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    TWO DEGREE OF FREEDOM DITHERING PLATFORM FOR MEMS SENSOR CALIBRATION
    2.
    发明申请
    TWO DEGREE OF FREEDOM DITHERING PLATFORM FOR MEMS SENSOR CALIBRATION 有权
    用于MEMS传感器校准的自由度平台的两个程度

    公开(公告)号：US20150024534A1

    公开(公告)日：2015-01-22

    申请号：US14508715

    申请日：2014-10-07

    Applicant: Honeywell International Inc.

    Inventor： Ryan Supino ,  Eugen Cabuz ,  Burgess R. Johnson ,  Robert D. Horning

    IPC: B81C1/00 ,  G01P21/00

    CPC classification number: B81C1/00134 ,  B81B2201/03 ,  B81C2203/03 ,  G01D5/34 ,  G01P21/00 ,  Y10T29/49002

    Abstract: Systems and methods for two degree of freedom dithering for micro-electromechanical system (MEMS) sensor calibration are provided. In one embodiment, a method for a device comprises forming a MEMS sensor layer, the MEMS sensor layer comprising a MEMS sensor and an in-plane rotator to rotate the MEMS sensor in the plane of the MEMS sensor layer. Further, the method comprises forming a first and second rotor layer and bonding the first rotor layer to a top surface and the second rotor layer to the bottom surface of the MEMS sensor layer, such that a first and second rotor portion of the first and second rotor layers connect to the MEMS sensor. Also, the method comprises separating the first and second rotor portions from the first and second rotor layers, wherein the first and second rotor portions and the MEMS sensor rotate about an in-plane axis of the MEMS sensor layer.

    Abstract translation: 提供了用于微机电系统（MEMS）传感器校准的两自由度抖动的系统和方法。 在一个实施例中，用于器件的方法包括形成MEMS传感器层，所述MEMS传感器层包括MEMS传感器和面内旋转器以在MEMS传感器层的平面内旋转MEMS传感器。 此外，该方法包括形成第一转子层和第二转子层，并将第一转子层结合到顶表面，将第二转子层结合到MEMS传感器层的底表面，使得第一和第二转子部分的第一和第二转子部分 转子层连接到MEMS传感器。 此外，该方法包括从第一和第二转子层分离第一和第二转子部分，其中第一和第二转子部分和MEMS传感器围绕MEMS传感器层的面内轴线旋转。

    Folded optics for batch fabricated atomic sensor
    3.
    发明授权
    Folded optics for batch fabricated atomic sensor 有权
    用于批量制造原子传感器的折叠光学器件

    公开(公告)号：US08829423B2

    公开(公告)日：2014-09-09

    申请号：US13663057

    申请日：2012-10-29

    Applicant: Honeywell International Inc.

    Inventor： Robert Compton ,  Robert D. Horning ,  Jeff A. Ridley

    IPC: H05H3/02 ,  H05H3/00

    CPC classification number: G21K1/006 ,  G01C19/58 ,  G01P15/08 ,  G04F5/14 ,  Y10T29/49826

    Abstract: System and methods for a vacuum cell apparatus for an atomic sensor are provided. In at least one embodiment, the apparatus comprises a cell wall encircling an enclosed volume, the cell wall having a first open end and a second open end opposite from the first open end and a first panel over the first open end of the cell wall and having a first surface, the first surface facing the enclosed volume and having a first set of diffractive optics therein. Further, the apparatus comprises a second panel over the second open end of the cell wall and having a second surface, the second surface facing the enclosed volume and having a second set of diffractive optics therein; wherein the first set of diffractive optics and the second of diffractive optics are configured to reflect at least one optical beam within the enclosed volume along a predetermined optical path.

    Abstract translation: 提供了一种用于原子传感器的真空电池装置的系统和方法。 在至少一个实施例中，该装置包括围绕封闭容积的细胞壁，细胞壁具有第一开放端和与第一开放端相对的第二开口端和在细胞壁的第一开口端上的第一面板， 具有第一表面，所述第一表面面向所述封闭容积并且在其中具有第一组衍射光学元件。 此外，该装置包括在细胞壁的第二开口端上的第二面板，并具有第二表面，第二表面面向封闭容积并且在其中具有第二组衍射光学元件; 其中所述第一组衍射光学器件和所述第二衍射光学器件被配置为沿着预定光学路径反射所述封闭容积内的至少一个光束。

    SYSTEMS AND METHODS FOR A TIME-BASED OPTICAL PICKOFF FOR MEMS SENSORS
    4.
    发明申请
    SYSTEMS AND METHODS FOR A TIME-BASED OPTICAL PICKOFF FOR MEMS SENSORS 有权
    用于MEMS传感器的基于时间的光学PICKOFF的系统和方法

    公开(公告)号：US20160377434A1

    公开(公告)日：2016-12-29

    申请号：US14860443

    申请日：2015-09-21

    Applicant: Honeywell International Inc.

