-
公开(公告)号:US3379539A
公开(公告)日:1968-04-23
申请号:US41966964
申请日:1964-12-21
Applicant: IBM
Inventor: MCGRATH RICHARD S , HOPEWELL JUNCTION , SILCOX NORMAN W
-
2.Method for making circuit connections to internal layers of a multilayer circuit card and circuit card produced thereby 失效
Title translation: 电路连接到由多层电路卡和由此产生的电路卡的内层的方法公开(公告)号:US3243498A
公开(公告)日:1966-03-29
申请号:US42096964
申请日:1964-12-24
Applicant: IBM
Inventor: ALLEN LOWELL G , HOPEWELL JUNCTION , KARL HINCK , PAULSEN ROBERT C
CPC classification number: H05K3/429 , H05K1/0287 , H05K1/0298 , H05K1/115 , H05K2201/09827 , H05K2201/09845 , H05K2201/09945 , H05K2203/0207 , H05K2203/1476
-
公开(公告)号:US2767348A
公开(公告)日:1956-10-16
申请号:US20196350
申请日:1950-12-21
Applicant: IBM
Inventor: KOEHLER ROBERT B , HOPEWELL JUNCTION , RABENDA EDWARD J
IPC: H03K29/00
CPC classification number: H03K29/00
-
4.Methods of improving electrical characteristics of semiconductor devices and products so produced 失效
Title translation: 改善如此制造的半导体器件和产品的电气特性的方法公开(公告)号:US3303059A
公开(公告)日:1967-02-07
申请号:US37886264
申请日:1964-06-29
Applicant: IBM
Inventor: KERR DONALD R , HOPEWELL JUNCTION , YOUNG DONALD R
IPC: H01L23/29 , H01L23/522 , H01L27/00 , H01L27/06 , H01L29/00
CPC classification number: H01L27/00 , H01L23/291 , H01L23/522 , H01L27/0635 , H01L27/0652 , H01L29/00 , H01L2924/0002 , Y10S438/91 , H01L2924/00
-
公开(公告)号:US3171114A
公开(公告)日:1965-02-23
申请号:US8031961
申请日:1961-01-03
Applicant: IBM
Inventor: BUTLER RICHARD A , HOPEWELL JUNCTION , CADWAILADER ROBERT H , ISOLE JR JOSEPH J , GERR PARK
CPC classification number: G05B19/108 , G05B2219/23175 , G05B2219/23365 , G07C3/005 , G08B5/36 , G09B5/02
-
公开(公告)号:US2782336A
公开(公告)日:1957-02-19
申请号:US39680453
申请日:1953-12-08
Applicant: IBM
Inventor: KOEHLER ROBERT B , HOPEWELL JUNCTION , RICHARDS RICHARD K
IPC: H01J17/48
CPC classification number: H01J17/48 , H01J2893/007