Rendering User Emotion in a Metaverse for User Awareness

    公开(公告)号:US20250045976A1

    公开(公告)日:2025-02-06

    申请号:US18362489

    申请日:2023-07-31

    Abstract: Rendering an emotional state of a virtual reality headset user is provided. An emotion feature vector predicting a current emotional state of a user of a virtual reality headset is mapped to a matching set of existing avatar vectors a mapping function. A best matching avatar vector is selected from the matching set of existing avatar vectors based on determining that values of the best matching avatar vector most closely match values of the emotion feature vector predicting the current emotional state of the user of the virtual reality headset. An avatar associated with the user is rendered in a metaverse consistent with the current emotional state of the user of the virtual reality headset based on the best matching avatar vector to the emotion feature vector predicting the current emotional state of the user.

    BREAK TYPE RECOMMENDATION USING MACHINE LEARNING

    公开(公告)号:US20250044862A1

    公开(公告)日:2025-02-06

    申请号:US18362060

    申请日:2023-07-31

    Abstract: A computer-implemented method, a computer system and a computer program product recommend an optimal break for a user. The method includes capturing activity data for the user from an environment using a device. The method also includes obtaining prior activity data related to the user and identifying a preferred break type for the user, wherein the preferred break type for the user is associated with a prior activity of the user. In addition, the method includes determining that the user needs a break from a current activity based on the activity data. The method further includes generating a break recommendation for the user, wherein the break recommendation associates the preferred break type for the user with the current activity in the activity data. Lastly, the method includes displaying the break recommendation to the user.

    FREE LAYER IN MAGNETORESISTIVE RANDOM-ACCESS MEMORY

    公开(公告)号:US20250040444A1

    公开(公告)日:2025-01-30

    申请号:US18358057

    申请日:2023-07-25

    Abstract: Embodiments of present invention provide a magnetoresistive random-access-memory (MRAM). The MRAM includes a reference layer; a tunnel barrier layer of magnesium-oxide (MgO); and a free layer, where the free layer includes a first cobalt-iron-boron (CoFeB) layer on top of the tunnel barrier layer; a spacer layer on top of the first CoFeB layer; a second CoFeB layer on top of the spacer layer; and a capping layer of MgO on top of the second CoFeB layer. Additionally, the first and the second CoFeB layer are substantially depleted of boron (B) to include respectively a first region adjacent to the tunnel barrier layer and the capping layer respectively and a second region adjacent to the spacer layer, where the first regions of the first and the second CoFeB layer include crystallized cobalt-iron (CoFe) and the second regions of the first and the second CoFeB layer include amorphous CoFe alloy.

    Metal gate patterning for logic and SRAM in nanosheet devices

    公开(公告)号:US12156395B2

    公开(公告)日:2024-11-26

    申请号:US17644076

    申请日:2021-12-13

    Abstract: A semiconductor device is provided. The semiconductor device includes a first device including a first nanosheet stack formed on a substrate, the first nanosheet stack including alternating layers of a first work function metal (WFM) gate layer and an active semiconductor layer, a second nanosheet stack formed on the substrate, the second nanosheet stack including alternating layers of a second WFM gate layer and the active semiconductor layer, a shallow trench isolation (STI) region formed in the substrate between the first nanosheet stack and the second nanosheet stack, and an STI divot formed in the STI region. The first WFM gate layer of the first nanosheet stack is formed in the STI divot.

    Back end of line embedded RRAM structure with low forming voltage

    公开(公告)号:US12144271B2

    公开(公告)日:2024-11-12

    申请号:US17444841

    申请日:2021-08-11

    Abstract: A semiconductor structure may include a resistive random access memory device embedded between an upper metal interconnect and a lower metal interconnect in a backend structure of a chip. The resistive random access memory may include a first electrode and a second electrode separated by a dielectric film. A portion of the dielectric film directly above the first electrode may be crystalline. The semiconductor structure may include a stud below and in electrical contact with the first electrode and the lower metal interconnect and a dielectric layer between the upper metal interconnect and the lower metal interconnect. The dielectric layer may separate the upper metal interconnect from the lower metal interconnect. The crystalline portion of the dielectric film may include grain boundaries that extend through an entire thickness of the dielectric film. The crystalline portion of the dielectric film may include grains.

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