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公开(公告)号:US10854669B2
公开(公告)日:2020-12-01
申请号:US16909745
申请日:2020-06-23
Applicant: Infineon Technologies AG
Inventor: Dirk Meinhold , Emanuele Bruno Bodini , Felix Braun , Hermann Gruber , Uwe Hoeckele , Dirk Offenberg , Klemens Pruegl , Ines Uhlig
IPC: H01L27/146 , H01L27/148
Abstract: Techniques are discloses regarding methods of manufacturing an imager as well as an imager device.
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公开(公告)号:US09882600B2
公开(公告)日:2018-01-30
申请号:US14172925
申请日:2014-02-05
Applicant: Infineon Technologies AG
Inventor: Christian Kuehn , Martin Bartels , Henning Feick , Dirk Offenberg , Anton Steltenpohl , Hans Taddiken , Ines Uhlig
IPC: H04B1/00 , H04B1/44 , H01L21/324 , H01L29/78 , H01L29/10
CPC classification number: H04B1/44 , H01L21/324 , H01L29/1079 , H01L29/78
Abstract: According to various embodiments, a switching device may include: an antenna terminal; a switch including a first switch terminal and a second switch terminal, the first switch terminal coupled to the antenna terminal, the switch including at least one transistor at least one of over or in a silicon region including an oxygen impurity concentration of smaller than about 3×1017 atoms per cm3; and a transceiver terminal coupled to the second switch terminal, wherein the transceiver terminal is at least one of configured to provide a signal received via the antenna terminal or configured to receive a signal to be transmitted via the antenna terminal.
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公开(公告)号:US20170358697A1
公开(公告)日:2017-12-14
申请号:US15688356
申请日:2017-08-28
Applicant: Infineon Technologies AG
Inventor: Thomas BEVER , Henning Feick , Dirk Offenberg , Stefano Parascandola , Ines Uhlig , Thoralf Kautzsch , Dirk Meinhold , Hanno Melzner
IPC: H01L31/0352 , G01S7/491 , H01L27/148
CPC classification number: H01L31/035272 , G01S7/4914 , H01L27/14806
Abstract: Embodiments related to controlling of photo-generated charge carriers are described and depicted. At least one embodiment provides a semiconductor substrate comprising a photo-conversion region to convert light into photo-generated charge carriers; a region to accumulate the photo-generated charge carriers; a control electrode structure including a plurality of control electrodes to generate a potential distribution such that the photo-generated carriers are guided towards the region to accumulate the photo-generated charge carriers based on signals applied to the control electrode structure; a non-uniform doping profile in the semiconductor substrate to generate an electric field with vertical field vector components in at least a part of the photo-conversion region
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公开(公告)号:US20230127662A1
公开(公告)日:2023-04-27
申请号:US18047912
申请日:2022-10-19
Applicant: Infineon Technologies AG
Inventor: Stefan Hampl , Kerstin Kämmer , Olaf Storbeck , Ines Uhlig
IPC: H05B3/44
Abstract: An IR (infrared) radiation source includes a sealed cavity structure enclosing a vacuum chamber having a low atmospheric pressure, wherein the sealed cavity structure includes a thermally and electrically insulating material for enclosing the vacuum chamber, heating filaments extending in the vacuum chamber between opposing electrode regions at opposing wall regions of the vacuum chamber, wherein the heating filaments are electrically connected in parallel, and wherein the heating filaments and the electrode regions have a highly electrically conductive material, and an optical isolation structure adjacent to the vacuum chamber for optically confining the IR radiation and providing a predominant propagation direction of the IR radiation.
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公开(公告)号:US10784147B2
公开(公告)日:2020-09-22
申请号:US16029237
申请日:2018-07-06
Applicant: Infineon Technologies AG
Inventor: Ines Uhlig , Kerstin Kaemmer , Norbert Thyssen
IPC: H01L21/762 , H01L21/768 , H01L21/3105 , H01L21/306 , H01L21/3065
Abstract: In accordance with an embodiment, a method for producing a buried cavity structure includes providing a mono-crystalline semiconductor substrate, producing a doped volume region in the mono-crystalline semiconductor substrate, wherein the doped volume region has an increased etching rate for a first etchant by comparison with an adjoining, undoped or more lightly doped material of the monocrystalline semiconductor substrate, forming an access opening to the doped volume region, and removing the doped semiconductor material in the doped volume region using the first etchant through the access opening to obtain the buried cavity structure.
