-
1.发明授权Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition 失效使用该组合物制造的马来酰亚胺树脂组合物和树脂封装的半导体器件
公开(公告)号：US5272377A
公开(公告)日：1993-12-21
申请号：US785812
申请日：1991-10-31
IPC分类号： C08L61/06 , C08K5/14 , C08K5/5313 , C08L35/00 , C08L61/04 , C08L79/08 , H01B3/30 , H01L23/29 , H01L23/31 , H01L23/28
CPC分类号： H01L23/293 , C08K5/14 , C08K5/5313 , C08L79/085 , H01B3/306 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/1433
摘要： The device characteristics is in containing a maleimide resin with a content of 0.2 weight percent of less of an organic acid, a phenolic resin, and a combination of a basic catalyst and a peroxide as a curing catalyst. In addition, additives as a mold release agent such as a polyethylene wax and an inorganic filler are contained. The maleimide resin composition is prepared in such a manner that a part of the phenolic resin is preblended with the curing catalyst in advance of other components, while the remainder of the phenolic resin is added to the maleimide resin to prepolymerize, and then, the preblend and the prepolyer are blended the other components. The maleimide resin composition has excellent moldability by improvement of curing characteristics through combined use of a basic catalyst and a peroxide as a curing agent. Besides, a resin encapsulated semiconductor device manufactured by encapsulating a semiconductor element with the resin composition has excellent heat resistance and moisture-resistance reliability.
摘要翻译： 该装置的特征在于含有0.2重量％以下的有机酸，酚醛树脂，碱性催化剂和过氧化物的组合的马来酰亚胺树脂作为固化催化剂。 此外，含有作为脱模剂的添加剂如聚乙烯蜡和无机填料。 马来酰亚胺树脂组合物的制备方法是将一部分酚醛树脂与其它组分预先与固化催化剂预混合，同时将剩余的酚醛树脂加入到马来酰亚胺树脂中进行预聚合，然后将预混物 并将预分散器与其它组分混合。 马来酰亚胺树脂组合物通过组合使用碱性催化剂和作为固化剂的过氧化物来改善固化特性，具有优异的成型性。 此外，通过用树脂组合物封装半导体元件制造的树脂封装的半导体器件具有优异的耐热性和耐湿可靠性。
-
公开(公告)号：US5258426A
公开(公告)日：1993-11-02
申请号：US484676
申请日：1990-02-20
CPC分类号： H01L23/293 , H01L23/295 , H01L2924/0002 , Y10T428/31511 , Y10T428/31721
摘要： A semiconductor device encapsulant contains (a) a thermosetting resin for providing a cured product having a glass transition temperature of not less than 190.degree. C., (b) a filler consisting of a fused silica, (c) a modifier consisting of an MBS or ABS, (d) a modifier consisting of a silicone rubber or a silicone gel, and (e) a lubricant containing a metal chelate compound.
-
公开(公告)号：US4719255A
公开(公告)日：1988-01-12
申请号：US760770
申请日：1985-07-31
摘要： An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:(a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule;(b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%;(c) 1.2 to 40 parts by weight of a polyvinyl acetal compound;(d) 0.8 to 30 parts by weight of a silicone oil; and(e) 4 to 80 parts by weight of a rubber-modified phenolic resin.The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.
摘要翻译： 用于半导体器件封装的环氧树脂组合物包括如下所示的组分（a），（b），（c）和组分（d）和（e）中的至少一种：（a）100重量份的 一个分子中具有至少2个环氧基团的环氧树脂; （b）8〜65重量份邻位比小于50％的酚醛清漆型酚醛树脂; （c）1.2〜40重量份的聚乙烯醇缩醛化合物; （d）0.8〜30重量份的硅油; 和（e）4至80重量份的橡胶改性酚醛树脂。 所述用于半导体器件封装的环氧树脂组合物可以在固化产物中保持其高的玻璃化转变温度，并且还具有低的弹性模量以及优异的耐湿性和耐热冲击性。
-
公开(公告)号：US5637667A
公开(公告)日：1997-06-10
申请号：US451065
申请日：1995-05-25
申请人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
发明人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
CPC分类号： C08L63/00 , C08G77/60 , C08L101/00 , C08L79/085 , C08L83/16
摘要： A thermosetting resin composition, containing (A) a thermosetting resin; (B) a curing agent for the thermosetting resin; (C) a polysilane copolymer; and (D) an inorganic filler; wherein the polyailane copolymer (C) is added in amount of about 0.1 to 10% by weight based on the total amount of the resin composition.
