公开(公告)号：US09725552B2

公开(公告)日：2017-08-08

申请号：US14881993

申请日：2015-10-13

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Cheng-Han Hsieh ,  Hung-Jie Liou

IPC: C08L63/04 ,  C08L77/02 ,  C08G8/32 ,  C09D163/00 ,  C08G8/04 ,  C08G8/06

CPC classification number: C08G8/32 ,  C08G8/04 ,  C08G8/06 ,  C08L63/04 ,  C08L77/02 ,  C09D163/00 ,  C08L61/14

Abstract: A HMF-based phenol formaldehyde resin is provided. The HMF-based phenol formaldehyde resin has the formula In the formula, A includes non-substituted phenol, m-cresol, p-cresol, hydroquinone or disubstituted phenol, B includes phosphate ester, phosphate, phosphine oxide, phosphinate ester or phosphinate, and n is 3-20, wherein the disubstituted phenol has substituted groups including H, halide, C1-C20 alkyl group, C1-C20 alkenyl group, C1-C20 cycloalkyl group, C1-C20 cycloalkenyl group, homocyclic aromatic group or heterocyclic aromatic group.