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    Method of adhering adherends
    1.
    发明授权
    Method of adhering adherends 失效
    附着物的方法

    公开(公告)号：US06333101B1

    公开(公告)日：2001-12-25

    申请号：US08141359

    申请日：1993-10-28

    申请人： Yasuo Imashiro ,  Kazuo Saito ,  Satoshi Amano ,  Takahiko Itoh ,  Hideshi Tomita ,  Ikuo Takahashi

    发明人： Yasuo Imashiro ,  Kazuo Saito ,  Satoshi Amano ,  Takahiko Itoh ,  Hideshi Tomita ,  Ikuo Takahashi

    IPC分类号： B32B300

    CPC分类号： C09J163/00 ,  C08L63/00 ,  C08L75/04 ,  C09J179/00 ,  Y10S525/907 ,  Y10T428/249967 ,  Y10T428/249982 ,  Y10T428/31515

    摘要： The present invention provides a method of adhering adherends, including (i) providing at least two adherends at least one of which is made of a flexible material, and (ii) joining the adherends together to form a structure using a heat-resistant adhesive composition containing mainly 1) a polycarbodiimide resin and an epoxy resin, or 2) a polycarbodiimide resin, an epoxy resin and a curing agent for the polycarbodiimide resin, or 3) a polycarbodiimide resin, an epoxy resin and a curing agent for the epoxy resin. The heat-resistant adhesive composition can be applied under mild conditions, and the resultant structure has excellent heat resistance and chemical resistance, and has superior adhesion strength particularly at high temperatures.

    摘要翻译： 本发明提供一种附着被粘物的方法，包括（i）提供至少两个被粘物，其至少一个由柔性材料制成，以及（ii）将被粘物结合在一起以形成使用耐热粘合剂组合物的结构 主要含有1）聚碳化二亚胺树脂和环氧树脂，或2）聚碳化二亚胺树脂，环氧树脂和聚碳二亚胺树脂的固化剂，或3）聚碳二亚胺树脂，环氧树脂和环氧树脂的固化剂。 耐热粘合剂组合物可以在温和条件下使用，所得结构具有优异的耐热性和耐化学性，并且特别是在高温下具有优异的粘合强度。

    Thermosetting polycarbodiimide copolymer
    2.
    发明授权
    Thermosetting polycarbodiimide copolymer 失效
    热固性聚碳化二亚胺共聚物

    公开(公告)号：US07253246B2

    公开(公告)日：2007-08-07

    申请号：US11133343

    申请日：2005-05-20

    申请人： Ikuo Takahashi ,  Hideshi Tomita

    发明人： Ikuo Takahashi ,  Hideshi Tomita

    IPC分类号： C08G64/00

    CPC分类号： C08G18/10 ,  C08G18/44 ,  C08G18/4854 ,  H05K1/0346 ,  H05K1/0393 ,  Y10T428/31504 ,  C08G18/095 ,  C08G18/025

    摘要： A thermosetting polycarbodiimide copolymer of the present invention comprises in a molecule thereof, a soft segment containing at least one residue formed by removing opposite functional end groups of polytetramethylene ether glycol, polyether block amide and polyalkylene carbonate diol having at least two mixed alkylene chains selected from the group consisting of hexamethylene, pentamethylene and tetramethylene; and a hard segment made of polycarbodiimide bonded to the soft segment through at least one bond selected from the group consisting of an urethane bond, a urea bond and an amide bond. The thermosetting polycarbodiimide copolymer can exhibit not only a high heat resistance and a good flexibility, but also an excellent flexing resistance (resistance to 180° bending),and can be, therefore, suitably used in applications of various electronic parts, for example, as materials of base films or cover-lay films for flexible wiring boards, or adhesive films.

    摘要翻译： 本发明的热固性聚碳化二亚胺共聚物在其分子中包含含有至少一个残基的软链段，其通过除去具有至少两个混合亚烷基链的聚四亚甲基醚二醇，聚醚嵌段酰胺和聚亚烷基碳酸酯二醇的相对官能端基形成， 由六亚甲基，五亚甲基和四亚甲基组成的组; 以及由通过选自氨基甲酸酯键，脲键和酰胺键的至少一个键与软链段结合的聚碳化二亚胺制成的硬链段。 热固性聚碳化二亚胺共聚物不仅具有高的耐热性和良好的柔软性，而且还具有优异的抗弯曲性（抗弯曲性为180°），因此可以适用于各种电子部件的应用，例如 用于柔性布线板或粘合膜的基膜或覆盖膜的材料。

