公开(公告)号：US20180359871A1

公开(公告)日：2018-12-13

申请号：US15621545

申请日：2017-06-13

申请人： Honeywell International Inc.

发明人： J.L. Hunter ,  Anthony J. Bussan

IPC分类号： H05K5/02 ,  G01R33/09

CPC分类号： H05K5/0217 ,  G01R33/091 ,  G01R33/093 ,  G01R33/096

摘要： Embodiments relate generally to systems and methods for retaining a sensor package within a carrier. A sensor package assembly may comprise a sensor package comprising at least one sensor element located within a sensing face of the sensor package; and a carrier comprising retention features configured to retain the sensor package while completely exposing the sensing face of the sensor package. A method for retaining a sensor package within a carrier may comprise inserting a sensor package into a carrier, wherein inserting the sensor package displaces one or more retaining clips of the carrier; retaining the sensor package within the carrier via the retaining clips interfacing with one or more notches of the sensor package; and exposing a sensing face of the sensor package via an opening in the carrier, wherein the sensor package comprises one or more sensor elements located in the sensing face of the sensor package.