MILLIMETER-WAVE WIDEBAND FREQUENCY DOUBLER
    2.
    发明申请
    MILLIMETER-WAVE WIDEBAND FREQUENCY DOUBLER 有权
    MILLIMETER-WAVE WIDEBAND频率双打

    公开(公告)号:US20120146747A1

    公开(公告)日:2012-06-14

    申请号:US12967160

    申请日:2010-12-14

    IPC分类号: H03B19/00

    CPC分类号: H03B19/00

    摘要: A millimeter-wave wideband frequency doubler stage for use in a distributed frequency doubler includes: a differential input pair of transistors, each transistor having respective gate, drain and source terminals, wherein the source terminals are coupled together to a first power supply node and the drain terminals are coupled together at a first node to a second power supply node; first and second pairs of bandpass gate lines coupled to the gate terminals of the transistors; and a pair of bandpass drain lines coupled to the drain terminals of the transistors.

    摘要翻译: 用于分布式倍频器的毫米波宽带倍频器级包括:差分输入对晶体管,每个晶体管具有相应的栅极,漏极和源极端子,其中源极端子耦合到第一电源节点,并且 漏极端子在第一节点耦合到第二电源节点; 耦合到晶体管的栅极端子的第一和第二对带通栅极线; 以及耦合到晶体管的漏极端子的一对带通漏极线。

    THROUGH CHIP COUPLING FOR SIGNAL TRANSPORT
    3.
    发明申请
    THROUGH CHIP COUPLING FOR SIGNAL TRANSPORT 有权
    通过芯片耦合进行信号传输

    公开(公告)号:US20120122395A1

    公开(公告)日:2012-05-17

    申请号:US12946072

    申请日:2010-11-15

    IPC分类号: H04B5/00

    CPC分类号: H04B5/0081

    摘要: Through-chip coupling is utilized for signal transport, where an interface is formed between a first coil on a first integrated circuit (IC) chip and a second coil on a second IC chip. The first coil is coupled to an antenna. The second coil is coupled to an amplifier circuit. The second coil is not in direct contact with the first coil. The first coil and the second coil communicatively transmit signals between the antenna and the first amplifier circuit.

    摘要翻译: 芯片耦合用于信号传输,其中在第一集成电路(IC)芯片上的第一线圈和第二IC芯片上的第二线圈之间形成接口。 第一线圈耦合到天线。 第二线圈耦合到放大器电路。 第二线圈不与第一线圈直接接触。 第一线圈和第二线圈在天线和第一放大器电路之间通信地传送信号。

    INJECTION-LOCKED FREQUENCY DIVIDER
    4.
    发明申请
    INJECTION-LOCKED FREQUENCY DIVIDER 审中-公开
    注射锁频分路器

    公开(公告)号:US20120068745A1

    公开(公告)日:2012-03-22

    申请号:US12887984

    申请日:2010-09-22

    IPC分类号: H03L7/08 H03B19/12

    CPC分类号: H03L7/18

    摘要: A representative injection-locked frequency divider includes a differential direct injection pair that is configured to receive and mix differential injection signals and an oscillator that is electrically connected to the differential direct injection pair and produces an operating frequency based on the mixed differential injection signals.

    摘要翻译: 代表性的注入锁定分频器包括被配置为接收和混合差分注入信号的差分直接注入对以及电连接到差分直接注入对的振荡器,并且基于混合的差分注入信号产生工作频率。

    BALANCED TRANSFORMER STRUCTURE
    6.
    发明申请
    BALANCED TRANSFORMER STRUCTURE 审中-公开
    平衡变压器结构

    公开(公告)号:US20120092121A1

    公开(公告)日:2012-04-19

    申请号:US12974080

    申请日:2010-12-21

    IPC分类号: H01F27/28

    摘要: A multi-chip electronic device includes a first winding having a first port (P+) and a second port (P−). The first winding is formed in a metal layer of a first chip. The device further includes a second winding having a third (S+) and a fourth port (S−). The second winding is formed in a metal layer of a second chip. A center tap of the second winding is connected to a reference potential.

