公开(公告)号：US3839727A

公开(公告)日：1974-10-01

申请号：US37352473

申请日：1973-06-25

申请人： IBM

发明人： PETERSON G ,  SULLIVAN M ,  HERDZIK R ,  JEANNOTTE D

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L3/00 ,  H01L5/00

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05664 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A solder bond between a semiconductor chip and a substrate is improved by the addition of a region of solder which is dispersion hardened with a ternary intermetallic. In the preferred embodiment the solder is constituted by a solid solution of tin in lead and a uniformly dispersed copper/tin/palladium ternary intermetallic. One of the constituents of the ternary intermetallic is a constituent of the solder.

摘要翻译： 通过添加用三元金属间化合物分散硬化的焊料区域来改善半导体芯片和基板之间的焊接。 在优选实施例中，焊料由锡在铅中的固溶体和均匀分散的铜/锡/钯三元金属间化合物构成。 三元金属间化合物之一是焊料的成分。

公开(公告)号：US3727173A

公开(公告)日：1973-04-10

申请号：US3727173D

申请日：1971-12-06

申请人： IBM

发明人： GOLDMANN L ,  JEANNOTTE D ,  KRALL B

IPC分类号： H01R4/01 ,  H01R13/193 ,  H01R13/54 ,  H01R13/62

CPC分类号： H01R4/01 ,  H01R13/193

摘要： A zero-insertion force connector comprising a supply means for providing a thermal source and a base means adapted to support one or more pairs of mating contacts. A reversible motion actuator means comprising a temperature responsive nickeltitanium alloy is adapted for connection to the mating contacts. The actuator means is selectively responsive to the thermal source for opening the mating contacts for providing zeroinsertion force for an electrical interconnection package having one or more pairs of electrical contacts thereon.

摘要翻译： 零插入力连接器，包括用于提供热源的供应装置和适于支撑一对或多对配合触点的底座装置。 包括温度响应镍钛合金的可逆运动致动器装置适于连接到配合触点。 致动器装置选择性地响应于热源以打开配合触头，以为其上具有一对或多对电触点的电互连封装提供零插入力。

公开(公告)号：US3829601A

公开(公告)日：1974-08-13

申请号：US34048373

申请日：1973-03-12

申请人： IBM

发明人： JEANNOTTE D ,  JOHNSON A

IPC分类号： H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/462 ,  H05K1/0272 ,  H05K3/328 ,  H05K3/4038 ,  H05K3/423 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/0305 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096

摘要： An interconnection substrate for electrical circuits comprising a plurality of planar conductive metallized patterns disposed between alternating layers of a dielectric medium, and substantially normal thereto electrically conductive paths extending between at least some of said conductive metallized patterns. Diffused metallurgical bond interfaces provide mechanical and electrical connection between the conductive metallized patterns and paths.

公开(公告)号：US3780568A

公开(公告)日：1973-12-25

申请号：US3780568D

申请日：1971-07-27

申请人： IBM

发明人： GOLDMANN L ,  JEANNOTTE D ,  KRALL B

IPC分类号： G01N13/02

CPC分类号： G01N13/02 ,  G01N2013/0225 ,  G01N2013/0266

摘要： A process for quantitatively measuring one of the surface tension components for a solder-flux combination by introducing a gaseous ambient bubble internally coated with a liquid flux into a molten solder, and measuring a pressure differential.

摘要翻译： 通过将内部涂覆有液体焊剂的气态环境气体引入熔融焊料中并测量压力差来定量测量焊剂组合的表面张力分量之一。