公开(公告)号：US20220260397A1

公开(公告)日：2022-08-18

申请号：US17736204

申请日：2022-05-04

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Rainer Markus Schaller

IPC: G01D11/24 ,  G01R33/07

Abstract: A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.

公开(公告)号：US20200043836A1

公开(公告)日：2020-02-06

申请号：US16595546

申请日：2019-10-08

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Franz-Peter Kalz ,  Volker Strutz

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L43/04 ,  H01L23/00 ,  H01L23/492 ,  H01L21/48

Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

公开(公告)号：US10438878B2

公开(公告)日：2019-10-08

申请号：US15949533

申请日：2018-04-10

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Franz-Peter Kalz ,  Volker Strutz

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L43/04 ,  H01L23/00 ,  H01L23/492 ,  H01L21/48

Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

公开(公告)号：US20170256515A1

公开(公告)日：2017-09-07

申请号：US15057481

申请日：2016-03-01

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Rainer Markus Schaller ,  Franz-Peter Kalz

IPC: H01L23/00 ,  H01L27/22

CPC classification number: H01L24/29 ,  G01R33/0052 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/60 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L27/22 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29561 ,  H01L2224/2957 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/30101 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 Ω·cm and 1010 Ω·cm.

公开(公告)号：US09658296B2

公开(公告)日：2017-05-23

申请号：US13939113

申请日：2013-07-10

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner ,  Volker Strutz ,  Jochen Dangelmaier ,  Rainer Steiner

IPC: G01R33/00 ,  B29C70/74 ,  G01R15/20 ,  H01L23/00

CPC classification number: G01R33/0047 ,  B29C70/745 ,  G01R15/20 ,  H01L24/48 ,  H01L2224/4809 ,  H01L2224/48451 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A current sensor device includes a casing having a cavity and a conductor fixedly mounted to the casing. A semiconductor chip configured to sense a magnetic field is arranged in the cavity. An electrically insulating medium is configured to at least partially fill the cavity of the casing.

公开(公告)号：US20160284990A1

公开(公告)日：2016-09-29

申请号：US15181733

申请日：2016-06-14

Applicant: Infineon Technologies AG

Inventor： Carsten von Koblinski ,  Volker Strutz ,  Manfred Engelhardt

IPC: H01L43/14 ,  H01L27/22 ,  H01L21/78 ,  H01L27/12 ,  H01L43/04 ,  H01L43/06

CPC classification number: H01L43/14 ,  H01L21/78 ,  H01L21/84 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/3178 ,  H01L23/3185 ,  H01L24/06 ,  H01L27/12 ,  H01L27/22 ,  H01L43/04 ,  H01L43/065 ,  H01L43/12 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In one embodiment, a method of forming a current sensor device includes forming a device region comprising a magnetic sensor within and/or over a semiconductor substrate. The device region is formed adjacent a front side of the semiconductor substrate. The back side of the semiconductor substrate is attached over an insulating substrate, where the back side is opposite the front side. Sidewalls of the semiconductor substrate are exposed by dicing the semiconductor substrate from the front side without completely dicing the insulating substrate. An isolation liner is formed over all of the exposed sidewalls of the semiconductor substrate. The isolation liner and the insulating substrate include a different material. The method further includes separating the insulating substrate to form diced chips, removing at least a portion of the isolation liner from over a top surface of the device region, and forming contacts over the top surface of the device region.

Abstract translation: 在一个实施例中，形成电流传感器装置的方法包括在半导体衬底之内和/或之上形成包括磁传感器的器件区域。 器件区域邻近半导体衬底的前侧形成。 半导体衬底的背面安装在绝缘衬底上，其中背面与正面相反。 半导体衬底的侧壁通过从前侧切割半导体衬底而没有完全切割绝缘衬底来暴露。 隔离衬垫形成在半导体衬底的所有暴露的侧壁上。 隔离衬垫和绝缘衬底包括不同的材料。 该方法还包括分离绝缘基板以形成切割的芯片，从隔离元件区域的顶表面上去除隔离衬垫的至少一部分，以及在器件区域的顶表面上形成触点。

公开(公告)号：US11211551B2

公开(公告)日：2021-12-28

申请号：US16441304

申请日：2019-06-14

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Volker Strutz

IPC: H01L21/76 ,  H01L43/04 ,  H01L23/31 ,  H01L23/00 ,  H01L43/12 ,  H01L43/02 ,  H01L43/14 ,  H01L43/06 ,  G01R15/20 ,  G01R19/00 ,  H01L23/495

Abstract: A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.

公开(公告)号：US11094619B2

公开(公告)日：2021-08-17

申请号：US16595546

申请日：2019-10-08

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Franz-Peter Kalz ,  Volker Strutz

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L43/04 ,  H01L23/00 ,  H01L23/492 ,  H01L21/48

Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

公开(公告)号：US20170288130A1

公开(公告)日：2017-10-05

申请号：US15089984

申请日：2016-04-04

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Klaus Elian ,  Cyrus Ghahremani ,  Rainer Markus Schaller

IPC: H01L43/02 ,  G01R33/07 ,  H01L43/12 ,  H01L43/08 ,  H01L43/06

CPC classification number: H01L43/02 ,  G01R33/0047 ,  G01R33/07 ,  H01L43/065 ,  H01L43/08 ,  H01L43/12 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.

公开(公告)号：US09741677B1

公开(公告)日：2017-08-22

申请号：US15057481

申请日：2016-03-01

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Rainer Markus Schaller ,  Franz-Peter Kalz

IPC: H01L29/82 ,  H01L23/00 ,  H01L27/22

CPC classification number: H01L24/29 ,  G01R33/0052 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/60 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L27/22 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29561 ,  H01L2224/2957 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/30101 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 Ω·cm and 1010 Ω·cm.