    摘要翻译: 多芯片电子设备包括具有第一端口(P +)和第二端口(P-)的第一绕组。 第一绕组形成在第一芯片的金属层中。 该装置还包括具有第三(S +)和第四端口(S)的第二绕组。 第二绕组形成在第二芯片的金属层中。 第二绕组的中心抽头连接到参考电位。

    JUNCTION VARACTOR FOR ESD PROTECTION OF RF CIRCUITS
    7.
    发明申请
    JUNCTION VARACTOR FOR ESD PROTECTION OF RF CIRCUITS 有权
    用于ESD保护射频电路的连接变压器

    公开(公告)号:US20110233678A1

    公开(公告)日:2011-09-29

    申请号:US12731562

    申请日:2010-03-25

    IPC分类号: H01L29/93 H01L27/06 H01L23/60

    摘要: An ESD protection device includes a first well of a first semiconductor type disposed in a substrate of a second semiconductor type forming a first diode. A second well of the second semiconductor type is formed in the substrate to form a second diode with the first well. A first plurality of doped regions of the first semiconductor type are formed in an upper surface of the first well. A second plurality of doped regions of the second semiconductor type are formed in the upper surface of the first well forming a third diode with the first well. A plurality of STI regions are formed in the upper surface of the first well. Each STI region is disposed between a doped region of the first and second semiconductor types. The third diode provides a current bypass when an ESD voltage spike is received at one of the first or second plurality of doped regions.

    摘要翻译: ESD保护装置包括设置在形成第一二极管的第二半导体类型的衬底中的第一半导体类型的第一阱。 第二半导体类型的第二阱形成在衬底中以与第一阱形成第二二极管。 第一半导体类型的第一多个掺杂区域形成在第一阱的上表面中。 第二半导体类型的第二多个掺杂区域形成在第一阱的上表面中,其与第一阱形成第三二极管。 多个STI区域形成在第一阱的上表面中。 每个STI区域设置在第一和第二半导体类型的掺杂区域之间。 当在第一或第二多个掺杂区域中的一个处接收ESD电压尖峰时,第三二极管提供电流旁路。

    CMOS MILLIMETER-WAVE VARIABLE-GAIN LOW-NOISE AMPLIFIER
    8.
    发明申请
    CMOS MILLIMETER-WAVE VARIABLE-GAIN LOW-NOISE AMPLIFIER 有权
    CMOS MILLIMETER-WAVE VARIABLE-GAIN低噪声放大器

    公开(公告)号:US20120032742A1

    公开(公告)日:2012-02-09

    申请号:US12851705

    申请日:2010-08-06

    IPC分类号: H03G3/30 H03F3/16 H03F1/22

    摘要: A low-noise amplifier (LNA) includes a first cascode gain stage coupled to an input node for increasing an amplitude of an RF input signal. A first variable gain network is coupled to the first cascode gain stage and includes a first inductor for boosting a gain of the first cascode gain stage, a first capacitor coupled to the first inductor for blocking a direct current (DC) voltage, and a first switch coupled to the first inductor and to the first capacitor. The first switch is configured to selectively couple the first inductor to the first cascode gain stage in response to a first control signal.

    摘要翻译: 低噪声放大器(LNA)包括耦合到输入节点的第一共源共同增益级,用于增加RF输入信号的幅度。 第一可变增益网络耦合到第一共源共同增益级,并且包括用于升高第一共源共享增益级的增益的第一电感器,耦合到第一电感器以阻止直流(DC)电压的第一电容器,以及第一可变增益网络 开关耦合到第一电感器和第一电容器。 第一开关被配置为响应于第一控制信号选择性地将第一电感器耦合到第一共源共享增益级。

    CIRCUIT AND METHOD FOR RADIO FREQUENCY AMPLIFIER
    10.
    发明申请
    CIRCUIT AND METHOD FOR RADIO FREQUENCY AMPLIFIER 有权
    无线电频率放大器的电路和方法

    公开(公告)号:US20110090012A1

    公开(公告)日:2011-04-21

    申请号:US12894903

    申请日:2010-09-30

    IPC分类号: H03F3/16

    CPC分类号: H03F3/19 H01L29/78

    摘要: A radio frequency amplifier circuit includes a substrate that is capable of receiving a substrate bias voltage. The source of a transistor is capable of receiving a source bias voltage. The drain of the transistor is capable of receiving a drain bias voltage. The gate of the transistor is located between the source and the drain. A radio frequency input signal is coupled to the gate. A substrate bias circuit provides the substrate bias voltage. The substrate bias voltage and the source bias voltage forward bias the first diode formed by the source and the substrate. The substrate bias voltage and the drain bias voltage reverse bias the second diode formed by the drain and the substrate.

    摘要翻译: 射频放大器电路包括能够接收衬底偏置电压的衬底。 晶体管的源极能够接收源极偏置电压。 晶体管的漏极能够接收漏极偏置电压。 晶体管的栅极位于源极和漏极之间。 射频输入信号耦合到门。 衬底偏置电路提供衬底偏置电压。 衬底偏置电压和源极偏置电压正向偏置由源极和衬底形成的第一二极管。 衬底偏置电压和漏极偏置电压反向偏置由漏极和衬底形成的第二二极管。