Transparent display device with wall structure

    公开(公告)号:US10468469B2

    公开(公告)日:2019-11-05

    申请号:US15937883

    申请日:2018-03-28

    摘要: A transparent display device including a substrate having a light emitting region and a light transmitting region, a light emitting element located in the light emitting region, a first wall structure having an undercut sidewall, a first top conductive pattern and a barrier multi-layer structure is provided. The first wall structure forms the boundary between the light emitting region and the light transmitting region and the light emitting element is located in the light emitting region surrounded by the first wall structure. The first top conductive pattern is disposed on the top surface of the first wall structure. The barrier multi-layer structure is disposed on the light emitting element. The barrier multi-layer structure includes a first barrier layer and a second barrier layer. An overlapping portion of the first barrier layer and the second barrier is located in the light emitting region surrounded by the first wall structure.

    Environmental sensitive electronic device package having side wall barrier structure
    7.
    发明授权
    Environmental sensitive electronic device package having side wall barrier structure 有权
    具有侧壁屏障结构的环境敏感电子器件封装

    公开(公告)号:US09450202B2

    公开(公告)日:2016-09-20

    申请号:US14065434

    申请日:2013-10-29

    发明人: Kuang-Jung Chen

    IPC分类号: H01L51/52 G02F1/1333

    摘要: An environmental sensitive electronic device package having side wall barrier structure may include a first substrate, a second substrate, an environmental sensitive electronic device, a first adhesive, a third substrate, at least one first side wall barrier structure, and a second adhesive. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located between the first and second substrates and covers the environmental sensitive electronic device. The third substrate is located below the first substrate. The first substrate is located between the second and third substrates. The first side wall barrier structure is located on the third substrate and between the first and the third substrates, wherein the first side wall barrier structure is embedded in the first substrate. The second adhesive is located between the first and third substrates and covers the second first side wall barrier structure.

    摘要翻译: 具有侧壁阻挡结构的环境敏感的电子器件封装可以包括第一衬底,第二衬底,环境敏感电子器件,第一粘合剂,第三衬底,至少一个第一侧壁阻挡结构和第二粘合剂。 环境敏感电子设备位于第一基板上。 第一粘合剂位于第一和第二基底之间并覆盖环境敏感的电子设备。 第三基板位于第一基板的下方。 第一基板位于第二和第三基板之间。 第一侧壁阻挡结构位于第三基板上并且位于第一和第三基板之间,其中第一侧壁阻挡结构嵌入第一基板。 第二粘合剂位于第一和第三基底之间并且覆盖第二第一侧壁阻挡结构。

    Functional film, environmentally sensitive electronic device package, and manufacturing methods thereof
    8.
    发明授权
    Functional film, environmentally sensitive electronic device package, and manufacturing methods thereof 有权
    功能膜,环境敏感电子器件封装及其制造方法

    公开(公告)号:US09252389B2

    公开(公告)日:2016-02-02

    申请号:US13909082

    申请日:2013-06-04

    发明人: Kuang-Jung Chen

    IPC分类号: H01L51/52

    摘要: An environmentally sensitive electronic device package including a first adhesive, at least one first side wall barrier, a first substrate, and a second substrate is provided. The first adhesive has a first surface and a second surface opposite to the first surface. The first side wall barrier is distributed in the first adhesive. The first substrate is bonded with the first surface. The first substrate has an environmentally sensitive electronic device formed thereon and the environmentally sensitive electronic device is surrounded by the first side wall barrier. The second substrate is bonded with the second surface. A manufacturing method of the environmentally sensitive electronic device package is also provided.

    摘要翻译: 提供了包括第一粘合剂,至少一个第一侧壁屏障,第一基板和第二基板的环境敏感的电子设备封装。 第一粘合剂具有与第一表面相对的第一表面和第二表面。 第一侧壁屏障分布在第一粘合剂中。 第一衬底与第一表面结合。 第一基板在其上形成有环境敏感的电子设备,并且环境敏感的电子设备被第一侧壁屏障包围。 第二基板与第二表面结合。 还提供了一种对环境敏感的电子设备封装的制造方法。

    BARRIER FUNCTIONAL FILM AND MANUFACTURING THEREOF, ENVIRONMENTAL SENSITIVE ELECTRONIC DEVICE, AND DISPLAY APPARATUS
    9.
    发明申请
    BARRIER FUNCTIONAL FILM AND MANUFACTURING THEREOF, ENVIRONMENTAL SENSITIVE ELECTRONIC DEVICE, AND DISPLAY APPARATUS 有权
    屏障功能膜及其制造方法,环境敏感电子设备及显示设备

    公开(公告)号:US20140118638A1

    公开(公告)日:2014-05-01

    申请号:US14051461

    申请日:2013-10-11

    发明人: Kuang-Jung Chen

    IPC分类号: G02B26/00 H05K7/06 G02B5/32

    摘要: A barrier functional film that includes a substrate, at least one side wall barrier structure, a releasing film, and an adhesive is provided. The side wall barrier structure is located on the substrate. The releasing film is located above the substrate, and the side wall barrier structure is located between the substrate and the releasing film. The adhesive covers the side wall barrier structure and is located between the substrate and the releasing film. An environmental sensitive electronic device, a display apparatus, and a manufacturing method of a barrier functional film are also provided.

    摘要翻译: 提供了包括基板,至少一个侧壁阻挡结构,脱模膜和粘合剂的阻挡功能膜。 侧壁阻挡结构位于基板上。 剥离膜位于基板上方,侧壁阻挡结构位于基板和剥离膜之间。 粘合剂覆盖侧壁阻挡结构并且位于基底和释放膜之间。 还提供了一种环境敏感的电子设备,显示设备和阻挡功能膜的制造方法。