    Inventor： Robert D. Horning ,  Grant Lodden

    IPC: G01C19/5726 ,  G01C19/574 ,  G01P15/03 ,  G02B6/293

    CPC classification number: G01C19/5726 ,  B81B2201/0228 ,  B81B2201/04 ,  B81B2203/053 ,  G01C19/5621 ,  G01C19/5656 ,  G01C19/574 ,  G01C25/00 ,  G01P15/032 ,  G01P15/093 ,  G01P21/00 ,  G01P2015/0822 ,  G02B6/29331

    Abstract: Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.

    Abstract translation: 提供了用于MEMS传感器的基于时间的光学拾取的系统和方法。 在一个实施例中，一种用于集成波导时基的光学传感器传感器的方法包括：将由光源产生的光束发射到在第一衬底内单片制造的集成波导光学检测器，所述集成波导光学检测器包括 光输入端口，耦合端口和光输出端口; 并且通过测量光输出端口处的光束的衰减来检测耦合端口和与耦合端口分离的移动传感器部件之间的重叠区域的变化，其中移动传感器部件正在与平面内移动， 相对于包括耦合端口的第一基板的表面和耦合端口被定位成检测移动的传感器部件的边缘的移动。

    LOW TEMPERATURE WAFER BONDING
    5.
    发明申请
    LOW TEMPERATURE WAFER BONDING 审中-公开
    低温波形焊接

    公开(公告)号：US20160351436A1

    公开(公告)日：2016-12-01

    申请号：US14722910

    申请日：2015-05-27

    Applicant: Honeywell International Inc.

    Inventor： Daniel Endean ,  Bob Martin ,  Robert D. Horning

    IPC: H01L21/762 ,  H01L29/06 ,  H01L21/68 ,  H01L21/02 ,  H01L21/324

    CPC classification number: H01L21/76251 ,  H01L21/02052 ,  H01L21/02164 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/02266 ,  H01L21/02274 ,  H01L21/2007 ,  H01L21/324 ,  H01L21/681 ,  H01L29/0649

    Abstract: A method of low temperature wafer bonding is provided. The method comprises: providing oxide to form a bonding layer on a deposition surface of at least one of two wafers, the bonding layer having a thickness in the range of 100 Angstroms to 500 Angstroms; soaking the wafers in a solution that makes bonding surfaces of the wafers hydrophilic; rinsing the wafers with water after soaking the wafers in the solution that makes bonding surfaces of the wafers hydrophilic; drying the wafers; optical-contact bonding the wafers with each other by bringing the bonding layers of the wafers in contact with each other to form a wafer pair; and annealing the wafer pair at a temperature less than or equal to 500° Celsius.

    Abstract translation: 提供了一种低温晶片接合的方法。 该方法包括：提供氧化物以在两个晶片中的至少一个晶片的沉积表面上形成结合层，该结合层的厚度在100埃至500埃的范围内; 将晶片浸泡在使晶片的结合表面亲水的溶液中; 在将晶片浸泡在使晶片的结合表面亲水的溶液中之后用水冲洗晶片; 干燥晶片; 通过使晶片的结合层彼此接触来将晶片彼此光学接触接合，以形成晶片对; 并且在小于或等于500℃的温度下退火晶片对。

    SYSTEMS AND METHODS FOR DEVICE TEMPERATURE STABILIZATION
    6.
    发明申请
    SYSTEMS AND METHODS FOR DEVICE TEMPERATURE STABILIZATION 审中-公开
    用于器件温度稳定的系统和方法

    公开(公告)号：US20160233851A1

    公开(公告)日：2016-08-11

    申请号：US14716635

    申请日：2015-05-19

    Applicant: Honeywell International Inc.

    Inventor： Robert D. Horning ,  Grant H. Lodden

    IPC: H03K3/011 ,  H01L35/32 ,  H01L35/34

    CPC classification number: H03K3/011 ,  B81B7/0087 ,  H01L23/34 ,  H01L23/38 ,  H01L35/32 ,  H01L35/34

    Abstract: A temperature stabilized device and method for temperature stabilization are provided. The temperature stabilized device comprises a substrate having a first surface, at least one component mounted on the first surface of the substrate, and a first conformal layer comprising a thermoelectric material, with the first conformal layer over the at least one component. A first temperature control circuit is electrically coupled to the first conformal layer. The first temperature control circuit is configured to control a current through the first conformal layer. The current through the first conformal layer is controlled to maintain the at least one component at a target operating temperature.

