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公开(公告)号：US20100018630A1
公开(公告)日：2010-01-28
申请号：US12461388
申请日：2009-08-11
IPC分类号： B28B3/00
CPC分类号： H05K3/281 , H01L2924/0002 , H05K1/0206 , H05K1/0269 , H05K1/0306 , H05K3/4007 , H05K3/4611 , H05K3/4629 , H05K2201/0367 , H05K2201/096 , H05K2201/09781 , H05K2201/09881 , H05K2203/1189 , H05K2203/308 , H01L2924/00
摘要： In a method for manufacturing a composite wiring board, a through hole is formed in a sheet having a shrinkage-suppressing effect, and the through hole is filled with conductive paste to obtain a sheet for formation of a conductor. The sheet for formation of the conductor and a green sheet for a substrate in their laminated state are fired to obtain a ceramic substrate having a surface provided with a sintered metal conductor. A fired product of the sheet having the shrinkage-suppressing effect is removed from the surface of the ceramic substrate. Finally, a resin layer is formed on the surface of the ceramic substrate.
摘要翻译： 在制造复合布线板的方法中，在具有收缩抑制效果的片材中形成通孔，并且通孔填充有导电膏以获得用于形成导体的片材。 烧结用于形成导体的片材和用于基板的生片的层叠状态，得到具有设置有烧结金属导体的表面的陶瓷基板。 从陶瓷基板的表面除去具有收缩抑制效果的片材的烧成品。 最后，在陶瓷基板的表面上形成树脂层。
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公开(公告)号：US20070108586A1
公开(公告)日：2007-05-17
申请号：US11595979
申请日：2006-11-13
IPC分类号： H01L23/48
CPC分类号： H05K3/281 , H01L2924/0002 , H05K1/0206 , H05K1/0269 , H05K1/0306 , H05K3/4007 , H05K3/4611 , H05K3/4629 , H05K2201/0367 , H05K2201/096 , H05K2201/09781 , H05K2201/09881 , H05K2203/1189 , H05K2203/308 , H01L2924/00
摘要： A composite wiring board includes a ceramic substrate, a resin layer in contact with at least one surface of the ceramic substrate and a sintered metal conductor piercing through the resin layer. The composite wiring board is manufactured by a method including the steps of forming a through hole in a sheet having a shrinkage-suppressing effect and filling the through hole with conductive paste to obtain a sheet for formation of a conductor, firing the conductor formation sheet and a green sheet for a substrate in their laminated state to obtain a ceramic substrate having a surface provided with a sintered metal conductor, removing from the surface of the ceramic substrate a fired product of the sheet having the shrinkage-suppressing effect and forming a resin layer on the surface of the ceramic substrate.
摘要翻译： 复合布线板包括陶瓷基板，与陶瓷基板的至少一个表面接触的树脂层和穿过树脂层的烧结金属导体。 复合布线板通过以下方法制造，该方法包括以下步骤：在具有收缩抑制效果的片材中形成通孔，并用导电膏填充该通孔，从而获得用于形成导体的片材，烧结导体形成片材和 在层叠状态的基板的生片，得到具有烧结金属导体的表面的陶瓷基板，从陶瓷基板的表面除去具有收缩抑制效果的片材的烧成品，形成树脂层 在陶瓷基板的表面上。
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3.发明授权公开(公告)号：US06872251B2
公开(公告)日：2005-03-29
申请号：US10158570
申请日：2002-05-29
IPC分类号： C30B13/16 , C01B13/14 , C01G23/00 , C01G49/00 , C04B35/26 , C30B11/00 , H01F1/34 , H01F1/37 , H01F5/00 , H01G4/12 , C30B29/22
CPC分类号： H01G4/1227 , B32B18/00 , C01B13/145 , C01G23/002 , C01G23/006 , C01G49/0063 , C01G49/009 , C01P2002/72 , C01P2004/03 , C01P2004/32 , C01P2004/61 , C01P2004/62 , C04B35/265 , C04B35/465 , C04B35/6261 , C04B35/6262 , C04B35/62625 , C04B35/6263 , C04B35/6264 , C04B35/62645 , C04B35/62655 , C04B35/6268 , C04B35/63 , C04B35/632 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3232 , C04B2235/3234 , C04B2235/3236 , C04B2235/3255 , C04B2235/326 , C04B2235/3272 , C04B2235/3274 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/3293 , C04B2235/3296 , C04B2235/3298 , C04B2235/36 , C04B2235/3817 , C04B2235/3852 , C04B2235/5436 , C04B2235/5445 , C04B2235/549 , C04B2235/6025 , C04B2237/704 , C30B11/00 , C30B29/22 , C30B29/30 , C30B29/32 , H01F1/34 , H01F1/37 , H01F5/003 , H01L2924/0002 , Y10S117/901 , Y10S428/90 , Y10T428/24926 , Y10T428/325 , H01L2924/00
摘要： A method for manufacturing single crystal ceramic powder is provided. The method includes a powder supply step for supplying powder consisting essentially of ceramic ingredients to a heat treatment area with a carrier gas, a heat treatment step for heating the powder supplied to the heat treatment area at temperatures required for single-crystallization of the powder to form a product, and a cooling step for cooling the product obtained in the heat treatment step to form single crystal ceramic powder. The method provides single crystal ceramic powder consisting of particles with a very small particle size and a sphericity being 0.9 or higher.
