公开(公告)号：US20190067213A1

公开(公告)日：2019-02-28

申请号：US15767306

申请日：2015-11-13

Applicant: INTEL CORPORATION

Inventor： Balu Pathangey ,  Mihir A. Oka ,  Andrew Proctor

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/78 ,  H01L25/18 ,  H01L25/065

Abstract: Described is an apparatus which comprises: a die having a first side and a second side opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the first side of the die; and a fluorocarbon layer disposed over the DBF or DAF. Described is a method which comprises: applying a die backside film (DBF) over a first side of a die, wherein the die has a second side which metal bumps; and applying a plasma polymerization process to treat the DBF with a fluorocarbon plasma.

公开(公告)号：US10546823B2

公开(公告)日：2020-01-28

申请号：US15767306

申请日：2015-11-13

Applicant: INTEL CORPORATION

Inventor： Balu Pathangey ,  Mihir A. Oka ,  Andrew Proctor

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/78 ,  H01L25/065 ,  H01L25/18

Abstract: Described is an apparatus which comprises: a die having a first side and a second side opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the first side of the die; and a fluorocarbon layer disposed over the DBF or DAF. Described is a method which comprises: applying a die backside film (DBF) over a first side of a die, wherein the die has a second side which metal bumps; and applying a plasma polymerization process to treat the DBF with a fluorocarbon plasma.