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公开(公告)号：US07204146B2
公开(公告)日：2007-04-17
申请号：US11368095
申请日：2006-03-02
申请人： Ichiro Ishimaru , Takahiro Okuda
发明人： Ichiro Ishimaru , Takahiro Okuda
IPC分类号： G01N29/46
CPC分类号： G01B11/0666
摘要： A device for measuring thickness of an object has a vibration generator for generating vibrations in the object, a vibration detector for detecting vibrations generated in the object by the vibration generator and a frequency analyzer for calculating resonance frequency of the object. The vibration generator includes a light-emitting part which emits light towards the object to irradiate and to be absorbed by the object. A plurality of vibration detectors may be used and the frequency analyzer may include a sound speed analyzer for calculating speed of sound inside the object from vibrations detected by these plurality of vibration detectors.
摘要翻译： 用于测量物体厚度的装置具有用于在物体中产生振动的振动发生器，用于检测由振动发生器产生的物体中的振动的振动检测器和用于计算物体的共振频率的频率分析器。 振动发生器包括发光部件，该发光部件向物体发射光以照射并被物体吸收。 可以使用多个振动检测器，并且频率分析器可以包括声速分析器，用于根据由这些多个振动检测器检测的振动来计算物体内的声音的速度。
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公开(公告)号：US20060144147A1
公开(公告)日：2006-07-06
申请号：US11368095
申请日：2006-03-02
申请人： Ichiro Ishimaru , Takahiro Okuda
发明人： Ichiro Ishimaru , Takahiro Okuda
CPC分类号： G01B11/0666
摘要： A device for measuring thickness of an object has a vibration generator for generating vibrations in the object, a vibration detector for detecting vibrations generated in the object by the vibration generator and a frequency analyzer for calculating resonance frequency of the object. The vibration generator includes a light-emitting part which emits light towards the object to irradiate and to be absorbed by the object. A plurality of vibration detectors may be used and the frequency analyzer may include a sound speed analyzer for calculating speed of sound inside the object from vibrations detected by these plurality of vibration detectors.
摘要翻译： 用于测量物体厚度的装置具有用于产生物体振动的振动发生器，用于检测由振动发生器产生的物体的振动的振动检测器和用于计算物体的共振频率的频率分析器。 振动发生器包括发光部件，该发光部件向物体发射光以照射并被物体吸收。 可以使用多个振动检测器，并且频率分析器可以包括声速分析器，用于根据由这些多个振动检测器检测的振动来计算物体内的声音的速度。
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公开(公告)号：US20050185172A1
公开(公告)日：2005-08-25
申请号：US11104621
申请日：2005-04-13
申请人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
发明人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
IPC分类号： G01B11/30 , G01B11/24 , G01B11/245 , G01N21/95 , G01N21/956 , G06T1/00 , H01L21/66 , G01N21/88
CPC分类号： G01N21/88 , G01N21/474 , G01N21/94 , G01N21/9501 , G01N21/9503 , G01N2021/8825 , G01N2021/8854
摘要： A surface inspection apparatus and a method for inspecting the surface of a sample are capable of inspecting discriminatingly between scratches of various configuration and adhered foreign objects that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to a polishing process such as CMP or a grinding process, in semiconductor manufacturing process or magnetic head manufacturing process. In the invention, the scratch and foreign object that occur on the polished or ground surface of the sample is epi-illuminated and slant-illuminated by use of approximately same light flux, the difference between the scattered light intensity from the shallow scratch and from the foreign object is applied to thereby discriminate between the shallow scratch and the foreign object, and the directionality of the scattered light is detected to discriminate between the linear scratch and the foreign object.
摘要翻译： 表面检查装置和检查样品表面的方法能够在工作目标（例如，工件的表面上的绝缘膜）上区别地检查在工作目标表面上发生的各种构造和附着异物的划痕 半导体衬底）在半导体制造工艺或磁头制造工艺中进行诸如CMP或研磨工艺的抛光工艺。 在本发明中，通过使用大致相同的光通量，在样品的抛光或地面上发生的划痕和异物被表面照射和倾斜照射，来自浅划痕的散射光强度与来自 应用异物，从而区分浅刮痕和异物，并且检测散射光的方向性以区分线状划痕和异物。
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公开(公告)号：US20130215428A1
公开(公告)日：2013-08-22
申请号：US13820592
申请日：2011-09-06
申请人： Ichiro Ishimaru
发明人： Ichiro Ishimaru
IPC分类号： A61B5/00
CPC分类号： A61B5/0075 , A61B5/14532 , A61B5/1455 , A61B2562/0233 , G01J3/0208 , G01J3/021 , G01J3/453 , G01J3/4531
摘要： Multiple rays such as scattered lights and fluorescent lights emitted radially in a variety of directions from each bright point in a measurement area enter an objective lens, where the multiple rays are converted into a parallel beam. The parallel beam is reflected by both a reference mirror unit and an oblique mirror unit, and the reflected beams pass through an imaging lens to form an interference image on a light-receiving surface of a detection unit. The detection of the light intensity of the interference image on the light-receiving surface enables an acquisition of the interferogram (the waveform of the change of imaging intensity) in which the light intensity continuously changes. By Fourier-converting the interferogram, spectral characteristics can be obtained which show the relative intensities for each wavelength of the lights emitted from one bright point of an object to be measured.
