公开(公告)号：US20170338820A1

公开(公告)日：2017-11-23

申请号：US15670740

申请日：2017-08-07

申请人： Intel Corporation

发明人： Fern Nee Tan ,  Sanjiv Soman ,  Alexander Levin ,  Srinivasan Rajagopalan

IPC分类号： H03K19/003 ,  H01L23/64 ,  H01L23/00

CPC分类号： H03K19/00346 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L2223/6688 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  Y10T307/406 ,  H01L2924/014

摘要： An integrated circuit (IC) can include multiple power domains that are served by a common power source. In an example, a first IC power rail can be coupled to the source and a first consumer circuit. A second IC power rail can be coupled to a second consumer circuit. The second IC power rail can receive a filtered power signal from an isolation module that is coupled between the first and second power rails. In an example, an isolation module includes an integrated inductor and a capacitor (e.g., a land-side capacitor). The integrated inductor can optionally include multiple spaced apart conductive layers that are electrically coupled. The integrated inductor can optionally include a series of conductive traces and plated through holes or vias that together provide a current path with multiple turns.

公开(公告)号：US09729151B2

公开(公告)日：2017-08-08

申请号：US14046592

申请日：2013-10-04

申请人： Intel Corporation

发明人： Fern Nee Tan ,  Sanjiv Soman ,  Alexander Levin ,  Srinivasan Rajagopalan

IPC分类号： H03K3/012 ,  H03K19/003 ,  H01L23/64 ,  H01L23/00

CPC分类号： H03K19/00346 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L2223/6688 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  Y10T307/406 ,  H01L2924/014

摘要： An integrated circuit (IC) can include multiple power domains that are served by a common power source. In an example, a first IC power rail can be coupled to the source and a first consumer circuit. A second IC power rail can be coupled to a second consumer circuit. The second IC power rail can receive a filtered power signal from an isolation module that is coupled between the first and second power rails. In an example, an isolation module includes an integrated inductor and a capacitor (e.g., a land-side capacitor). The integrated inductor can optionally include multiple spaced apart conductive layers that are electrically coupled. The integrated inductor can optionally include a series of conductive traces and plated through holes or vias that together provide a current path with multiple turns.

公开(公告)号：US10560094B2

公开(公告)日：2020-02-11

申请号：US15670740

申请日：2017-08-07

申请人： Intel Corporation

发明人： Fern Nee Tan ,  Sanjiv Soman ,  Alexander Levin ,  Srinivasan Rajagopalan

IPC分类号： H03K3/012 ,  H03K19/003 ,  H01L23/64 ,  H01L23/00

摘要： An integrated circuit (IC) can include multiple power domains that are served by a common power source. In an example, a first IC power rail can be coupled to the source and a first consumer circuit. A second IC power rail can be coupled to a second consumer circuit. The second IC power rail can receive a filtered power signal from an isolation module that is coupled between the first and second power rails. In an example, an isolation module includes an integrated inductor and a capacitor (e.g., a land-side capacitor). The integrated inductor can optionally include multiple spaced apart conductive layers that are electrically coupled. The integrated inductor can optionally include a series of conductive traces and plated through holes or vias that together provide a current path with multiple turns.