    Abstract translation: 提供了一种用于温度稳定的温度稳定装置和方法。 温度稳定装置包括具有第一表面的基底，安装在基底的第一表面上的至少一个部件和包含热电材料的第一共形层，第一共形层在至少一个部件上。 第一温度控制电路电耦合到第一保形层。 第一温度控制电路被配置为控制通过第一保形层的电流。 控制通过第一保形层的电流以将至少一个组分保持在目标工作温度。

    HEMITOROIDAL RESONATOR GYROSCOPE
    7.
    发明申请
    HEMITOROIDAL RESONATOR GYROSCOPE 有权
    HEMITOROIDAL谐振器GYROSCOPE

    公开(公告)号：US20140068931A1

    公开(公告)日：2014-03-13

    申请号：US14090588

    申请日：2013-11-26

    Applicant: Honeywell International Inc.

    Inventor： Robert D. Horning ,  Burgess R. Johnson ,  Robert Compton ,  Eugen Cabuz

    IPC: G01C25/00

    CPC classification number: G01C25/00 ,  G01C19/5691 ,  H03H9/2405 ,  Y10T29/49002 ,  Y10T29/49117

    Abstract: A method for fabricating a vibratory structure gyroscope is provided herein. An annular cavity is formed in a first surface of a substrate, the annular cavity defining an anchor post located in a central portion of the annular cavity. A bubble layer is formed over the first surface of the substrate and over the annular cavity. The substrate and the bubble layer are heated to form a hemitoroidal bubble in the bubble layer over the annular cavity. A sacrificial layer is deposited over the hemitoroidal bubble of the bubble layer and an aperture is formed in the sacrificial layer, the aperture disposed over the anchor post in the annular cavity. A resonator layer is deposited over the sacrificial layer and the sacrificial layer between the bubble layer and the resonator layer is removed.

    Abstract translation: 本文提供了一种用于制造振动结构陀螺仪的方法。 在衬底的第一表面中形成环形空腔，所述环形空腔限定位于所述环形腔的中心部分中的锚固柱。 气泡层形成在衬底的第一表面上方和环形腔上方。 衬底和气泡层被加热，以在环形空腔中的气泡层中形成一个椭圆形气泡。 牺牲层沉积在气泡层的椭圆形气泡上方，并且在牺牲层中形成孔，该孔设置在环形空腔中的锚柱上方。 在牺牲层上沉积谐振器层，并去除气泡层和谐振器层之间的牺牲层。

    Hemitoroidal resonator gyroscope
    10.
    发明授权
    Hemitoroidal resonator gyroscope 有权
    血管型谐振陀螺仪

    公开(公告)号：US09534925B2

    公开(公告)日：2017-01-03

    申请号：US14090588

    申请日：2013-11-26

    Applicant: Honeywell International Inc.

    Inventor： Robert D. Horning ,  Burgess R. Johnson ,  Robert Compton ,  Eugen Cabuz

    IPC: G01C25/00 ,  G01C19/5691 ,  H03H9/24

    CPC classification number: G01C25/00 ,  G01C19/5691 ,  H03H9/2405 ,  Y10T29/49002 ,  Y10T29/49117

    Abstract: A method for fabricating a vibratory structure gyroscope is provided herein. An annular cavity is formed in a first surface of a substrate, the annular cavity defining an anchor post located in a central portion of the annular cavity. A bubble layer is formed over the first surface of the substrate and over the annular cavity. The substrate and the bubble layer are heated to form a hemitoroidal bubble in the bubble layer over the annular cavity. A sacrificial layer is deposited over the hemitoroidal bubble of the bubble layer and an aperture is formed in the sacrificial layer, the aperture disposed over the anchor post in the annular cavity. A resonator layer is deposited over the sacrificial layer and the sacrificial layer between the bubble layer and the resonator layer is removed.

    Abstract translation: 本文提供了一种用于制造振动结构陀螺仪的方法。 在衬底的第一表面中形成环形空腔，所述环形空腔限定位于所述环形腔的中心部分中的锚固柱。 气泡层形成在衬底的第一表面上方和环形腔上方。 衬底和气泡层被加热，以在环形空腔中的气泡层中形成一个椭圆形气泡。 牺牲层沉积在气泡层的椭圆形气泡上方，并且在牺牲层中形成孔，该孔设置在环形空腔中的锚柱上方。 在牺牲层上沉积谐振器层，并去除气泡层和谐振器层之间的牺牲层。

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