摘要翻译： 在测量区域中的每个亮点沿各种方向径向发射的散射光和荧光灯的多个光线进入物镜，其中多个光线被转换成平行光束。 平行光束由参考镜单元和倾斜镜单元两者反射，并且反射光束通过成像透镜，以在检测单元的光接收表面上形成干涉图像。 对光接收表面上的干涉图像的光强的检测使得能够获得其中光强度连续变化的干涉图（成像强度的变化波形）。 通过对干涉图进行傅立叶变换，可以获得光谱特性，其显示从要测量的物体的一个亮点发射的光的每个波长的相对强度。
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公开(公告)号：US07417244B2
公开(公告)日：2008-08-26
申请号：US11657455
申请日：2007-01-25
申请人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
发明人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
IPC分类号： G01N21/88
CPC分类号： G01N21/88 , G01N21/474 , G01N21/94 , G01N21/9501 , G01N21/9503 , G01N2021/8825 , G01N2021/8854
摘要： An apparatus for detecting defects, including: a first illumination optical unit which illuminates from a normal direction or in the vicinity of the normal direction; a second illumination optical unit which illuminates from a first elevation angle; a first detection optical unit which detects light reflected by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors; a second detection optical unit which detects light reflected by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors; wherein the plural detectors of the first detection optical unit and the plural detectors of the second detection optical unit are photomultipliers, and the signal processor processes the signals outputted from the photomultipliers and are adjusted to balance in sensitivities.
摘要翻译： 一种用于检测缺陷的装置，包括：第一照明光学单元，其从法向方向或附近照射; 第二照明光学单元，其从第一仰角照亮; 第一检测光学单元，其利用多个检测器检测由第一照明光学单元或第二照明光学单元的照明反射的光; 第二检测光学单元，其利用多个检测器检测由第一照明光学单元或第二照明光学单元的照明反射的光; 其中第一检测光学单元的多个检测器和第二检测光学单元的多个检测器是光电倍增管，并且信号处理器处理从光电倍增管输出的信号，并调整其灵敏度的平衡。
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公开(公告)号：US07952085B2
公开(公告)日：2011-05-31
申请号：US12196647
申请日：2008-08-22
申请人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
发明人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
IPC分类号： G01N21/88
CPC分类号： G01N21/88 , G01N21/474 , G01N21/94 , G01N21/9501 , G01N21/9503 , G01N2021/8825 , G01N2021/8854
摘要： The invention provides a surface inspection apparatus and a method for inspecting the surface of a sample that are capable of inspecting discriminatingly between the scratch of various configuration and the adhered foreign object that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to polishing process such as CMP or grinding process in semiconductor manufacturing process or magnetic head manufacturing process.
摘要翻译： 本发明提供了一种表面检查装置和用于检查样品表面的方法，所述表面检查装置和检查方法能够区分各种构型的刮擦和在作业目标（例如，工件）上发生在工作目标表面上的被粘附的异物之间的差异 ，半导体衬底上的绝缘膜）在半导体制造工艺或磁头制造工艺中进行诸如CMP或研磨工艺的抛光工艺。
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公开(公告)号：US07242016B2
公开(公告)日：2007-07-10
申请号：US11104621
申请日：2005-04-13
申请人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
发明人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
IPC分类号： G01N21/88
CPC分类号： G01N21/88 , G01N21/474 , G01N21/94 , G01N21/9501 , G01N21/9503 , G01N2021/8825 , G01N2021/8854
摘要： A surface inspection apparatus and a method for inspecting the surface of a sample are capable of inspecting discriminatingly between scratches of various configuration and adhered foreign objects that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to a polishing process such as CMP or a grinding process, in semiconductor manufacturing process or magnetic head manufacturing process. In the invention, the scratch and foreign object that occur on the polished or ground surface of the sample is epi-illuminated and slant-illuminated by use of approximately same light flux, the difference between the scattered light intensity from the shallow scratch and from the foreign object is applied to thereby discriminate between the shallow scratch and the foreign object, and the directionality of the scattered light is detected to discriminate between the linear scratch and the foreign object.
