SENSOR ARRANGEMENT FOR CAPACITIVE POSITION DETECTION OF AN OBJECT

    公开(公告)号:US20230046256A1

    公开(公告)日:2023-02-16

    申请号:US17796554

    申请日:2021-01-25

    Abstract: A sensor arrangement for capacitive detection of an object, including: an electrode arrangement having a heating element as an electrode; a detection device providing a detection signal to a sensor electrode and capacitively detecting the presence of an object near the sensor electrode; a high-side switch connected between a heating power source having a first potential and the heating element; a low-side switch connected between the heating element and a second potential; and a gate controller closing the high-side switch and low-side switch in a heating mode and opening the high-side switch and low-side switch in a detection mode. A decoupling MOSFET is connected between the high-side switch and heating element. The gate controller closes the MOSFET in the heating mode and opens the MOSFET in the detection mode. During the detection mode, the decoupling circuit provides a third potential at a first node between the high-side switch and MOSFET.

    Sensor arrangement for capacitive position detection of an object

    公开(公告)号:US12221015B2

    公开(公告)日:2025-02-11

    申请号:US17796554

    申请日:2021-01-25

    Abstract: A sensor arrangement for capacitive detection of an object, including: an electrode arrangement having a heating element as an electrode; a detection device providing a detection signal to a sensor electrode and capacitively detecting the presence of an object near the sensor electrode; a high-side switch connected between a heating power source having a first potential and the heating element; a low-side switch connected between the heating element and a second potential; and a gate controller closing the high-side switch and low-side switch in a heating mode and opening the high-side switch and low-side switch in a detection mode. A decoupling MOSFET is connected between the high-side switch and heating element. The gate controller closes the MOSFET in the heating mode and opens the MOSFET in the detection mode. During the detection mode, the decoupling circuit provides a third potential at a first node between the high-side switch and MOSFET.

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