Method and system for characterizing coupling capacitance between integrated circuit interconnects
    1.
    发明授权
    Method and system for characterizing coupling capacitance between integrated circuit interconnects 失效
    表征集成电路互连之间的耦合电容的方法和系统

    公开(公告)号:US06333680B1

    公开(公告)日:2001-12-25

    申请号:US09677348

    申请日:2000-10-02

    IPC分类号: H03B524

    CPC分类号: G01R27/2605 G01R31/04

    摘要: An exemplary embodiment of the invention is a method of characterizing capacitances of a plurality of integrated circuit interconnects. The method includes coupling a first oscillator to a first integrated circuit interconnect and coupling a second oscillator to a second integrated circuit interconnect. The first oscillator is activated to characterize the sum of (i) coupling capacitance between the first integrated-circuit interconnect and the second integrated-circuit interconnect and (ii) ground capacitance between the first integrated-circuit interconnect and a ground. In addition, both of the first oscillator and the second oscillator are activated to characterize the ground capacitance between the first integrated-circuit interconnect and the ground.

    摘要翻译: 本发明的示例性实施例是表征多个集成电路互连的电容的方法。 该方法包括将第一振荡器耦合到第一集成电路互连并将第二振荡器耦合到第二集成电路互连。 激活第一振荡器以表征(i)第一集成电路互连和第二集成电路互连之间的耦合电容和(ii)第一集成电路互连和地之间的接地电容之和的和。 此外,第一振荡器和第二振荡器都被激活以表征第一集成电路互连和地之间的接地电容。