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1.发明授权公开(公告)号：US11189539B2
公开(公告)日：2021-11-30
申请号：US16433278
申请日：2019-06-06
Applicant: Infineon Technologies AG
Inventor： Prashanth Makaram , John Cooper , Joerg Ortner , Stephan Pindl , Caterina Travan , Alexander Zoepfl
Abstract: An apparatus includes a semiconductor-based substrate with a functional structure that is formed in or on the semiconductor-based substrate. The apparatus includes a frame structure surrounding the functional structure and includes a coating that covers the functional structure and is delimited by the frame structure.
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公开(公告)号：US20170309565A1
公开(公告)日：2017-10-26
申请号：US15137431
申请日：2016-04-25
Applicant: Infineon Technologies AG
Inventor： Joerg Ortner , John Cooper
IPC: H01L23/525
CPC classification number: H01L23/5256
Abstract: A method for use in manufacturing semiconductor devices includes providing a structured layer on a wafer, and selectively providing a substance on a selected portion of the structured layer. A die comprises a semiconductor device on a substrate, where the semiconductor device includes a substance, and where the substance has a sidewall that is sheer with respect to one or more of a base surface or a top surface of the substrate.
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3.发明授权
公开(公告)号：US11908763B2
公开(公告)日：2024-02-20
申请号：US17483312
申请日：2021-09-23
Applicant: Infineon Technologies AG
Inventor： Prashanth Makaram , John Cooper , Joerg Ortner , Stephan Pindl , Caterina Travan , Alexander Zoepfl
CPC classification number: H01L23/3171 , H01L21/02282 , H01L23/3178
Abstract: An apparatus includes a semiconductor-based substrate with a functional structure that is formed in or on the semiconductor-based substrate. The apparatus includes a frame structure surrounding the functional structure and includes a coating that covers the functional structure and is delimited by the frame structure.
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4.发明申请
公开(公告)号：US20220013424A1
公开(公告)日：2022-01-13
申请号：US17483312
申请日：2021-09-23
Applicant: Infineon Technologies AG
Inventor： Prashanth Makaram , John Cooper , Joerg Ortner , Stephan Pindl , Caterina Travan , Alexander Zoepfl
Abstract: An apparatus includes a semiconductor-based substrate with a functional structure that is formed in or on the semiconductor-based substrate. The apparatus includes a frame structure surrounding the functional structure and includes a coating that covers the functional structure and is delimited by the frame structure.
