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公开(公告)号：US20180328971A1
公开(公告)日：2018-11-15
申请号：US16046093
申请日：2018-07-26
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Dirk Hammerschmidt , Ferdinand Gastinger , Bernhard Schaffer , Wolfgang Granig
CPC classification number: G01R31/007 , B60T8/885 , B60T2250/06 , B60T2270/406 , B60T2270/411 , B60T2270/413 , G01D3/08 , G01R31/2644 , G01R31/2829 , G01R31/2856 , G01R31/2884
Abstract: Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
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公开(公告)号：US10101379B2
公开(公告)日：2018-10-16
申请号：US15132783
申请日：2016-04-19
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Dirk Hammerschmidt , Ferdinand Gastinger , Bernhard Schaffer , Wolfgang Granig
Abstract: Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
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公开(公告)号：US10145882B2
公开(公告)日：2018-12-04
申请号：US15132783
申请日：2016-04-19
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Dirk Hammerschmidt , Ferdinand Gastinger , Bernhard Schaffer , Wolfgang Granig
Abstract: Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
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公开(公告)号：US20210003395A1
公开(公告)日：2021-01-07
申请号：US17027185
申请日：2020-09-21
Applicant: Infineon Technologies AG
Inventor： Udo Ausserlechner , Armin Satz , Ferdinand Gastinger
IPC: G01B13/02 , G01R33/022 , G01D5/14 , G01R33/07 , G01R33/09
Abstract: Magnetic position sensors, systems and methods are disclosed. In an embodiment, a position sensing system includes a magnetic field source; and a sensor module spaced apart from the magnetic field source, at least one of the magnetic field source or the sensor module configured to move relative to the other along a path, the sensor module configured to determine a position of the magnetic field source relative to the sensor module from a nonlinear function of a ratio of a first component of a magnetic field of the magnetic field source to a second component of the magnetic field of the magnetic field source.
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公开(公告)号：US10782127B2
公开(公告)日：2020-09-22
申请号：US14251861
申请日：2014-04-14
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Udo Ausserlechner , Armin Satz , Ferdinand Gastinger
Abstract: Magnetic position sensors, systems and methods are disclosed. In an embodiment, a position sensing system includes a magnetic field source; and a sensor module spaced apart from the magnetic field source, at least one of the magnetic field source or the sensor module configured to move relative to the other along a path, the sensor module configured to determine a position of the magnetic field source relative to the sensor module from a nonlinear function of a ratio of a first component of a magnetic field of the magnetic field source to a second component of the magnetic field of the magnetic field source.
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公开(公告)号：US20160231371A1
公开(公告)日：2016-08-11
申请号：US15132783
申请日：2016-04-19
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Dirk Hammerschmidt , Ferdinand Gastinger , Bernhard Schaffer , Wolfgang Granig
CPC classification number: G01R31/007 , B60T8/885 , B60T2250/06 , B60T2270/406 , B60T2270/411 , B60T2270/413 , G01D3/08 , G01R31/2644 , G01R31/2829 , G01R31/2856 , G01R31/2884
Abstract: Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
Abstract translation: 实施例涉及使用多个信号路径的传感器自我诊断的系统和方法。 在一个实施例中，传感器是磁场传感器，并且系统和/或方法被配置为满足或超过诸如SIL标准的相关安全或其他工业标准。 例如，在单个半导体船上实现的单片集成电路传感器系统可以包括具有用于半导体芯片上的第一传感器信号的第一信号路径的第一传感器设备; 以及第二传感器装置，具有用于半导体芯片上的第二传感器信号的第二信号路径，第二信号路径与第一信号路径不同，其中第一信号路径信号和第二信号路径信号的比较提供传感器系统 自我测试。
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公开(公告)号：US11874298B2
公开(公告)日：2024-01-16
申请号：US17196101
申请日：2021-03-09
Applicant: Infineon Technologies AG
Inventor： Gernot Binder , Ferdinand Gastinger , Stephanie Jankowski , Thomas Lassleben
CPC classification number: G01P3/487 , G01D5/147 , G01D11/245 , G01R33/0047
Abstract: A sensor device includes a magnetic field sensor component, including a chip carrier having a connection conductor and a magnetic field sensor chip arranged on the chip carrier, and a magnet, wherein the magnetic field sensor component is arranged on a mounting surface of the magnet, wherein the mounting surface has an elevation and the connection conductor is bent around the elevation.
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公开(公告)号：US11287252B2
公开(公告)日：2022-03-29
申请号：US17027185
申请日：2020-09-21
Applicant: Infineon Technologies AG
Inventor： Udo Ausserlechner , Armin Satz , Ferdinand Gastinger
Abstract: Magnetic position sensors, systems and methods are disclosed. In an embodiment, a position sensing system includes a magnetic field source; and a sensor module spaced apart from the magnetic field source, at least one of the magnetic field source or the sensor module configured to move relative to the other along a path, the sensor module configured to determine a position of the magnetic field source relative to the sensor module from a nonlinear function of a ratio of a first component of a magnetic field of the magnetic field source to a second component of the magnetic field of the magnetic field source.
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公开(公告)号：US10514410B2
公开(公告)日：2019-12-24
申请号：US16046093
申请日：2018-07-26
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Dirk Hammerschmidt , Ferdinand Gastinger , Bernhard Schaffer , Wolfgang Granig
Abstract: Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
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公开(公告)号：US09874609B2
公开(公告)日：2018-01-23
申请号：US13833852
申请日：2013-03-15
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Wolfgang Scherr , Wolfgang Granig , Michael Strasser , Bernhard Schaffer , Gerhard Pircher , Ferdinand Gastinger , Dirk Hammerschmidt
CPC classification number: G01R31/3187 , B60T8/885 , B60T2250/06 , B60T2270/406 , B60T2270/411 , B60T2270/413 , B60W50/0205 , B60W2050/0047 , B60W2050/0215 , G01D3/08 , G01R31/007 , G01R31/2829
Abstract: Embodiments relate to systems and methods for self-diagnostics and/or error detection using multiple signal paths in sensor and other systems. In an embodiment, a sensor system comprises at least two sensors, such as magnetic field sensors, and separate signal paths associated with each of the sensors. A first signal path can be coupled to a first sensor and a first digital signal processor (DSP), and a second signal path can be coupled to a second sensor and a second DSP. A signal from the first DSP can be compared with a signal from the second DSP, either on-chip or off, to detect faults, errors, or other information related to the operation of the sensor system. Embodiments of these systems and/or methods can be configured to meet or exceed relevant safety or other industry standards, such as safety integrity level (SIL) standards.
