oxide material in a mixed state, and performing a heat treatment to the film, wherein the paraelectric material is one of a layered catalytic substance which includes Si in the constituent elements and a layered catalytic substance which includes Si and Ge in the constituent elements. The heat treatment includes sintering and post-annealing. At least the post-annealing is performed in a pressurized atmosphere including at least one of oxygen and ozone. A ceramic is a complex oxide having an oxygen octahedral structure, and has Si and Ge in the oxygen octahedral structure.