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公开(公告)号:US09659992B2
公开(公告)日:2017-05-23
申请号:US14186390
申请日:2014-02-21
Applicant: Infineon Technologies AG
Inventor: Dirk Meinhold , Emanuele Bruno Bodini , Felix Braun , Hermann Gruber , Uwe Hoeckele , Dirk Offenberg , Klemens Pruegl , Ines Uhlig
IPC: H01L27/146 , H01L27/148
CPC classification number: H01L27/14689 , H01L27/14609 , H01L27/14627 , H01L27/14629 , H01L27/14687 , H01L27/14806
Abstract: Embodiments related to a method of manufacturing of an imager and an imager device are shown and depicted.
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公开(公告)号:US12154921B2
公开(公告)日:2024-11-26
申请号:US17398147
申请日:2021-08-10
Applicant: Infineon Technologies AG
Inventor: Ines Uhlig , Kerstin Kaemmer , Dirk Offenberg , Norbert Thyssen
IPC: H01L27/146 , G02B5/04 , G03B30/00
Abstract: A device for an image sensor is provided. The device includes a semiconductor device having a photo-sensitive region and a metallization stack for electrically contacting the photo-sensitive region. The photo-sensitive region is configured to generate an electric signal based on incident light. Further, the device includes an optical stack formed on a surface of the semiconductor device and configured to guide the incident light towards the photo-sensitive region. The optical stack includes a plurality of regions stacked on top of each other. The plurality of regions includes a filter region configured to selectively transmit the incident light only in a target wavelength range.
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公开(公告)号:US20200321388A1
公开(公告)日:2020-10-08
申请号:US16909745
申请日:2020-06-23
Applicant: Infineon Technologies AG
Inventor: Dirk Meinhold , Emanuele Bruno Bodini , Felix Braun , Hermann Gruber , Uwe Hoeckele , Dirk Offenberg , Klemens Pruegl , Ines Uhlig
IPC: H01L27/146 , H01L27/148
Abstract: Techniques are discloses regarding methods of manufacturing an imager as well as an imager device.
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公开(公告)号:US10707362B2
公开(公告)日:2020-07-07
申请号:US15881100
申请日:2018-01-26
Applicant: Infineon Technologies AG
Inventor: Thomas Bever , Henning Feick , Dirk Offenberg , Stefano Parascandola , Ines Uhlig , Thoralf Kautzsch , Dirk Meinhold , Hanno Melzner
IPC: H01L31/0352 , G01S7/4914 , H01L27/148
Abstract: Embodiments related to controlling of photo-generated charge carriers are described and depicted. At least one embodiment provides a semiconductor substrate comprising a photo-conversion region to convert light into photo-generated charge carriers; a region to accumulate the photo-generated charge carriers; a control electrode structure including a plurality of control electrodes to generate a potential distribution such that the photo-generated carriers are guided towards the region to accumulate the photo-generated charge carriers based on signals applied to the control electrode structure; a non-uniform doping profile in the semiconductor substrate to generate an electric field with vertical field vector components in at least a part of the photo-conversion region.
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公开(公告)号:US20200006418A1
公开(公告)日:2020-01-02
申请号:US16566171
申请日:2019-09-10
Applicant: Infineon Technologies AG
Inventor: Dirk Meinhold , Emanuele Bruno Bodini , Felix Braun , Hermann Gruber , Uwe Hoeckele , Dirk Offenberg , Klemens Pruegl , Ines Uhlig
IPC: H01L27/146 , H01L27/148
Abstract: Techniques are discloses regarding methods of manufacturing an imager as well as an imager device.
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