公开(公告)号：US20190223324A1

公开(公告)日：2019-07-18

申请号：US16368341

申请日：2019-03-28

申请人： Intel Corporation

发明人： Minh Le ,  Thomas Boyd ,  Bijoyraj Sahu ,  Evan Chenelly ,  Christopher Wade Ackerman ,  Carlos Alvizo Flores ,  Craig Jahne

IPC分类号： H05K7/20

CPC分类号： H05K7/20281 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20409 ,  H05K7/20509 ,  H05K7/20781 ,  H05K7/20836

摘要： Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

公开(公告)号：US11291115B2

公开(公告)日：2022-03-29

申请号：US15942263

申请日：2018-03-30

申请人： Intel Corporation

发明人： Shelby A. Ferguson ,  Bijoyraj Sahu ,  Russell Aoki ,  Thomas Boyd ,  Eric W. Buddrius ,  Kevin Ceurter ,  Mustafa Haswarey ,  Rolf Laido ,  Daniel Neumann ,  Rachel Taylor ,  Anthony Valpiani

IPC分类号： H05K1/18 ,  H01L23/40 ,  H01L21/48 ,  H01R12/88 ,  H01R12/70 ,  H05K7/20 ,  H05K1/02

摘要： A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

公开(公告)号：US11296009B2

公开(公告)日：2022-04-05

申请号：US15942275

申请日：2018-03-30

申请人： Intel Corporation

发明人： Rolf Laido ,  Divya Swamy Bandaru ,  Thomas Boyd ,  Jorge Contreras Perez ,  Shelby A. Ferguson ,  Mustafa Haswarey

IPC分类号： H01L23/40 ,  H05K1/02 ,  H01R13/629 ,  H05K7/20

摘要： A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

公开(公告)号：US11032941B2

公开(公告)日：2021-06-08

申请号：US16368341

申请日：2019-03-28

申请人： Intel Corporation

发明人： Minh Le ,  Thomas Boyd ,  Bijoyraj Sahu ,  Evan Chenelly ,  Christopher Wade Ackerman ,  Carlos Alvizo Flores ,  Craig Jahne

IPC分类号： H05K7/20

摘要： Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

公开(公告)号：US20190304870A1

公开(公告)日：2019-10-03

申请号：US15942270

申请日：2018-03-30

申请人： Intel Corporation

发明人： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC分类号： H01L23/40 ,  H05K7/14 ,  H01L23/367

摘要： A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US11557529B2

公开(公告)日：2023-01-17

申请号：US15942270

申请日：2018-03-30

申请人： Intel Corporation

发明人： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC分类号： H05K7/14 ,  H01L23/40 ,  H01L23/367

摘要： A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US20190304871A1

公开(公告)日：2019-10-03

申请号：US15942275

申请日：2018-03-30

申请人： Intel Corporation

发明人： Rolf Laido ,  Divya Swamy Bandaru ,  Thomas Boyd ,  Jorge Contreras Perez ,  Shelby A. Ferguson ,  Mustafa Haswarey

IPC分类号： H01L23/40 ,  H05K1/02

摘要： A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.