    Acoustically matching layer and composition thereof
    4.
    发明授权
    Acoustically matching layer and composition thereof 失效
    声学匹配层及其组成

    公开(公告)号：US06979703B2

    公开(公告)日：2005-12-27

    申请号：US10330479

    申请日：2002-12-30

    申请人： Ikuo Takahashi ,  Hideshi Tomita

    发明人： Ikuo Takahashi ,  Hideshi Tomita

    IPC分类号： H04R17/00 ,  C08G18/02 ,  C08G59/40 ,  C08K7/20 ,  C08K7/28

    CPC分类号： C08G18/025 ,  C08G59/4042 ,  C08G2350/00 ,  C08K7/20

    摘要： It is an object of the present invention to provide a composition for an acoustically matching layer, having sufficient mechanical strength to allow itself to be easily formed, and capable of giving an acoustically matching layer highly stable in characteristics over extended periods even under high temperature and high humidity conditions. The present invention provides a composition containing a carbodiimide resin for an acoustically matching layer, where the composition may further contain inorganic hollow bodies or inorganic hollow bodies and another reactive resin; a process for producing a formed article of an acoustically matching layer by curing and forming under heating the composition in a mold for the acoustically matching layer; and an ultrasonic transducer using the same composition and ultrasonic transducer using the same formed article.

    摘要翻译： 本发明的目的是提供一种用于声匹配层的组合物，其具有足够的机械强度以允许其容易地形成，并且能够在甚至在高温下在长时间内使特性高度稳定的声匹配层，以及 高湿度条件。 本发明提供一种含有用于声匹配层的碳二亚胺树脂的组合物，其中该组合物还可以含有无机中空体或无机中空体和另一反应性树脂; 通过在用于声匹配层的模具中固化和加热所述组合物来形成声匹配层的成形制品的方法; 以及使用相同组成的超声波换能器和使用相同的成形物品的超声换能器。

    Thermosetting polycarbodiimide copolymer
    5.
    发明申请
    Thermosetting polycarbodiimide copolymer 失效
    热固性聚碳化二亚胺共聚物

    公开(公告)号：US20050261448A1

    公开(公告)日：2005-11-24

    申请号：US11133343

    申请日：2005-05-20

    申请人： Ikuo Takahashi ,  Hideshi Tomita

    发明人： Ikuo Takahashi ,  Hideshi Tomita

    IPC分类号： C08G18/10 ,  C08G18/44 ,  C08G18/48 ,  H05K1/00 ,  H05K1/03 ,  C08L79/00 ,  C08G18/00

    CPC分类号： C08G18/10 ,  C08G18/44 ,  C08G18/4854 ,  H05K1/0346 ,  H05K1/0393 ,  Y10T428/31504 ,  C08G18/095 ,  C08G18/025

    摘要： A thermosetting polycarbodiimide copolymer of the present invention comprises in a molecule thereof, a soft segment containing at least one residue formed by removing opposite functional end groups of polytetramethylene ether glycol, polyether block amide and polyalkylene carbonate diol having at least two mixed alkylene chains selected from the group consisting of hexamethylene, pentamethylene and tetramethylene; and a hard segment made of polycarbodiimide bonded to the soft segment through at least one bond selected from the group consisting of an urethane bond, a urea bond and an amide bond. The thermosetting polycarbodiimide copolymer can exhibit not only a high heat resistance and a good flexibility, but also an excellent flexing resistance (resistance to 180° bending),and can be, therefore, suitably used in applications of various electronic parts, for example, as materials of base films or cover-lay films for flexible wiring boards, or adhesive films.

    摘要翻译： 本发明的热固性聚碳化二亚胺共聚物在其分子中包含含有至少一个残基的软链段，其通过除去具有至少两个混合亚烷基链的聚四亚甲基醚二醇，聚醚嵌段酰胺和聚亚烷基碳酸酯二醇的相对官能端基形成， 由六亚甲基，五亚甲基和四亚甲基组成的组; 以及由通过选自氨基甲酸酯键，脲键和酰胺键的至少一个键与软链段结合的聚碳化二亚胺制成的硬链段。 热固性聚碳化二亚胺共聚物不仅具有高的耐热性和良好的柔软性，而且还具有优异的抗弯曲性（抗弯曲性为180°），因此可以适用于各种电子部件的应用，例如 用于柔性布线板或粘合膜的基膜或覆盖膜的材料。

