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    Circuit devices and fabrication Method of the same
    1.
    发明授权
    Circuit devices and fabrication Method of the same 失效
    电路器件及其制造方法相同

    公开(公告)号：US5822850A

    公开(公告)日：1998-10-20

    申请号：US577324

    申请日：1995-12-22

    申请人： Hiroshi Odaira ,  Eiji Imamura ,  Yusuke Wada ,  Yasushi Arai ,  Kenji Sasaoka ,  Takahiro Mori ,  Fumitoshi Ikegaya ,  Sadao Kowatari

    发明人： Hiroshi Odaira ,  Eiji Imamura ,  Yusuke Wada ,  Yasushi Arai ,  Kenji Sasaoka ,  Takahiro Mori ,  Fumitoshi Ikegaya ,  Sadao Kowatari

    IPC分类号： H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H05K3/02

    CPC分类号： H05K3/4647 ,  H05K3/4069 ,  H05K3/4614 ,  H05K1/095 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/1189 ,  H05K3/4652 ,  Y10T29/31 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/5153 ,  Y10T29/5171

    摘要： A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet. Moreover, the conductive bumps can be properly electrically connected to an opposed conductive layer. Thus, the circuit component provides high reliability and contributes to high yield and fabrication efficiency.

    摘要翻译： 在第二合成树脂片上的第二合成树脂片的树脂成分塑性变形或其温度超过玻璃化转变温度的条件下，将叠置在规定位置上的导电性凸起的支撑部件或第一合成树脂片叠置在第二合成树脂片上， 导电凸块被穿入第二合成树脂片。 换句话说，导电凸块被垂直地刺入第二合成树脂片中，以形成暴露于第一（支撑基底）和第二合成树脂片的通孔型导电部分。 贯通型导电引线部分用于电气连接电气设备和电路，并连接布线图案层。 导电凸块可以通过印刷方法或电镀方式精确且密集地形成和布置。 可以将导电凸块推入并穿入第二合成树脂片。 此外，导电凸块可以适当地电连接到相对的导电层。 因此，电路组件提供高可靠性并且有助于高产量和制造效率。

    Circuit devices and fabrication method of the same
    2.
    发明授权
    Circuit devices and fabrication method of the same 失效
    电路器件及其制造方法相同

    公开(公告)号：US5600103A

    公开(公告)日：1997-02-04

    申请号：US204994

    申请日：1994-03-02

    申请人： Hiroshi Odaira ,  Eiji Imamura ,  Yusuke Wada ,  Yasushi Arai ,  Kenji Sasaoka ,  Takahiro Mori ,  Fumitoshi Ikegaya ,  Sadao Kowatari

    发明人： Hiroshi Odaira ,  Eiji Imamura ,  Yusuke Wada ,  Yasushi Arai ,  Kenji Sasaoka ,  Takahiro Mori ,  Fumitoshi Ikegaya ,  Sadao Kowatari

    IPC分类号： H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H05K1/00

    CPC分类号： H05K3/4647 ,  H05K3/4069 ,  H05K3/4614 ,  H05K1/095 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/1189 ,  H05K3/4652 ,  Y10T29/31 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/5153 ,  Y10T29/5171

    摘要： A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet. Moreover, the conductive bumps can be properly electrically Connected to an opposed conductive layer. Thus, the circuit component provides high reliability and contributes to high yield and fabrication efficiency.

    摘要翻译： 在第二合成树脂片上的第二合成树脂片的树脂成分塑性变形或其温度超过玻璃化转变温度的条件下，将叠置在规定位置上的导电性凸起的支撑部件或第一合成树脂片叠置在第二合成树脂片上， 导电凸块被穿入第二合成树脂片。 换句话说，导电凸块被垂直地刺入第二合成树脂片中，以形成暴露于第一（支撑基底）和第二合成树脂片的通孔型导电部分。 贯通型导电引线部分用于电气连接电气设备和电路，并连接布线图案层。 导电凸块可以通过印刷方法或电镀方式精确且密集地形成和布置。 可以将导电凸块推入并穿入第二合成树脂片。 此外，导电凸块可以适当地电连接到相对的导电层。 因此，电路组件提供高可靠性并且有助于高产量和制造效率。