摘要翻译： 提供了制造单晶陶瓷粉末的方法。 该方法包括：粉末供给步骤，用于将主要由陶瓷成分组成的粉末供给到具有载气的热处理区域;热处理步骤，用于将粉末单次结晶所需的温度加热到加热处理区域中的粉末， 形成产品，以及冷却步骤，用于冷却在热处理步骤中获得的产物以形成单晶陶瓷粉末。 该方法提供由粒子非常小且球形度为0.9或更高的颗粒组成的单晶陶瓷粉末。
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4.发明申请公开(公告)号：US20050056347A1
公开(公告)日：2005-03-17
申请号：US10946984
申请日：2004-09-22
摘要： A method for manufacturing magnetic metal powder is provided. In the method, a powdered magnetic metal oxide is supplied to a heat treatment furnace with a carrier gas composed of a reducing gas. The heat treatment furnace is maintained at temperatures above a reducing action starting temperature for the powdered magnetic metal oxide and above a melting point of the magnetic metal in the powder. The powdered magnetic metal oxide is subject to a reducing process, and then magnetic metal particles, the resultant reduced product, is melted to form a melt. The melt is re-crystallized in a succeeding cooling step, to obtain single crystal magnetic metal power in substantially spherical form.
摘要翻译： 提供一种制造磁性金属粉末的方法。 在该方法中，将粉末状的磁性金属氧化物供给到具有由还原气体构成的载气的热处理炉。 该热处理炉保持在高于粉末状磁性金属氧化物的还原作用开始温度以上且高于粉末中磁性金属的熔点的温度。 粉末状磁性金属氧化物经历还原过程，然后将所得还原产物的磁性金属颗粒熔化以形成熔体。 熔体在随后的冷却步骤中重结晶，以获得基本上为球形的单晶磁性金属功率。
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5.发明授权公开(公告)号：US07416795B2
公开(公告)日：2008-08-26
申请号：US10946984
申请日：2004-09-22
IPC分类号： H01F1/33
摘要： A method for manufacturing magnetic metal powder is provided. In the method, a powdered magnetic metal oxide is supplied to a heat treatment furnace with a carrier gas composed of a reducing gas. The heat treatment furnace is maintained at temperatures above a reducing action starting temperature for the powdered magnetic metal oxide and above a melting point of the magnetic metal in the powder. The powdered magnetic metal oxide is subject to a reducing process, and then magnetic metal particles, the resultant reduced product, is melted to form a melt. The melt is re-crystallized in a succeeding cooling step, to obtain single crystal magnetic metal power in substantially spherical form.
摘要翻译： 提供一种制造磁性金属粉末的方法。 在该方法中，将粉末状的磁性金属氧化物供给到具有由还原气体构成的载气的热处理炉。 该热处理炉保持在高于粉末状磁性金属氧化物的还原作用开始温度以上且高于粉末中磁性金属的熔点的温度。 粉末状磁性金属氧化物经历还原过程，然后将所得还原产物的磁性金属颗粒熔化以形成熔体。 熔体在随后的冷却步骤中再结晶，以获得基本上为球形的单晶磁性金属功率。
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6.发明授权公开(公告)号：US06827758B2
公开(公告)日：2004-12-07
申请号：US10159953
申请日：2002-05-29
IPC分类号： B22F930
摘要： A method for manufacturing magnetic metal powder is provided. In the method, a powdered magnetic metal oxide is supplied to a heat treatment furnace with a carrier gas composed of a reducing gas. The heat treatment furnace is maintained at temperatures above a reducing action starting temperature for the powdered magnetic metal oxide and above a melting point of the magnetic metal in the powder. The powdered magnetic metal oxide is subject to a reducing process, and then magnetic metal particles, the resultant reduced product, is melted to form a melt. The melt is re-crystallized in a succeeding cooling step, to obtain single crystal magnetic metal power in substantially spherical form.