    Highly heat-resistant plasma etching electrode and dry etching device including the same
    8.
    发明授权
    Highly heat-resistant plasma etching electrode and dry etching device including the same 失效
    高耐热等离子体蚀刻电极和包括其的干蚀刻装置

    公开(公告)号：US06818097B2

    公开(公告)日：2004-11-16

    申请号：US10199465

    申请日：2002-07-22

    申请人： Akira Yamaguchi ,  Hideshi Tomita

    发明人： Akira Yamaguchi ,  Hideshi Tomita

    IPC分类号： H05H100

    CPC分类号： H01J37/3255 ,  C08K3/04 ,  C08L79/08 ,  C08L2666/20 ,  C09J163/00 ,  H01J37/32009

    摘要： A plasma etching electrode for dry etching devices for production of semiconductor devices. The plasma etching electrode is prevented from contamination with impurities, provides good thermal and electrical conductance and heat resistance at the joint between the electrode plate and pedestal (or supporting ring), and hence improves etching characteristics and silicon wafer yield. The highly heat-resistant plasma etching electrode includes an electrode plate of silicon which is supported by and uniformly joined to a pedestal by an adhesive. The pedestal is made of graphite. The adhesive includes an epoxy resin containing polycarbodiimide resin and carbon powder. A dry etching device including the electrode is also described.

    摘要翻译： 一种用于制造半导体器件的干蚀刻装置的等离子体蚀刻电极。 防止等离子体蚀刻电极被杂质污染，在电极板和基座（或支撑环）之间的接合处提供良好的导热性和耐热性，因此提高了蚀刻特性和硅晶片的产量。 高耐热等离子体蚀刻电极包括由粘合剂支撑并均匀地接合到基座的硅的电极板。 基座由石墨制成。 粘合剂包括含有聚碳二亚胺树脂和碳粉末的环氧树脂。 还描述了包括电极的干蚀刻装置。

    Adhesive resin composition and sealing resin composition
    10.
    发明授权
    Adhesive resin composition and sealing resin composition 失效
    粘合树脂组合物和密封树脂组成

    公开(公告)号：US6140454A

    公开(公告)日：2000-10-31

    申请号：US292004

    申请日：1999-04-15

    申请人： Satoshi Amano ,  Hideshi Tomita

    发明人： Satoshi Amano ,  Hideshi Tomita

    IPC分类号： C08G18/02 ,  C08G59/62 ,  C08L61/06 ,  C08L63/00 ,  C08L79/00 ,  C09J161/06 ,  C09J163/00 ,  C09J179/00 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31 ,  C08G18/58

    CPC分类号： H01L23/293 ,  C08L61/06 ,  C08L63/00 ,  C08L79/00 ,  C09J161/06 ,  C09J163/00 ,  C09J179/00 ,  C09K3/10 ,  C09K2200/0247 ,  C09K2200/0647 ,  C09K2200/0667 ,  C09K2200/067 ,  H01L2924/0002

    摘要： The present invention provides an adhesive resin composition including an epoxy resin, a phenolic resin and a polycarbodiimide resin, wherein the proportion of the polycarbodiimide resin is 0.5 to 20 parts by weight per 100 parts by weight of the total of the epoxy resin and the phenolic resin, and a sealing resin composition including an epoxy resin, a phenolic resin, a polycarbodiimide resin and an inorganic filler, wherein the proportion of the polycarbodiimide resin is 0.5 to 20 parts by weight per 100 parts by weight of the total of the epoxy resin and the phenolic resin and the proportion of the inorganic filler is 60 to 95 parts by weight of the total weight of the composition. The resin compositions of the present invention are superior in heat resistance and long-term stability and, moreover, have excellent adhesivity even to new materials such as Ni alloys and the like.

    摘要翻译： 本发明提供了包含环氧树脂，酚醛树脂和聚碳二亚胺树脂的粘合剂树脂组合物，其中聚碳二亚胺树脂的比例为每100重量份环氧树脂和酚醛树脂总量的0.5-20重量份 树脂，以及包含环氧树脂，酚醛树脂，聚碳化二亚胺树脂和无机填料的密封树脂组合物，其中聚碳二亚胺树脂的比例为每100重量份总共的环氧树脂的0.5〜20重量份 酚醛树脂和无机填料的比例为组合物总重量的60〜95重量份。 本发明的树脂组合物的耐热性和长期稳定性优异，而且即使对于Ni合金等新材料也具有优异的粘接性。