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公开(公告)号:US20050184133A1
公开(公告)日:2005-08-25
申请号:US11065193
申请日:2005-02-24
申请人: Horst Clauberg , Ronald Focia , David Beatson , Kenneth Dury
发明人: Horst Clauberg , Ronald Focia , David Beatson , Kenneth Dury
CPC分类号: H01L24/85 , B08B7/0042 , B23K20/004 , B23K26/1224 , B23K26/123 , B23K26/142 , B23K26/1462 , B23K2101/32 , H01L24/45 , H01L24/78 , H01L2224/05554 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/7865 , H01L2224/8501 , H01L2224/85014 , H01L2224/85016 , H01L2224/85205 , H01L2224/85207 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/3025 , H01L2224/48 , H01L2924/00
摘要: A wire bonding system for attaching a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system includes a frame and a bonding head attached to the frame and adapted to attach a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system also includes a laser cleaning mechanism mounted to the frame, the laser cleaning mechanism including a laser for emitting laser light adapted to irradiate contaminants on a bonding pad, the laser mechanism located on the frame so as to emit light onto a bonding pad of at least one of the semiconductor device and the substrate prior to the bonding head attaching the wire thereto.
摘要翻译: 一种用于在半导体器件和衬底上的接合焊盘之间连接导线的引线接合系统。 引线接合系统包括框架和粘合头,该接合头附接到框架并且适于将导线附接到半导体器件和基板上的接合焊盘之间。 引线接合系统还包括安装到框架的激光清洁机构,激光清洁机构包括用于发射适合于在接合焊盘上照射污染物的激光的激光器,位于框架上的激光机构以将光发射到接合 所述半导体器件和所述基板中的至少一个的焊盘在所述焊接头附接所述导线之前。
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2.
公开(公告)号:US20060219754A1
公开(公告)日:2006-10-05
申请号:US11096140
申请日:2005-03-31
申请人: Horst Clauberg , Ronald Focia , David Beatson , Kenneth Dury
发明人: Horst Clauberg , Ronald Focia , David Beatson , Kenneth Dury
CPC分类号: H01L24/85 , B08B7/00 , B08B7/0057 , B23K20/004 , B23K20/24 , B23K2101/40 , C23F4/00 , H01L21/67138 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45014 , H01L2224/45147 , H01L2224/48247 , H01L2224/7801 , H01L2224/78301 , H01L2224/85013 , H01L2224/85055 , H01L2224/85065 , H01L2224/85075 , H01L2224/851 , H01L2924/00014 , H01L2924/01007 , H01L2924/0101 , H01L2924/01013 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/01001 , H01L2924/01002 , H01L2924/206
摘要: A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.
摘要翻译: 提供了一种用于清洁被配置为引线键合的导线的电线清洁系统。 电线清洁系统包括一个室,通过该室配置成引线接合的导线在导线接合之前延伸。 电线清洁系统还包括能量源,用于在电线被引线接合之前去除腔室中的电线的污染物。
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公开(公告)号:US20070026574A1
公开(公告)日:2007-02-01
申请号:US10552429
申请日:2004-04-08
申请人: David Beatson , Horst Clauderg , Kenneth Dury
发明人: David Beatson , Horst Clauderg , Kenneth Dury
IPC分类号: H01L21/00 , H01L23/495
CPC分类号: H01L24/85 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/49175 , H01L2224/81801 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , H01L2924/3025 , Y10T29/49204 , H01L2224/78 , H01L2924/00 , H01L2924/20751 , H01L2924/20753 , H01L2924/00015
摘要: Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.
摘要翻译: 公开了利用包含氮化铜的接合表面的互连结构和方法。 互连结构包括包含氮化铜的结合表面,其有效地防止下面的导电材料的氧化和/或其它不希望的腐蚀,同时为高导电性键提供基础。 氮化铜接合表面提供相对不导电的耐腐蚀粘合表面,同时在粘合时或之前容易地转变成导电层。
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