-
公开(公告)号：US11699664B2
公开(公告)日：2023-07-11
申请号：US17089756
申请日：2020-11-05
Applicant: Intel Corporation
Inventor： Eng Huat Goh , Tin Poay Chuah , Yew San Lim , Min Suet Lim
IPC: H01L23/552 , H05K3/28 , H05K1/02
CPC classification number: H01L23/552 , H05K1/0209 , H05K3/284
Abstract: According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.
-
公开(公告)号：US10939540B2
公开(公告)日：2021-03-02
申请号：US16399825
申请日：2019-04-30
Applicant: Intel Corporation
Inventor： Tin Poay Chuah , Yew San Lim , Boon Ping Koh , Phaik Kiau Tan
Abstract: A folded circuit board includes a first circuit board and a second circuit board. The first circuit board and second circuit board are coupled together through a flexible interconnect. One or more folding guides are coupled to one of the first circuit board or second circuit board. The one or more folding guides extend beyond a first edge of the one of the first circuit board or second circuit board. The one or more folding guides include a curved sidewall configured to guide the flexible interconnect when the first circuit board is folded over the second circuit board. In one embodiment, the one or more folding guides are grounded to reduce EMI emissions.
-
公开(公告)号：US11445608B2
公开(公告)日：2022-09-13
申请号：US16903845
申请日：2020-06-17
Applicant: Intel Corporation
Inventor： Chee How Lim , Eng Huat Goh , Jon Sern Lim , Khai Ern See , Min Suet Lim , Tin Poay Chuah , Yew San Lim
Abstract: An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.
-
公开(公告)号：US20210410341A1
公开(公告)日：2021-12-30
申请号：US17471396
申请日：2021-09-10
Applicant: Intel Corporation
Inventor： Boon Ping Koh , Twan Sing Loo , Yew San Lim , Tin Poay Chuah
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a radiation shield groove that extends past a surface of the support structure and into the support structure, a radiation source on the substrate, and a radiation shield around the radiation source, where the radiation shield includes a wall secured to the support structure and a groove channel coupling wall that extends past a surface of the support structure and into the radiation shield groove.
-
公开(公告)号：US20210100101A1
公开(公告)日：2021-04-01
申请号：US16903845
申请日：2020-06-17
Applicant: Intel Corporation
Inventor： Chee How Lim , Eng Huat Goh , Jon Sern Lim , Khai Ern See , Min Suet Lim , Tin Poay Chuah , Yew San Lim
Abstract: An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.
-
公开(公告)号：US20240310881A1
公开(公告)日：2024-09-19
申请号：US18185505
申请日：2023-03-17
Applicant: Intel Corporation
Inventor： Jeffrey Ho , Shawn Mceuen , Min Suet Lim , Yew San Lim , Bruce Cheng
CPC classification number: G06F1/1681 , F16C11/04 , E05D3/02 , E05D5/14 , E05Y2999/00
Abstract: Hinges for electronic devices are disclosed herein. An example hinge includes a bracket capable of being coupled to a first portion of the electrical device. The bracket has a barrel defining a first opening. The hinge also includes a shaft in the first opening. The shaft is rotatable in the first opening. The hinge further includes a sleeve capable of being inserted into a bore in a second portion of the electronic device. The sleeve defines a second opening to receive a portion of the shaft.
-
公开(公告)号：US12061502B2
公开(公告)日：2024-08-13
申请号：US17368851
申请日：2021-07-07
Applicant: Intel Corporation
Inventor： Jeff Ku , Tin Poay Chuah , Howe Yin Loo , Chin Kung Goh , Yew San Lim , Cora Shih Wei Nien
CPC classification number: G06F1/203 , G06F1/1616
Abstract: According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.
-
公开(公告)号：US20230395480A1
公开(公告)日：2023-12-07
申请号：US17834674
申请日：2022-06-07
Applicant: Intel Corporation
Inventor： Tin Poay Chuah , Jeff Ku , Min Suet Lim , Yew San Lim , Twan Sing Loo
IPC: H01L23/498 , H05K3/34 , H01L21/48 , H05K1/11
CPC classification number: H01L23/49816 , H01L23/49827 , H01L23/49838 , H05K3/3436 , H05K2201/10378 , H05K1/115 , H05K2201/10734 , H05K2201/0154 , H05K2201/10303 , H01L21/4853
Abstract: A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.
-
公开(公告)号：US11481001B2
公开(公告)日：2022-10-25
申请号：US17088620
申请日：2020-11-04
Applicant: Intel Corporation
Inventor： Chee Chun Yee , Tin Poay Chuah , Yew San Lim , Min Suet Lim , Jeff Ku
IPC: G06F1/16
Abstract: According to the various examples, a dual display system having a first panel having a first display area, a second panel having a second display area, and a connector assembly, attached to the first and second panels, that is configured to enable the first and second panels to rotate around three-directional axes. The connector assembly includes an elongated member and a hinge assembly, which are configured for attachment to the first and second display panels. The present dual display system may have several functional modalities, including use as a desktop computer, a laptop computer, a tablet, and a panoramic display.
-
公开(公告)号：US10856454B2
公开(公告)日：2020-12-01
申请号：US16535766
申请日：2019-08-08
Applicant: Intel Corporation
Inventor： Min Suet Lim , Yew San Lim , Jia Yan Go , Tin Poay Chuah , Eng Huat Goh
Abstract: Apparatus and method for providing an electromagnetic interference (EMI) shield for removable engagement with a printed circuit board (PCB). A shaped electrically conductive member has a substantially planar member portion with multiple lateral member edges. The sidewalls are disposed at respective lateral member edges and are substantially orthogonal to the substantially planar member portion. At least one of the sidewalls includes at least one first snap-fit latching feature to engage a respective complementary second snap-fit latching feature disposed at one or more of multiple peripheral portions of a PCB.
