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公开(公告)号：US20220209829A1
公开(公告)日：2022-06-30
申请号：US17470332
申请日：2021-09-09
Applicant: Intel Corporation
Inventor： Ashoke Ravi , Ofir Degani , Ronen Kronfeld , Harry Skinner , Seong-Youp Suh , Tae-Young Yang
IPC: H04B7/0413 , H01Q15/04 , H01Q3/46 , H04B7/06
Abstract: A communication device may include a millimeter wave (mm-wave) antenna array having antenna elements, a mm-wave element (e.g. lens), and one or more transceivers (e.g. first and second transceivers). The mm-wave lens may be configured to adjust the first beam and the second beam as the first and second beams pass through the mm-wave lens. The first transceiver can selectively couple to the antenna elements, the first transceiver being configured to drive a first selected antenna element of the antenna elements to transmit a beam from the selected first antenna element. The second transceiver may selectively couple to the antenna elements, the second transceiver being configured to drive a second selected antenna element of the antenna elements to transmit a second beam from the selected second antenna element.
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公开(公告)号：US10950536B2
公开(公告)日：2021-03-16
申请号：US16017710
申请日：2018-06-25
Applicant: Intel Corporation
Inventor： Zhen Zhou , Jun Liao , Xiang Li , Kevin Stone , Daqiao Du , Tae-Young Yang , Ling Zheng , James A. McCall
IPC: H01L23/498 , H01R12/71 , H01R43/20 , H01R43/16 , H01R12/57 , H01R12/52 , H01R13/6467 , H01R12/70
Abstract: An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.
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公开(公告)号：US20180006360A1
公开(公告)日：2018-01-04
申请号：US15198782
申请日：2016-06-30
Applicant: Intel Corporation
Inventor： Jose Rodrigo Camacho Perez , Seong-Youp J. Suh , Tae-Young Yang
CPC classification number: H01Q1/243 , H01Q1/2275 , H01Q1/48 , H01Q1/50 , H01Q5/40 , H01Q13/02 , H01Q21/28
Abstract: An antenna including a substrate; top and bottom grounded conductive layers formed on respective larger faces of the substrate; an antenna feed coupled to at least one of the top and bottom grounded conductive layers, and configured to feed radio signals to the antenna; and at least one conductive wall formed to the top and bottom grounded conductive layers, and configured to form a short-circuit between the top and bottom grounded conductive layers, wherein the substrate and the at least one conductive wall forms a plurality of antenna cavities configured to operate at specific, respective frequencies, and each of the plurality of antenna cavities comprises at least two sides not covered by a conductive layer.
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公开(公告)号：US11764835B2
公开(公告)日：2023-09-19
申请号：US17470332
申请日：2021-09-09
Applicant: Intel Corporation
Inventor： Ashoke Ravi , Ofir Degani , Ronen Kronfeld , Harry Skinner , Seong-Youp Suh , Tae-Young Yang
IPC: H04B7/0413 , H01Q3/46 , H01Q15/04 , H04B7/06
CPC classification number: H04B7/0413 , H01Q3/46 , H01Q15/04 , H04B7/0639 , H04B7/0695
Abstract: A communication device may include a millimeter wave (mm-wave) antenna array having antenna elements, a mm-wave element (e.g. lens), and one or more transceivers (e.g. first and second transceivers). The mm-wave lens may be configured to adjust the first beam and the second beam as the first and second beams pass through the mm-wave lens. The first transceiver can selectively couple to the antenna elements, the first transceiver being configured to drive a first selected antenna element of the antenna elements to transmit a beam from the selected first antenna element. The second transceiver may selectively couple to the antenna elements, the second transceiver being configured to drive a second selected antenna element of the antenna elements to transmit a second beam from the selected second antenna element.
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公开(公告)号：US10511082B2
公开(公告)日：2019-12-17
申请号：US15198782
申请日：2016-06-30
Applicant: Intel Corporation
Inventor： Jose Rodrigo Camacho Perez , Seong-Youp J. Suh , Tae-Young Yang
Abstract: An antenna including a substrate; top and bottom grounded conductive layers formed on respective larger faces of the substrate; an antenna feed coupled to at least one of the top and bottom grounded conductive layers, and configured to feed radio signals to the antenna; and at least one conductive wall formed to the top and bottom grounded conductive layers, and configured to form a short-circuit between the top and bottom grounded conductive layers, wherein the substrate and the at least one conductive wall forms a plurality of antenna cavities configured to operate at specific, respective frequencies, and each of the plurality of antenna cavities comprises at least two sides not covered by a conductive layer.
