Semiconductor light emitting device
    4.
    发明授权
    Semiconductor light emitting device 失效
    半导体发光器件

    公开(公告)号:US08368089B2

    公开(公告)日:2013-02-05

    申请号:US12885777

    申请日:2010-09-20

    IPC分类号: H01L29/18 H01L33/00

    摘要: According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a transparent layer, and a fluorescent material layer. The transparent layer is provided on the first major surface of the semiconductor layer. The transparent layer is transparent with respect to light emitted by the light emitting layer and has a trench provided outside the outer circumference of the light emitting layer. The fluorescent material layer is provided in the trench and on the transparent layer. The fluorescent material layer includes a first fluorescent material particle provided in the trench and a second fluorescent material particle provided on the transparent layer. A particle size of the first fluorescent material particle is smaller than a width of the trench. A particle size of the second fluorescent material particle is larger than the width of the trench and larger than the particle size of the first fluorescent material particle.

    摘要翻译: 根据一个实施例,半导体发光器件包括半导体层,第一电极,第二电极,透明层和荧光材料层。 透明层设置在半导体层的第一主表面上。 透明层相对于由发光层发射的光是透明的,并且具有设置在发光层的外周外的沟槽。 荧光材料层设置在沟槽和透明层上。 荧光材料层包括设置在沟槽中的第一荧光材料颗粒和设置在透明层上的第二荧光材料颗粒。 第一荧光体粒子的粒径小于沟槽的宽度。 第二荧光体粒子的粒径大于沟槽的宽度,大于第一荧光体粒子的粒径。

    SEMICONDUCTOR LIGHT EMITTING DEVICE
    6.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE 失效
    半导体发光器件

    公开(公告)号:US20110297969A1

    公开(公告)日:2011-12-08

    申请号:US12885777

    申请日:2010-09-20

    IPC分类号: H01L33/08 H01L33/26

    摘要: According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a transparent layer, and a fluorescent material layer. The transparent layer is provided on the first major surface of the semiconductor layer. The transparent layer is transparent with respect to light emitted by the light emitting layer and has a trench provided outside the outer circumference of the light emitting layer. The fluorescent material layer is provided in the trench and on the transparent layer. The fluorescent material layer includes a first fluorescent material particle provided in the trench and a second fluorescent material particle provided on the transparent layer. A particle size of the first fluorescent material particle is smaller than a width of the trench. A particle size of the second fluorescent material particle is larger than the width of the trench and larger than the particle size of the first fluorescent material particle.

    摘要翻译: 根据一个实施例,半导体发光器件包括半导体层,第一电极,第二电极,透明层和荧光材料层。 透明层设置在半导体层的第一主表面上。 透明层相对于由发光层发射的光是透明的,并且具有设置在发光层的外周外的沟槽。 荧光材料层设置在沟槽和透明层上。 荧光材料层包括设置在沟槽中的第一荧光材料颗粒和设置在透明层上的第二荧光材料颗粒。 第一荧光体粒子的粒径小于沟槽的宽度。 第二荧光体粒子的粒径大于沟槽的宽度,大于第一荧光体粒子的粒径。

    Substrate processing system and substrate processing program
    8.
    发明授权
    Substrate processing system and substrate processing program 有权
    基板加工系统和基板加工程序

    公开(公告)号:US09303976B2

    公开(公告)日:2016-04-05

    申请号:US13456458

    申请日:2012-04-26

    摘要: According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.

    摘要翻译: 根据一个实施例,基板处理系统包括测量单元,数据处理单元和处理单元。 测量单元被配置为测量与衬底的厚度尺寸有关的信息。 基板包括发光单元和波长转换单元。 波长转换单元包括荧光体。 数据处理单元被配置为基于与基板的厚度尺寸相关的测量信息,并且基于与从发光单元发射的光的特性相关的信息来确定与波长转换单元的厚度方向有关的处理信息。 处理单元被配置为基于所确定的处理信息来执行波长转换单元的处理。

    SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING PROGRAM
    9.
    发明申请
    SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING PROGRAM 有权
    基板处理系统和基板处理程序

    公开(公告)号:US20120277896A1

    公开(公告)日:2012-11-01

    申请号:US13456458

    申请日:2012-04-26

    IPC分类号: G06F19/00 G06F15/00 G01B11/06

    摘要: According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.

    摘要翻译: 根据一个实施例,基板处理系统包括测量单元,数据处理单元和处理单元。 测量单元被配置为测量与衬底的厚度尺寸有关的信息。 基板包括发光单元和波长转换单元。 波长转换单元包括荧光体。 数据处理单元被配置为基于与基板的厚度尺寸相关的测量信息,并且基于与从发光单元发射的光的特性相关的信息来确定与波长转换单元的厚度方向有关的处理信息。 处理单元被配置为基于所确定的处理信息来执行波长转换单元的处理。