摘要翻译： 一种热固性树脂组合物，其含有（A）热固性树脂; （B）热固性树脂用固化剂; （C）聚硅烷共聚物; 和（D）无机填料; 其中所述聚烯烃共聚物（C）的添加量相对于树脂组合物的总量为约0.1〜10重量％。
-
公开(公告)号：US5438113A
公开(公告)日：1995-08-01
申请号：US40267
申请日：1993-03-30
申请人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
发明人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
CPC分类号： C08L63/00 , C08G77/60 , C08L101/00 , C08L79/085 , C08L83/16
摘要： A thermosetting resin composition containing a silane compound a) having at least one phenolic hydroxyl group, and an organic compound b) having at least two functional groups capable of reaction with the phenolic hydroxyl group of the silane compound, wherein the silane compound a) is added in an amount of more than 10 parts by weight relative to 100 parts by weight of the organic compound b).
摘要翻译： 含有具有至少一个酚羟基的硅烷化合物a）和具有至少两个能够与硅烷化合物的酚羟基反应的官能团的有机化合物b）的热固性树脂组合物，其中硅烷化合物a）为 相对于100重量份的有机化合物b），加入量大于10重量份。
-
公开(公告)号：US5346743A
公开(公告)日：1994-09-13
申请号：US28696
申请日：1993-03-08
申请人： Ken Uchida , Michiya Higashi , Shinetsu Fujieda
发明人： Ken Uchida , Michiya Higashi , Shinetsu Fujieda
CPC分类号： H01L23/293 , C08G59/3218 , C08G59/686 , C08L63/00 , H01B3/40 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/1433 , H01L2924/181 , Y10T428/239
摘要： According to a first embodiment of the present invention, there is provided a resin encapsulation type semiconductor device, comprising a semiconductor element and an epoxy resin composition used as an encapsulating resin, the composition containing as essential components:(a) an epoxy resin represented by formula (I) given below: ##STR1## where R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are hydrogen or an alkyl group respectively, and n.gtoreq.0,(b) a phenolic resin curing agent,(c) an imidazole compound, and(d) triphenyl phosphate.In the first embodiment of the present invention, a heat resistance skeletal structure is formed by the epoxy resin (a) and the phenolic resin curing agent (b) in the epoxy resin composition after cured, leading to an improved resistance to heat and to an improved package crack resistance. Further, the combination of the imidazole compound (c) used as a curing catalyst and triphenyl phosphate (d) permits ensuring a high reliability in terms of the humidity resistance and also permits improving the resistance to the external contamination.
摘要翻译： 根据本发明的第一实施例，提供一种树脂封装型半导体器件，其包含半导体元件和用作封装树脂的环氧树脂组合物，该组合物含有作为必要成分的组合物：（a）由 式（I）：其中R1，R2，R3和R4分别是氢或烷基，n≥0，（b）酚醛树脂固化剂，（c） 咪唑化合物和（d）磷酸三苯酯。 在本发明的第一实施方案中，环氧树脂组合物中的环氧树脂（a）和酚醛树脂固化剂（b）在固化后形成耐热骨架结构，导致耐热性提高 提高包装抗裂性。 此外，用作固化催化剂的咪唑化合物（c）和磷酸三苯酯（d）的组合可以确保在耐湿性方面的高可靠性，并且还可以改善对外部污染的抵抗力。
-
公开(公告)号：US5223739A
公开(公告)日：1993-06-29
申请号：US581700
申请日：1990-09-13
CPC分类号： H01L23/564 , H01L21/565 , H01L23/16 , H01L2224/48091 , H01L2224/48247
摘要： A plastic molded semiconductor device having a semiconductor chip mounted on a die pad supported by hanging pins. The semiconductor chip is encapsulated by mold plastic where the semiconductor chip has a lead portion protruding to a side, and in which practically the entire periphery of the semiconductor chip is covered by aluminum or some other moistureproof material that stops the entry of moisture.
