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公开(公告)号：US09825387B2
公开(公告)日：2017-11-21
申请号：US15084726
申请日：2016-03-30
Applicant: Intel Corporation
Inventor： Feifei Cheng , Kuang C. Liu , Michael Garcia , Eric W. Buddrius , Kevin J. Ceurter , Jonathon Robert Carstens
IPC: H01R13/62 , H01R12/75 , H01R12/70 , H01R13/639
CPC classification number: H01R12/75 , H01R12/7023 , H01R12/774 , H01R13/639
Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.
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2.发明申请
公开(公告)号：US20170229420A1
公开(公告)日：2017-08-10
申请号：US15495581
申请日：2017-04-24
Applicant: Intel Corporation
Inventor： Mark D. Summers , Kuang C. Liu
CPC classification number: H01L24/81 , B23K1/0016 , B23K1/008 , B23K2101/38 , B23K2101/40 , H01L23/147 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L2224/13023 , H01L2224/1616 , H01L2224/81143 , H01L2224/81815 , H01L2924/0002 , H01L2924/15323 , H01R12/7076 , H01R12/718 , H01R13/22 , H05K3/3426 , H05K2201/10325 , Y02P70/613 , H01L2924/00
Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.
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3.发明授权
公开(公告)号：US10186497B2
公开(公告)日：2019-01-22
申请号：US15495581
申请日：2017-04-24
Applicant: Intel Corporation
Inventor： Mark D. Summers , Kuang C. Liu
IPC: B23K31/02 , H01L23/00 , B23K1/00 , B23K1/008 , B23K101/40
Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.
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公开(公告)号：US09615483B2
公开(公告)日：2017-04-04
申请号：US14484896
申请日：2014-09-12
Applicant: Intel Corporation
Inventor： Gaurav Chawla , Joshua D. Heppner , Vijaykumar Krithivasan , Michael Garcia , Kuang C. Liu , Rajasekaran Swaminathan
IPC: H05K7/20 , H01L23/367 , H01L23/40 , H01L23/433
CPC classification number: H05K7/20 , H01L23/3675 , H01L23/4006 , H01L23/433 , H01L2224/16225 , H01L2924/0002 , H01L2924/15311 , H01L2924/16152 , H01L2924/00
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.
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5.发明申请TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF SURFACE MOUNTED ELECTRICAL DEVICES 有权控制表面安装电气设备运动和位置的技术和配置
公开(公告)号：US20160087361A1
公开(公告)日：2016-03-24
申请号：US14491646
申请日：2014-09-19
Applicant: Intel Corporation
Inventor： Mark D. Summers , Kuang C. Liu
CPC classification number: H01R12/718 , B23K1/0016 , B23K2101/38 , H01L23/147 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L2924/0002 , H01R12/7076 , H01R13/22 , H05K3/3426 , H05K2201/10325 , Y02P70/613 , H01L2924/00
Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.
Abstract translation: 本公开的实施例涉及用于控制表面安装的电气装置的运动和位置的技术和构造。 在一个实施例中，电触点包括被配置成沿第一方向延伸的腿部部分，与腿部部分联接的脚部分，所述脚部部分具有沿基本上垂直于第一方向的第二方向延伸的表面， 表面构造成直接与可焊接材料结合以形成焊接接头，邻接腿部和脚部的跟部，跟部具有轮廓形状，以及从脚部延伸并与鞋跟相对设置的趾部 趾部具有与跟部的轮廓形状对称的轮廓形状。 可以描述和/或要求保护其他实施例。
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公开(公告)号：US20180007791A1
公开(公告)日：2018-01-04
申请号：US15702709
申请日：2017-09-12
Applicant: Intel Corporation
Inventor： Mani Prakash , Thomas T. Holden , Jeffory L. Smalley , Ram S. Viswanath , Bassam N. Coury , Dimitrios Ziakas , Chong J. Zhao , Jonathan W. Thibado , Gregorio R. Murtagian , Kuang C. Liu , Rajasekaran Swaminathan , Zhichao Zhang , John M. Lynch , David J. Llapitan , Sanka Ganesan , Xiang Li , George Vergis
IPC: H05K1/18 , H01L23/00 , H01L23/498 , H01R12/71 , H01R12/79
CPC classification number: H05K1/181 , H01L23/00 , H01L23/498 , H01L2224/16225 , H01L2924/15311 , H01R12/712 , H01R12/79 , H05K2201/10159 , H05K2201/10325 , Y02P70/611
Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.
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7.发明授权
公开(公告)号：US09647363B2
公开(公告)日：2017-05-09
申请号：US14491646
申请日：2014-09-19
Applicant: Intel Corporation
Inventor： Mark D. Summers , Kuang C. Liu
IPC: H01R9/00 , H01R12/71 , B23K1/00 , H05K3/34 , H01R12/70 , H01R13/22 , H01L23/14 , H01L23/498 , B23K101/38
CPC classification number: H01R12/718 , B23K1/0016 , B23K2101/38 , H01L23/147 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L2924/0002 , H01R12/7076 , H01R13/22 , H05K3/3426 , H05K2201/10325 , Y02P70/613 , H01L2924/00
Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.
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公开(公告)号：US09832876B2
公开(公告)日：2017-11-28
申请号：US14575775
申请日：2014-12-18
Applicant: INTEL CORPORATION
Inventor： Mani Prakash , Thomas T. Holden , Jeffory L. Smalley , Ram S. Viswanath , Bassam N. Coury , Dimitrios Ziakas , Chong J. Zhao , Jonathan W. Thibado , Gregorio R. Murtagian , Kuang C. Liu , Rajasekaran Swaminathan , Zhichao Zhang , John M. Lynch , David J. Llapitan , Sanka Ganesan , Xiang Li , George Vergis
CPC classification number: H05K1/181 , H01L23/00 , H01L23/498 , H01L2224/16225 , H01L2924/15311 , H01R12/712 , H01R12/79 , H05K2201/10159 , H05K2201/10325 , Y02P70/611
Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.
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公开(公告)号：US20170288330A1
公开(公告)日：2017-10-05
申请号：US15084682
申请日：2016-03-30
Applicant: Intel Corporation
Inventor： Feifei Cheng , Kuang C. Liu , Michael Garcia , Eric W. Buddrius , Kevin J. Ceurter , Anthony P. Valpiani , Jonathon Robert Carstens
Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.
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公开(公告)号：US20160079150A1
公开(公告)日：2016-03-17
申请号：US14484896
申请日：2014-09-12
Applicant: Intel Corporation
Inventor： Gaurav Chawla , Joshua D. Heppner , Vijaykumar Krithivasan , Michael Garcia , Kuang C. Liu , Rajasekaran Swaminathan
IPC: H01L23/498 , H01L23/36 , H01L21/48 , B23P15/26
CPC classification number: H05K7/20 , H01L23/3675 , H01L23/4006 , H01L23/433 , H01L2224/16225 , H01L2924/0002 , H01L2924/15311 , H01L2924/16152 , H01L2924/00
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.
Abstract translation: 本公开的实施例涉及与封装负载组件相关联的技术和配置。 在一个实施例中，包装负载组件可以包括框架，该框架被配置为围绕包装衬底的管芯区域形成周边，该封装衬底具有构造成与封装衬底的表面耦合的第一表面和与第一表面相对设置的第二表面 。 框架可以包括设置在第二表面上的可变形构件，其可以被配置为与散热器的底座相耦合，以经由框架分布施加在散热器和封装衬底之间的力，并且可以在应用 力，其可以允许散热器的底部接触在封装衬底的管芯区域内的集成散热器的表面。
