摘要:
A bio electron microscope and an observation method which can observe a bio specimen by low damage and high contrast to perform high-accuracy image analysis, and conduct high-throughput specimen preparation. 1) A specimen is observed at an accelerating voltage 1.2 to 4.2 times a critical electron accelerating voltage possible to transmit a specimen obtained under predetermined conditions. 2) An electron energy filter of small and simplified construction is provided between the specimen and an electron detector for imaging by the electron beam in a specified energy region of the electron beams transmitting the specimen. 3) Similarity between an observed image such as virus or protein in the specimen and a reference image such as known virus or protein is subjected to quantitative analysis by image processing. 4) A preparation protocol of the bio specimen is made into a chip using an MEMS technique, which is then mounted on a specimen stage part of an electron microscope to conduct specimen introduction, preparation and transfer onto a specimen holder.
摘要:
It is possible to reliably and efficiently determine whether a specimen contains viruses, bacteria, etc. and, if it does, identify their types, regardless of the observer. Furthermore, even a newly-discovered bacterium can be quickly identified by utilizing a database at a remote location. A transmission microscope system has a microscope for observing a specimen and a database which stores, for each microscopic thing (such as a virus), a name, a specimen pretreatment method and an imaging condition used when the microscopic thing is observed, captured image data, etc. An image of the specimen is captured according to a specimen pretreatment method and an imaging condition retrieved from the database using the name of a target microscopic thing as a key, and the captured image is compared with images stored in the database to identify microscopic things present in the specimen.
摘要:
It is possible to reliably and efficiently determine whether a specimen contains viruses, bacteria, etc. and, if it does, identify their types, regardless of the observer. Furthermore, even a newly-discovered bacterium can be quickly identified by utilizing a database at a remote location. A transmission microscope system has a microscope for observing a specimen and a database which stores, for each microscopic thing (such as a virus), a name, a specimen pretreatment method and an imaging condition used when the microscopic thing is observed, captured image data, etc. An image of the specimen is captured according to a specimen pretreatment method and an imaging condition retrieved from the database using the name of a target microscopic thing as a key, and the captured image is compared with images stored in the database to identify microscopic things present in the specimen.
摘要:
A technique for calculating the angle from an auxiliary dot sequence indicating the track of a pattern and for performing pattern measurement is provided, thereby enabling achievement of high-accuracy pattern measurement with reduced influence of the roughness of pattern edges.
摘要:
An end mill body wiih a corner cutting edge forming a convex arc shape of which the rotation locus becomes convex toward the tip outer peripheral side is formed at a side ridge portion of the corner cutting edge rake face, a gash is formed on the inner peripheral side of the corner cutting edge rake face, and an end cutting edge connected to the corner cutting edge and extending toward the inner peripheral side is formed at a tip-side side ridge portion of the end cutting edge rake face. An intersection line between the corner cutting edge rake face and the end cutting edge rake face is located closer to the radial inner peripheral side with respect to the axis than the center of the convex arc that the corner cutting edge forms in the rotation locus.
摘要:
A technique for calculating the angle from an auxiliary dot sequence indicating the track of a pattern and for performing pattern measurement is provided, thereby enabling achievement of high-accuracy pattern measurement with reduced influence of the roughness of pattern edges.
摘要:
A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.
摘要:
An inspection method, including: illuminating a light on a wafer on which plural chips having identical patterns are formed; imaging corresponding areas of two chips formed on the wafer to obtain inspection images and reference images with an image sensor; and processing the obtained inspection image and the reference image to produce a difference image which indicates a difference between the inspection image and the reference image and detect a defect by comparing the difference image with a threshold, wherein a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging peripheral portion of the wafer is different from a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging central portion of the wafer.
摘要:
The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.
摘要:
With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects.