摘要:
A substrate cutting apparatus includes a stage configured to support a substrate to be cut along a virtual cutting line, a laser generator configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line.
摘要:
To minimize stress variations applied to mother glasses when a glass sealing material is melted via a laser to combine the mother glasses, a method of manufacturing a flat panel display device includes providing a plurality of emission units between a first substrate and a second substrate, wherein the first substrates faces the second substrate and each emission unit forms a unit display device; providing a plurality of walls between the first substrate and the second substrate, wherein each wall respectively surrounds one of the emission units; irradiating a laser beam onto the walls, wherein the laser beam is simultaneously irradiated to wall portions aligned in a row in a first direction; scanning the laser beam in a second direction, wherein the second direction is different from the first direction to irradiate other wall portions of the plurality of walls; and cutting the first and second substrates to obtain individual display devices.
摘要:
To minimize stress variations applied to mother glasses when a glass sealing material is melted via a laser to combine the mother glasses, a method of manufacturing a flat panel display device includes providing a plurality of emission units between a first substrate and a second substrate, wherein the first substrates faces the second substrate and each emission unit forms a unit display device; providing a plurality of walls between the first substrate and the second substrate, wherein each wall respectively surrounds one of the emission units; irradiating a laser beam onto the walls, wherein the laser beam is simultaneously irradiated to wall portions aligned in a row in a first direction; scanning the laser beam in a second direction, wherein the second direction is different from the first direction to irradiate other wall portions of the plurality of walls; and cutting the first and second substrates to obtain individual display devices.
摘要:
A laser irradiation apparatus for bonding a first substrate and a second substrate of a display device by melting a plurality of bonding members disposed between the first and second substrates to define cells when the display device is manufactured, the display device including light emitting elements disposed on a surface of the first substrate such that the bonding members respectively encompass lateral regions of the light emitting elements, the laser irradiation apparatus including a stage on which the first substrate is mounted, a laser oscillation member configured to irradiate a laser beam that melts the bonding members disposed between the first substrate and the second substrate, and a scanner configured to irradiate the laser beam incident from the laser oscillation member onto the bonding members, the scanner being configured to sequentially irradiate the laser beam on portions of the bonding members.
摘要:
A laser irradiation apparatus for bonding a first substrate and a second substrate of a display device by melting a plurality of bonding members disposed between the first and second substrates to define cells when the display device is manufactured, the display device including light emitting elements disposed on a surface of the first substrate such that the bonding members respectively encompass lateral regions of the light emitting elements, the laser irradiation apparatus including a stage on which the first substrate is mounted, a laser oscillation member configured to irradiate a laser beam that melts the bonding members disposed between the first substrate and the second substrate, and a scanner configured to irradiate the laser beam incident from the laser oscillation member onto the bonding members, the scanner being configured to sequentially irradiate the laser beam on portions of the bonding members.
摘要:
A substrate cutting apparatus including: a stage to support a substrate; a laser generator to emit a laser beam; a beam oscillator to oscillate the laser beam onto a cutting line of the substrate, to heat the substrate; and a cooling unit to cool the heated substrate.
摘要:
A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.
摘要:
A laser induced thermal imaging (LITI) method, a method of patterning an organic layer using the same and a method of manufacturing an organic light emitting diode (OLED) display device using the same. The LITI method includes preparing a substrate including a transfer layer, preparing a donor substrate including a base film and a light-to-heat conversion layer disposed on the base film, aligning the substrate with the donor substrate, and irradiating laser to the base layer of the donor substrate. Here, the laser is irradiated to the base layer in a region excluding a region corresponding to a pattern to be formed on the substrate. Thus, according to the method, regardless of the size of the pattern to be formed and the size of the laser beam, stitching mura can be prevented.
摘要:
A method for manufacturing a flexible display is provided. A sacrificial layer is formed on a substrate support, the sacrificial layer having an absorptivity of 1 E+02 to 1 E+06 cm−1 as a function of the wavelength of a laser. A flexible substrate is formed on the sacrificial layer. A device is formed on the flexible substrate. Laser irradiating is performed on a rear of the substrate support for detaching the sacrificial layer from the flexible substrate.
摘要:
A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section.