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公开(公告)号:US11316322B2
公开(公告)日:2022-04-26
申请号:US16802294
申请日:2020-02-26
IPC分类号: H01S5/0239 , H01S5/02 , H01S5/026 , G01S7/481 , H01S5/042 , H01S5/0231 , G01S7/484 , H01S5/323 , H01S5/0234 , H01S5/02345
摘要: A laser diode module is described herein. In accordance with a first exemplary embodiment, the laser diode module includes a first semiconductor die including at least one electronic switch, and a second semiconductor die including at least one laser diode. The second semiconductor die is bonded on the first semiconductor die using a chip-on-chip connecting technology to provide electrical connection between the electronic switch and the laser diode.
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公开(公告)号:US20180278011A1
公开(公告)日:2018-09-27
申请号:US15926499
申请日:2018-03-20
CPC分类号: H01S5/0215 , G01S7/4813 , G01S7/4814 , G01S7/484 , H01S5/0224 , H01S5/02244 , H01S5/02276 , H01S5/0261 , H01S5/0425 , H01S5/0428 , H01S5/32341
摘要: A laser diode module is described herein. In accordance with a first exemplary embodiment, the laser diode module includes a first semiconductor die including at least one electronic switch, and a second semiconductor die including at least one laser diode. The second semiconductor die is bonded on the first semiconductor die using a chip-on-chip connecting technology to provide electrical connection between the electronic switch and the laser diode.
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