摘要翻译： 一种塑料模制半导体器件，其具有安装在由悬挂销支撑的裸片上的半导体芯片。 半导体芯片由模具塑料封装，其中半导体芯片具有向一侧突出的引线部分，并且实际上半导体芯片的整个周边被铝或其它防止水分进入的其它防潮材料覆盖。
-
公开(公告)号：US5252639A
公开(公告)日：1993-10-12
申请号：US796896
申请日：1991-11-25
CPC分类号： H01L23/293 , C08K5/00 , C08K5/0091 , H01L2924/0002
摘要： The molding resin composition of this invention comprises a resin contained a releasing a agents formulated with a release agent and a metal chelate compound.This resin composition is improved an good adhesivity, high moisture resistivity and a good moldability.
摘要翻译： 本发明的成型树脂组合物包含含有脱模剂和金属螯合物配制的试剂的树脂。 该树脂组合物具有良好的粘合性，高的耐湿性和良好的成型性。
-
公开(公告)号：US5641997A
公开(公告)日：1997-06-24
申请号：US305478
申请日：1994-09-13
申请人： Hideo Ohta , Tetsuo Okuyama , Shinetsu Fujieda , Sadao Kajiura , Akira Yoshizumi
发明人： Hideo Ohta , Tetsuo Okuyama , Shinetsu Fujieda , Sadao Kajiura , Akira Yoshizumi
IPC分类号： C08L63/00 , H01L21/56 , H01L23/29 , H01L23/433
CPC分类号： C08L63/00 , H01L21/56 , H01L23/293 , H01L23/295 , H01L23/4334 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01077 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/1815
摘要： A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.
摘要翻译： 半导体芯片位于封装片之间。 封装片各自具有高粘合性的表面和较少粘合剂的表面。 高度粘合的封装片的表面接触芯片。 粘合剂较少的表面与模具接触。 随后，通过模塑进行包封。 可以在不降低脱模性的情况下改善耐焊接性。
-
10.发明授权Rubber-modified phenolic resin composition and method of manufacturing the same 失效橡胶改性酚醛树脂组合物及其制造方法
公开(公告)号：US5216077A
公开(公告)日：1993-06-01
申请号：US874226
申请日：1992-04-27
申请人： Akira Yoshizumi , Shinetsu Fujieda , Ken Uchida , Naoko Kihara , Kazuhiro Sawai , Tsutomu Nagata , Shinji Murakami , Shigeyuki Kouchiyama
发明人： Akira Yoshizumi , Shinetsu Fujieda , Ken Uchida , Naoko Kihara , Kazuhiro Sawai , Tsutomu Nagata , Shinji Murakami , Shigeyuki Kouchiyama
摘要： A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.
摘要翻译： 橡胶改性酚醛树脂组合物含有酚醛清漆型酚醛树脂，其中至少一种选自ABS树脂和MBS树脂的改性剂均匀分散。 该组合物具有良好的抗冲击性和耐热冲击性。 通过将上述至少一种改性剂加入到其软化点或更高温度下被加热和熔化的酚醛清漆型酚醛树脂来制备组合物，使得改性剂均匀分散在树脂中。 树脂组合物适合用作环氧树脂密封剂用于密封电子器件的固化剂。
-
-
-
-
-
-
-
-
-
搜索结果
58 条记录 (耗时 0.024 秒)