摘要翻译： 提供一种制造磁性金属粉末的方法。 在该方法中，将粉末状的磁性金属氧化物供给到具有由还原气体构成的载气的热处理炉。 该热处理炉保持在高于粉末状磁性金属氧化物的还原作用开始温度以上且高于粉末中磁性金属的熔点的温度。 粉末状磁性金属氧化物经历还原过程，然后将所得还原产物的磁性金属颗粒熔化以形成熔体。 熔体在随后的冷却步骤中再结晶，以获得基本上为球形的单晶磁性金属功率。
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公开(公告)号：US08591750B2
公开(公告)日：2013-11-26
申请号：US12659893
申请日：2010-03-24
申请人： Hiroyuki Uematsu , Kenichi Kawabata , Kenji Nagase
发明人： Hiroyuki Uematsu , Kenichi Kawabata , Kenji Nagase
CPC分类号： H05K3/427 , H05K3/002 , H05K3/0035 , H05K3/0038 , H05K3/0041 , H05K3/0044 , H05K3/061 , H05K3/064 , H05K3/382 , H05K3/389 , H05K3/421 , H05K3/4652 , H05K2201/0347 , H05K2201/0355 , H05K2201/0358 , H05K2201/0394 , H05K2203/025 , H05K2203/0353 , H05K2203/054 , H05K2203/0585 , H05K2203/0733
摘要： Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.
摘要翻译： 提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案 。 将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备 并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。 之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用 作为掩模的图案化层，对底漆树脂层21进行图案化。 使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。
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公开(公告)号：US08492659B2
公开(公告)日：2013-07-23
申请号：US12379295
申请日：2009-02-18
申请人： Kenji Nagase , Hiroyuki Uematsu , Kenichi Kawabata
发明人： Kenji Nagase , Hiroyuki Uematsu , Kenichi Kawabata
IPC分类号： H05K1/11
CPC分类号： H05K3/0035 , H05K1/115 , H05K3/0055 , H05K3/381 , H05K2201/09509 , H05K2201/09827 , H05K2203/025 , H05K2203/0554 , H05K2203/0557 , Y10T29/49155 , Y10T29/49165
摘要： The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability and a manufacturing method therefor. The printed wiring board 100 includes a thermosetting resin sheet 16 (insulation layer) having a via hole 20 (through hole) constituted by inner wall parts having different taper angles from each other, a copper foil 17 (conductor layer) provided on the thermosetting resin sheet 16, and a wiring pattern 13 (wiring layer) which is provided so as to be exposed from the via hole 20 and is electrically connected with the copper foil 17 through the via hole 20.
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公开(公告)号：USD663333S1
公开(公告)日：2012-07-10
申请号：US29413899
申请日：2012-02-22
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公开(公告)号：US20100243601A1
公开(公告)日：2010-09-30
申请号：US12659893
申请日：2010-03-24
申请人： Hiroyuki Uematsu , Kenichi Kawabata , Kenji Nagase
发明人： Hiroyuki Uematsu , Kenichi Kawabata , Kenji Nagase
CPC分类号： H05K3/427 , H05K3/002 , H05K3/0035 , H05K3/0038 , H05K3/0041 , H05K3/0044 , H05K3/061 , H05K3/064 , H05K3/382 , H05K3/389 , H05K3/421 , H05K3/4652 , H05K2201/0347 , H05K2201/0355 , H05K2201/0358 , H05K2201/0394 , H05K2203/025 , H05K2203/0353 , H05K2203/054 , H05K2203/0585 , H05K2203/0733
摘要： Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.
摘要翻译： 提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案 。 将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备 并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。 之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用 作为掩模的图案化层，对底漆树脂层21进行图案化。 使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。
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