摘要翻译： 表面检查装置和检查样品表面的方法能够在工作目标（例如，工件的表面上的绝缘膜）上区别地检查在工作目标表面上发生的各种构造和附着异物的划痕 半导体衬底）在半导体制造工艺或磁头制造工艺中进行诸如CMP或研磨工艺的抛光工艺。 在本发明中，通过使用大致相同的光通量，在样品的抛光或地面上发生的划痕和异物被表面照射和倾斜照射，来自浅划痕的散射光强度与来自 应用异物，从而区分浅刮痕和异物，并且检测散射光的方向性以区分线状划痕和异物。
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公开(公告)号：US08988689B2
公开(公告)日：2015-03-24
申请号：US13820592
申请日：2011-09-06
申请人： Ichiro Ishimaru
发明人： Ichiro Ishimaru
CPC分类号： A61B5/0075 , A61B5/14532 , A61B5/1455 , A61B2562/0233 , G01J3/0208 , G01J3/021 , G01J3/453 , G01J3/4531
摘要： Multiple rays such as scattered lights and fluorescent lights emitted radially in a variety of directions from each bright point in a measurement area enter an objective lens, where the multiple rays are converted into a parallel beam. The parallel beam is reflected by both a reference mirror unit and an oblique mirror unit, and the reflected beams pass through an imaging lens to form an interference image on a light-receiving surface of a detection unit. The detection of the light intensity of the interference image on the light-receiving surface enables an acquisition of the interferogram (the waveform of the change of imaging intensity) in which the light intensity continuously changes. By Fourier-converting the interferogram, spectral characteristics can be obtained which show the relative intensities for each wavelength of the lights emitted from one bright point of an object to be measured.
摘要翻译： 在测量区域中的每个亮点沿各种方向径向发射的散射光和荧光灯的多个光线进入物镜，其中多个光线被转换成平行光束。 平行光束由参考镜单元和倾斜镜单元两者反射，并且反射光束通过成像透镜，以在检测单元的光接收表面上形成干涉图像。 对光接收表面上的干涉图像的光强的检测使得能够获得其中光强度连续变化的干涉图（成像强度的变化波形）。 通过对干涉图进行傅立叶变换，可以获得光谱特性，其显示从要测量的物体的一个亮点发射的光的每个波长的相对强度。
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9.发明授权公开(公告)号：US08830462B2
公开(公告)日：2014-09-09
申请号：US14001810
申请日：2012-02-28
申请人： Ichiro Ishimaru
发明人： Ichiro Ishimaru
CPC分类号： G01N21/23 , G01J3/0224 , G01J3/453
摘要： A linearly polarized light reaches a sample S through a polarizer and receives a retardation from the sample S. Then, the light reaches a movable mirror unit and a fixed mirror unit of a phase shifter through a first polarizing plate and a second polarizing plate. Then, the reflected measurement lights pass through an analyzer, and are caused by an imaging lens to form an interference image on the light-receiving surface of a detector. At this time, an optical path length difference between a beam reflected on the movable mirror unit and a beam reflected on the fixed mirror unit is continuously changed the movable mirror unit. Hence, the imaging intensity of the interference image detected by the detector continuously changes producing a synthetic waveform similar to an interferogram. The synthetic waveform is Fourier-transformed, to obtain an amplitude per wavelength and a birefringent phase difference per wavelength.
摘要翻译： 直线偏振光通过偏光片到达样品S，并从样品S接收延迟。然后，光通过第一偏振片和第二偏振片到达移相器的可移动镜单元和固定镜单元。 然后，反射的测量光通过分析器，并且由成像透镜引起，以在检测器的光接收表面上形成干涉图像。 此时，可移动镜单元反射的光束与固定镜单元上反射的光束之间的光程长度差连续地变化。 因此，由检测器检测到的干涉图像的成像强度连续变化，产生类似于干涉图的合成波形。 合成波形被傅里叶变换，以获得每波长的振幅和每波长的双折射相位差。
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公开(公告)号：US08729514B2
公开(公告)日：2014-05-20
申请号：US13114160
申请日：2011-05-24
申请人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
发明人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
IPC分类号： G01N21/88
CPC分类号： G01N21/88 , G01N21/474 , G01N21/94 , G01N21/9501 , G01N21/9503 , G01N2021/8825 , G01N2021/8854
摘要： A defect inspection apparatus including: a first illumination optical system which is configured to illuminate the inspection area on a sample surface from a normal line direction or a direction near thereof with respect to said sample surface; a second illumination optical system which is configured to illuminate said inspection area from a slant direction with respect to said sample surface; a detection optical system having a plurality of first detectors which are located, in front of, on the sides of, and behind said inspection area, respectively, with respect to the illumination direction of said second illumination optical system, and where the regular reflected light component, from said sample surface, by illumination light of said second illumination optical system, is not converged; and a signal processing system which is configured to inspect a defect, upon basis of signals obtained from said plurality of first detectors.
摘要翻译： 一种缺陷检查装置，包括：第一照明光学系统，被配置为从相对于所述样品表面的法线方向或近似的方向照射样品表面上的检查区域; 第二照明光学系统，被配置为相对于所述样品表面从倾斜方向照射所述检查区域; 检测光学系统，具有分别相对于所述第二照明光学系统的照明方向位于所述检查区域的所述检查区域的前方和后方的多个第一检测器，并且其中所述规则反射光 从所述样品表面通过所述第二照明光学系统的照明光分量不会收敛; 以及信号处理系统，其被配置为基于从所述多个第一检测器获得的信号来检查缺陷。
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